公开(公告)号：US06445580B1

公开(公告)日：2002-09-03

申请号：US09591011

申请日：2000-06-09

申请人： Mark E. Cohen ,  Joseph Anthony Ho-lung ,  Vinod Kamath ,  Leo Harold Webster, Jr. ,  Tin-Lup Wong

发明人： Mark E. Cohen ,  Joseph Anthony Ho-lung ,  Vinod Kamath ,  Leo Harold Webster, Jr. ,  Tin-Lup Wong

IPC分类号： G06F120

CPC分类号： H01L23/38 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling apparatus, method and article of manufacture are disclosed which provide for selectively providing power to an attached heat-dissipating apparatus having a cooling probe in thermal contact with a cooling unit, to remove heat generated by a heat-generating source within the computer to an external environment outside of the computer. Power may be conserved, portable battery life extended, higher-speed processors utilized, and overall dimensional characteristics of a personal computer may be slimmed and reduced by utilizing the apparatus with a personal computer. Heat energy is transferred across a thermal connection interface from the heat-generating source of the personal computer to a collection face of the apparatus, and thereafter collected heat energy is dissipated in relation to the available power of the power source and/or the planned operating speed of the processor.

公开(公告)号：US06172871B2

公开(公告)日：2001-01-09

申请号：US09282299

申请日：1999-03-31

申请人： Joseph Anthony Holung ,  Vinod Kamath ,  Mohanlal Savji Mansuria ,  Tin-Lup Wong

发明人： Joseph Anthony Holung ,  Vinod Kamath ,  Mohanlal Savji Mansuria ,  Tin-Lup Wong

IPC分类号： H05K720

CPC分类号： G06F1/203 ,  G06F1/1632

摘要： A portable data processing system and method are disclosed for improving cooling of a microprocessor included within the system. The portable data processing system includes a base housing for housing a CPU and a display housing for housing a display. A heat sink is established within the base housing. The heat sink is formed from a highly conductive composite material. A heat dissipater is established within the display housing. The heat dissipater is comprised of a highly conductive composite material. The heat dissipater and heat sink are capable of receiving a heat pipe. Heat is transferred from the heat sink to the heat dissipator utilizing the heat pipe. In a second embodiment, the portable system is docked with a docking station, and a heat probe is included which is utilized to dissipate additional heat from the microprocessor to a large fan sink included within the docking station.

摘要翻译： 公开了一种用于改善系统内包括的微处理器的冷却的便携式数据处理系统和方法。 便携式数据处理系统包括用于容纳CPU的基座外壳和用于容纳显示器的显示器外壳。 在基座外部建立散热器。 散热器由高导电性复合材料形成。 在显示器外壳内建立散热器。 散热器由高导电性复合材料构成。 散热器和散热器能够接收热管。 利用热管将热量从散热片传送到散热器。 在第二实施例中，便携式系统与对接站对接，并且包括热探针，其用于将附加的热量从微处理器散发到包括在对接站内的大型风扇水槽。

公开(公告)号：US5794687A

公开(公告)日：1998-08-18

申请号：US905688

申请日：1997-08-04

申请人： Leo H. Webster, Jr. ,  Lawrence Shungwei Mok ,  Vinod Kamath ,  Mohanlal S. Mansuria

发明人： Leo H. Webster, Jr. ,  Lawrence Shungwei Mok ,  Vinod Kamath ,  Mohanlal S. Mansuria

IPC分类号： H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： An integrated air mover/heatsink for cooling semiconductor chip packages supports disks to rotate within the heat sink parallel to a heat receiving surface so that the heat sink acts as an enclosing housing for the disks. The heat sink preferably defines enclosing aperatures for respective disks which are closely spaced and coextensive heat with transfer surfaces over which air is forced by rotation of the disks. By so arranging the disks and enclosing aperature walls parallel to the heat receiving surface, a forced intimate flow of air over heat sink surfaces is achieved in a low profile configuration. Alternative implementations provide cooling for multiple chips and various arrangements for intake and exhaust of cooling air.

摘要翻译： 用于冷却半导体芯片封装的集成式移动器/散热器支撑盘，以平行于热接收表面在散热器内旋转，使得散热器用作盘的封闭壳体。 散热器优选地限定用于相应盘的封闭温度，其与传送表面紧密隔开并具有共同延伸的热量，空气通过盘旋转而被驱动。 通过如此布置圆盘并且围绕平行于热接收表面的温度壁，在低轮廓构造中实现了在散热器表面上强制的空气流动。 替代实施方案提供用于多个芯片的冷却和用于进入和排出冷却空气的各种布置。

公开(公告)号：US10180665B2

公开(公告)日：2019-01-15

申请号：US13234563

申请日：2011-09-16

申请人： Thomas M. Brey ,  Vinod Kamath ,  Jason A. Matteson

发明人： Thomas M. Brey ,  Vinod Kamath ,  Jason A. Matteson

IPC分类号： G05D23/19 ,  G05B13/02 ,  H05K7/20 ,  G06F1/20

摘要： A fluid-cooled computer system includes a plurality of heat-generating components and a cooling system configured for supplying a cooling fluid at a controlled cooling fluid flow rate to cool the heat-generating components. A temperature-based cooling control circuit includes a temperature sensor configured for sensing a temperature of the heat-generating components and control logic for increasing a cooling fluid flow rate in response to the temperature exceeding a temperature threshold. A power-based cooling control circuit is configured for identifying and quantifying an increasing power consumption trend over a target time interval and, during a period that the temperature of the electronic device does not exceed the temperature threshold, increasing a cooling fluid flow rate to the electronic device in response to the magnitude of the increasing power consumption trend exceeding a power threshold. In one option, the fluid-cooled computer system is a server and the heat-generating components include a processor.

公开(公告)号：US09110642B2

公开(公告)日：2015-08-18

申请号：US13274835

申请日：2011-10-17

申请人： Thomas M. Brey ,  Vinod Kamath ,  Jason A. Matteson ,  Billy W. Medlin

发明人： Thomas M. Brey ,  Vinod Kamath ,  Jason A. Matteson ,  Billy W. Medlin

IPC分类号： G06F1/20 ,  H05K7/20 ,  G06F1/32

CPC分类号： G06F1/206 ,  G06F1/3206 ,  H05K7/20209 ,  H05K7/20718 ,  Y02D10/16

摘要： A computer-implemented method comprises accessing historical operating data for a unit of information technology equipment, wherein the historical operating data includes power consumption, fan speed, inlet air temperature, workload, and any processor throttling events at various points in time. The method further comprises receiving user input selecting a fan speed, and using the historical operating data to determine a performance impact that is expected from operating the unit at the selected fan speed, where the power consumption is a proxy for performance. The estimated performance impact of the selected fan speed and one or more alternative fan speeds is then displayed.

摘要翻译： 计算机实现的方法包括访问信息技术设备单元的历史操作数据，其中历史操作数据包括功率消耗，风扇速度，入口空气温度，工作负载以及在不同时间点的任何处理器调节事件。 该方法还包括接收选择风扇速度的用户输入，以及使用历史操作数据来确定在所选择的风扇速度下操作单元所期望的性能影响，其中功耗是性能的代理。 然后显示所选风扇速度和一个或多个替代风扇速度的估计性能影响。

公开(公告)号：US20120123595A1

公开(公告)日：2012-05-17

申请号：US12945958

申请日：2010-11-15

申请人： Fred A. Bower, III ,  Vinod Kamath ,  Michael S. Miller

发明人： Fred A. Bower, III ,  Vinod Kamath ,  Michael S. Miller

IPC分类号： G05D23/00 ,  G05D7/06 ,  F28D15/00

CPC分类号： G05D23/1934 ,  H05K7/20772 ,  H05K7/20836

摘要： Methods and systems for controlling fluid coolant flow in cooling systems of computing devices are disclosed. According to an aspect, a method may include determining a temperature of a fluid coolant in a cooling system of a computing device. For example, a temperature of water exiting a cooling system of a server may be determined. The method may also include determining an operational condition of the computing device. For example, a temperature of a processor, memory, or input/output (I/O) component may be determined. Further, the method may include controlling a flow of the fluid coolant through the cooling system based on the temperature of the fluid coolant and/or the operational condition.

摘要翻译： 公开了用于控制计算设备的冷却系统中的流体冷却剂流的方法和系统。 根据一个方面，一种方法可以包括确定计算装置的冷却系统中的流体冷却剂的温度。 例如，可以确定离开服务器的冷却系统的水的温度。 该方法还可以包括确定计算设备的操作条件。 例如，可以确定处理器，存储器或输入/输出（I / O）组件的温度。 此外，该方法可以包括基于流体冷却剂的温度和/或操作条件来控制通过冷却系统的流体冷却剂的流动。

公开(公告)号：US07948196B2

公开(公告)日：2011-05-24

申请号：US12099841

申请日：2008-04-09

申请人： Ralph Murray Begun ,  Raymond Mathew Clemo ,  Karl Klaus Dittus ,  Vinod Kamath ,  Michael Sven Miller ,  Warren Everett Price ,  Whitcomb Randolph Scott, III

发明人： Ralph Murray Begun ,  Raymond Mathew Clemo ,  Karl Klaus Dittus ,  Vinod Kamath ,  Michael Sven Miller ,  Warren Everett Price ,  Whitcomb Randolph Scott, III

IPC分类号： G06F1/20 ,  H02P31/00

CPC分类号： G06F1/20 ,  H05K7/20209 ,  Y10S388/934

摘要： A system comprising a chassis that includes a plurality of modules and a fan assembly disposed in a distal end of the chassis for drawing air in parallel pathways through the plurality of modules. At least one of the modules is a compute module having a thermal sensor disposed to sense the temperature of air flowing across a processor mounted on a motherboard. The system further comprises a fan controller receiving output from the thermal sensor, wherein the fan controller operates the fan assembly to cool the plurality of modules and maintain the thermal sensor output within an operating temperature range. The fan controller controls the fan speed according to predetermined thermal profile settings associated with one of the compute modules received in the chassis. For example, the predetermined thermal profile settings may include a minimum fan speed, a maximum fan speed, and control loop feedback settings.

摘要翻译： 一种包括底盘的系统，其包括多个模块和设置在所述底盘的远端中的风扇组件，用于通过所述多个模块的并行路径抽取空气。 至少一个模块是具有热传感器的计算模块，该热传感器设置成感测流过安装在母板上的处理器的空气的温度。 该系统还包括接收来自热传感器的输出的风扇控制器，其中风扇控制器操作风扇组件以冷却多个模块并将热传感器输出保持在工作温度范围内。 风扇控制器根据与在机箱中接收的计算模块之一相关联的预定热分布设置来控制风扇速度。 例如，预定的热分布设置可以包括最小风扇速度，最大风扇速度和控制回路反馈设置。

公开(公告)号：US07639499B1

公开(公告)日：2009-12-29

申请号：US12168259

申请日：2008-07-07

申请人： Levi A. Campbell ,  Richard C. Chu ,  Martin J. Crippen ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Jason A. Matteson ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Martin J. Crippen ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Vinod Kamath ,  Jason A. Matteson ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20772

摘要： Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.

摘要翻译： 提供了设备和方法，以便于液体冷却设置在电子机架内的电子子系统机架的一个或多个部件。 该设备包括机架级冷却剂歧管组件和至少一个可移动底盘级歧管组件。 机架级冷却剂歧管组件包括机架级入口歧管和机架级出口歧管，并且每个可移动底盘级歧管组件包括与机架级入口歧管流体连通地联接的底盘级冷却剂入口歧管， 以及与所述齿条级出口歧管流体连通地联接的底盘级冷却剂出口歧管。 底盘级歧管子组件可滑动地联接到电子机架，以便于接近电子子系统底盘的一个或多个可拆卸部件。 在一个实施例中，电子系统底盘是具有多个可移除刀片的多刀片中心系统，每个刀片是电子子系统。

公开(公告)号：US07529085B2

公开(公告)日：2009-05-05

申请号：US11480292

申请日：2006-06-30

申请人： Albert V. Makley ,  Thomas M. Cipolla ,  Thomas R. Hildner ,  Vinod Kamath ,  Fumitoshi Kiyooka ,  Lawrence S. Mok ,  Fusanobu Nakamura

发明人： Albert V. Makley ,  Thomas M. Cipolla ,  Thomas R. Hildner ,  Vinod Kamath ,  Fumitoshi Kiyooka ,  Lawrence S. Mok ,  Fusanobu Nakamura

IPC分类号： H05K7/20

CPC分类号： G06F1/203

摘要： A fansink arrangement for a laptop computer wherein two distinct patterns of air intake can be employed. Particularly, dual air intakes of the laptop can be managed and controlled depending upon an operating mode of the computer. Thus, when the computer is in a “stand alone” mode, only one air intake is employed while in a “docking” mode of the computer two air intakes are employed.

摘要翻译： 一种用于膝上型计算机的风扇排列装置，其中可以采用两种截然不同的进气模式。 特别地，可以根据计算机的操作模式来管理和控制膝上型计算机的双重进气口。 因此，当计算机处于“独立”模式时，在计算机的“对接”模式中仅采用一个进气口，两个进气口被采用。

公开(公告)号：US07403393B2

公开(公告)日：2008-07-22

申请号：US11319315

申请日：2005-12-28

申请人： Dean Frederick Herring ,  Vinod Kamath ,  Paul Andrew Wormsbecher

发明人： Dean Frederick Herring ,  Vinod Kamath ,  Paul Andrew Wormsbecher

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/4332 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus and system are disclosed for cooling of heat producing components. The apparatus may include a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a heat producing circuit board component, and a heat sink having first and second ends. The heat sink is configured to interface with the mounting plate in order to provide a downward force on the heat producing circuit board component. The apparatus also includes at least one bellows device coupling a heat transfer tip with the first end of the heat sink, wherein the bellows device is configured to transfer the downward force from the mounting plate to a top surface of the heat producing component and maintain the heat transfer tip in compliance with the plane of the top surface of the heat producing component. The system includes a circuit board, a plurality of heat producing circuit board components, and the described apparatus.

摘要翻译： 公开了用于冷却发热部件的装置和系统。 该装置可以包括与电路板的顶表面刚性连接的安装板，位于发热电路板部件上方的安装板和具有第一端和第二端的散热器。 散热器被配置成与安装板接合，以便在发热电路板部件上提供向下的力。 该装置还包括至少一个波纹管装置，其耦合传热尖端与散热器的第一端，其中波纹管装置构造成将向下的力从安装板传递到发热部件的顶表面，并保持 传热尖端符合发热部件顶表面的平面。 该系统包括电路板，多个发热电路板部件和所述装置。