公开(公告)号：US20190056226A1

公开(公告)日：2019-02-21

申请号：US15767271

申请日：2016-11-09

Applicant: Robert Bosch GmbH

Inventor： Reinhard Neul ,  Torsten Ohms ,  Robert Maul ,  Mirko Hattass ,  Christian Hoeppner ,  Odd-Axel Pruetz ,  Benjamin Schmidt ,  Rolf Scheben ,  Friedjof Heuck

IPC: G01C19/5747

Abstract: A micromechanical rate-of-rotation sensor includes a first Coriolis element. The micromechanical rate-of-rotation sensor further includes a first drive beam arranged along the first Coriolis element. The first drive beam is coupled via a first spring to the first Coriolis element. The micromechanical rate-of-rotation sensor further includes a first drive electrode carrier extending from the first drive beam in a direction opposite to the first Coriolis element. The first drive electrode carrier is configured to carry a multiplicity of first drive electrodes extending parallel to the first drive beam.

公开(公告)号：US20180321039A1

公开(公告)日：2018-11-08

申请号：US15775321

申请日：2016-11-10

Applicant: Robert Bosch GmbH

Inventor： Reinhard Neul ,  Torsten Ohms ,  Robert Maul ,  Mirko Hattass ,  Christian Hoeppner ,  Odd-Axel Pruetz ,  Benjamin Schmidt ,  Rolf Scheben ,  Friedjof Heuck

IPC: G01C19/5747 ,  G01C19/5712

Abstract: A micromechanical yaw rate sensor includes a substrate and a rotationally oscillating mass having a rotationally oscillating mass bearing. The rotationally oscillating mass bearing includes a rocker bar, a rocker spring rod which resiliently connects the rocker bar to the substrate, and two support spring rods which resiliently connect, on opposite sides of the rocker spring rod, the rocker bar to the rotationally oscillating mass.

公开(公告)号：US09823073B2

公开(公告)日：2017-11-21

申请号：US14787702

申请日：2014-05-14

Applicant: Robert Bosch GmbH

Inventor： Thorsten Balslink ,  Rolf Scheben ,  Benjamin Schmidt ,  Ralf Ameling ,  Mirko Hattass ,  Burkhard Kuhlmann ,  Robert Maul

IPC: G01C19/5747 ,  G01C19/56 ,  G01C19/5705 ,  G01C19/574 ,  G01C19/5719

CPC classification number: G01C19/5705 ,  G01C19/5719 ,  G01C19/574 ,  G01C19/5747

Abstract: A rotation-rate sensor having a substrate with main extension plane, for detecting a rotation rate, extending in a direction parallel/orthogonal to the main plane; the sensor including a primary/secondary pair of seismic masses; the primary pair having first/second primary masses; the secondary pair having first/second secondary masses; the first/second primary masses being movable relative to the substrate along a primary deflection direction extending parallel to the main plane; the first/second secondary masses being movable relative to the substrate along a secondary deflection direction extending parallel to the main plane; the first/second primary masses and the first/second primary masses being movable antiparallel or parallel to one another corresponding to the deflection direction, essentially extending orthogonally to the secondary deflection direction; and the primary pair and/or secondary pair being drivable so that, based on sensor rotation, the Coriolis force leads to deflection of the first/second primary masses and/or the first/second secondary masses.

公开(公告)号：US20160112803A1

公开(公告)日：2016-04-21

申请号：US14884959

申请日：2015-10-16

Applicant: Robert Bosch GmbH

Inventor： Rolf Scheben

IPC: H04R7/10 ,  H04R19/00 ,  H04R19/04 ,  H04R1/04

CPC classification number: H04R7/10 ,  H04R19/005 ,  H04R19/04

Abstract: A concept is provided which permits the implementation of MEMS microphone elements having a very good SNR, high microphone sensitivity and a large frequency bandwidth. The microphone structure of the MEMS element is implemented in a layer structure and includes at least one sound pressure-sensitive diaphragm (210), an acoustically permeable counter element (220) and a capacitor system for detecting the diaphragm deflections, the diaphragm (210) and the counter element (220) being situated on top of each other and a distance apart from one another in the layer structure and each bring equipped with at least one electrode of the capacitor system. According to the invention, the layer structure of the diaphragm (210) includes at least one thin closed layer (1) and at least one thick structured layer (2), a grid structure (100) covering the entire diaphragm area being provided in the thick layer (2), which determines the stiffness of the diaphragm (210).

Abstract translation: 提供了一种概念，其允许实现具有非常好的SNR，高麦克风灵敏度和大的频率带宽的MEMS麦克风元件。 MEMS元件的麦克风结构以层结构实现，并且包括至少一个声压敏膜（210），用于检测隔膜偏转的声导透计数元件（220）和电容器系统，隔膜（210） 并且所述计数元件（220）位于彼此的顶部并且在所述层结构中彼此间隔开，并且每个配备有所述电容器系统的至少一个电极。 根据本发明，隔膜（210）的层结构包括至少一个薄的封闭层（1）和至少一个厚的结构化层（2），覆盖整个隔膜区域的网格结构（100）设置在 厚层（2），其确定隔膜（210）的刚度。

公开(公告)号：US20160084653A1

公开(公告)日：2016-03-24

申请号：US14890559

申请日：2014-05-05

Applicant: ROBERT BOSCH GMBH

Inventor： Thorsten Balslink ,  Rolf Scheben ,  Benjamin Schmidt ,  Ralf Ameling ,  Mirko Hattass ,  Burkhard Kuhlmann ,  Robert Maul

IPC: G01C19/5712

CPC classification number: G01C19/5712

Abstract: A rotation rate sensor for detecting a rotational movement of the rotation rate sensor about a rotational axis extending within a drive plane of the rotation rate sensor include: a first rotational element, a second rotational element and a drive structure moveable in parallel to the drive plane, the first rotational element being drivable about a first center of rotation to achieve a first rotational vibration in parallel to the drive plane, the second rotational element being drivable about a second center of rotation to achieve a second rotational vibration in parallel to the drive plane, the drive structure being (i) coupled to the first and second rotational elements, and (ii) configured to generate a drive mode in phase opposition of the first and second rotational vibrations.

Abstract translation: 用于检测旋转速率传感器围绕在旋转速率传感器的驱动平面内延伸的旋转轴线的旋转运动的旋转速率传感器包括：第一旋转元件，第二旋转元件和可平行于驱动平面移动的驱动结构 第一旋转元件围绕第一旋转中心驱动以实现平行于驱动平面的第一旋转振动，第二旋转元件围绕第二旋转中心驱动以实现与驱动平面平行的第二旋转振动 驱动结构是（i）联接到第一和第二旋转元件，和（ii）被配置成产生与第一和第二旋转振动相反的驱动模式。

公开(公告)号：US20150365751A1

公开(公告)日：2015-12-17

申请号：US14732368

申请日：2015-06-05

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Rolf Scheben ,  Ricardo Ehrenpfordt

IPC: H04R1/08

CPC classification number: H04R19/005 ,  H04R19/04 ,  H04R31/00

Abstract: A micromechanical sensor system combination, and a corresponding manufacturing method, includes an interposer chip including a first front side and a first back side which includes first electrical contacts on the first front side and second electrical contacts on the first back side, the interposer chip having first electrical vias which electrically connect the first electrical contacts to the second electrical contacts; as well as a micromechanical sensor chip system including a second front side a second back side including at least one first sensor device and a second sensor device which are laterally adjacent, the first front side being attached on the second front side so that the first sensor device and the second sensor device are electrically and mechanically connected to the first electrical contacts.

Abstract translation: 微机械传感器系统组合和相应的制造方法包括插入器芯片，其包括第一前侧和第一后侧，该第一前侧和第一后侧包括第一前侧上的第一电触点和第一背面侧的第二电触点，所述插入器芯片具有 第一电气通孔，其将第一电触头电连接到第二电触点; 以及包括第二前侧的微机械传感器芯片系统，第二后侧包括至少一个横向相邻的第一传感器装置和第二传感器装置，第一前侧附接在第二前侧，使得第一传感器 装置和第二传感器装置电连接和机械地连接到第一电触点。