公开(公告)号：US06780668B1

公开(公告)日：2004-08-24

申请号：US10031000

申请日：2002-01-16

申请人： Norihito Tsukahara ,  Takashi Akiguchi ,  Hidenori Miyakawa

发明人： Norihito Tsukahara ,  Takashi Akiguchi ,  Hidenori Miyakawa

IPC分类号： H01L2150

CPC分类号： H01L24/82 ,  G06K19/07745 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49855 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： A bump is formed on each element electrode of a semiconductor device, and a thermoplastic resin sheet is aligned in position with the semiconductor device. The sheet and the semiconductor device are subjected to hot pressing to melt the sheet, forming a thermoplastic resin portion that covers a portion other than the end surface of each bump of the semiconductor device. The thermoplastic resin portion obtained after the hot pressing is out.

摘要翻译： 在半导体器件的每个元件电极上形成凸起，并且热塑性树脂片与半导体器件对准。 对片材和半导体器件进行热压以熔化片材，形成覆盖半导体器件的每个凸起的端面之外的部分的热塑性树脂部分。 热压后获得的热塑性树脂部分出来。