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    Coil component and board having the same
    43.
    发明授权
    Coil component and board having the same 有权
    线圈组件和板具有相同的

    公开(公告)号：US09263180B2

    公开(公告)日：2016-02-16

    申请号：US14256558

    申请日：2014-04-18

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chan Yoon ,  Dong Hwan Lee ,  Tae Young Kim

    IPC: H01F5/00 ,  H01F27/28 ,  H01L27/08 ,  H01F27/29 ,  H01F17/00 ,  H05K3/34 ,  H01F27/32 ,  H01F17/04

    CPC classification number: H01F27/292 ,  H01F17/0006 ,  H01F27/324 ,  H01F2017/0066 ,  H01F2017/0073 ,  H01F2017/048 ,  H05K3/3442 ,  H05K2201/1003

    Abstract: A coil component may include: a magnetic body; and first and eighth external electrodes formed on one surface of the magnetic body, second and third external electrodes and sixth and seventh external electrodes that are formed on two surfaces adjacent to the one surface of the magnetic body, respectively, and fourth and fifth external electrodes formed on the other surface opposing the one surface of the magnetic body. The magnetic body includes upper and lower substrates and first to fourth coil parts disposed between the upper and lower substrates and enclosed by an insulation film, the first to fourth coil parts having coupled coils wound in parallel on the same plane, respectively, so that magnetic fluxes in the coupled coils are formed in directions opposite to each other, the coupled coils being composed of first to eighth coils.

    Abstract translation: 线圈部件可以包括：磁体; 以及形成在磁体的一个表面上的第一和第八外部电极，分别形成在与磁体的一个表面相邻的两个表面上的第二和第三外部电极以及第六和第七外部电极，以及第四和第五外部电极 形成在与磁体的一个表面相对的另一表面上。 磁体包括上下基板和设置在上基板和下基板之间并由绝缘膜包围的第一至第四线圈部分，第一至第四线圈部分具有分别在同一平面上并联缠绕的线圈，使得磁 耦合线圈中的磁通在彼此相反的方向上形成，耦合的线圈由第一至第八线圈组成。

    Coil component
    47.
    发明授权
    Coil component 有权

    公开(公告)号：US11664148B2

    公开(公告)日：2023-05-30

    申请号：US16539658

    申请日：2019-08-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chan Yoon ,  Young Ghyu Ahn ,  Dong Hwan Lee ,  Dong Jin Lee

    IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F27/255

    CPC classification number: H01F27/2804 ,  H01F27/255 ,  H01F27/29 ,  H01F27/32 ,  H01F2027/2809

    Abstract: A coil component includes a body; a first coil portion disposed inside of the body and having a first core portion; a first external electrode and a second external electrode disposed outside of the body and connected to both ends of the first coil portion, respectively; a second coil portion disposed on the first coil portion in the body and having a second core portion; and a third external electrode and a fourth external electrode disposed outside of the body and connected to both ends of the second coil portion, respectively, wherein the first core portion comprises a first shared core portion overlapping the second core portion and a first non-shared core portion not overlapping the second core portion, and the second core portion comprises a second shared core portion overlapping the first core portion and a second non-shared core portion not overlapping the first core portion.

    Electronic component
    48.
    发明授权
    Electronic component 有权

    公开(公告)号：US11651897B2

    公开(公告)日：2023-05-16

    申请号：US17173526

    申请日：2021-02-11

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chan Yoon ,  Sang Soo Park ,  Hwi Dae Kim ,  Woo Chul Shin ,  Ji Hong Jo

    IPC: H01G4/232 ,  H01G4/30

    CPC classification number: H01G4/232 ,  H01G4/30

    Abstract: An electronic component includes a capacitor body having alternately stacked first and second internal electrodes with dielectric layers therebetween, the capacitor body having first to sixth surfaces and the first internal electrodes and the second internal electrodes being exposed through the third surface and the fourth surface, respectively. First and second external electrodes are disposed respectively on the third and fourth surfaces of the body and respectively connected to the first and second internal electrodes. A shielding layer includes a cap portion disposed on the second surface of the capacitor body and a side wall portion disposed on the third, fourth, fifth, and sixth surfaces of the capacitor body, and an insulating layer is disposed between the capacitor body and the shielding layer. The shielding layer consists of first and second shielding layers offset from each other in a direction connecting the third and fourth surfaces.

    Multilayer ceramic capacitor
    49.
    发明授权
    Multilayer ceramic capacitor 有权

    公开(公告)号：US11527358B2

    公开(公告)日：2022-12-13

    申请号：US17349304

    申请日：2021-06-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hwi Dae Kim ,  Ji Hong Jo ,  Woo Chul Shin ,  Sang Soo Park ,  Chan Yoon

    IPC: H01G4/01 ,  H01G4/12

    Abstract: A multilayer ceramic electronic component includes a ceramic body comprising dielectric layers and first and second internal electrodes laminatedly disposed in a third direction with respective dielectric layers interposed therebetween, and first electrode and second external electrodes disposed on both surfaces of the ceramic body in the first direction and electrically connected to the first and second internal electrodes. When an absolute value of a horizontal angle in the second direction of the first internal electrode with respect to the first surface of the ceramic body is referred to a first angle of the internal electrode, a total sum of the first angles is less than 10°.

    Coil electronic component
    50.
    发明授权
    Coil electronic component 有权

    公开(公告)号：US11264161B2

    公开(公告)日：2022-03-01

    申请号：US16281687

    申请日：2019-02-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chan Yoon ,  Dong Hwan Lee ,  Dong Jin Lee ,  Young Ghyu Ahn

    IPC: H01F27/29 ,  H01F27/28 ,  H01F27/24

    Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least one surface of the support substrate, a lead-out pattern disposed on at least one surface of the support substrate to be connected to the coil pattern, an encapsulant disposed to encapsulate the support substrate, the coil pattern, and at least one portion of the lead-out pattern, and an external electrode disposed on an external surface of the encapsulant to be connected to the lead-out pattern. The lead-out pattern includes a slit disposed on a side of a region facing the external electrode. The slit is exposed in a direction toward the external electrode and in a direction away from the support substrate, on the basis of a thickness direction of the support substrate, and is not connected to the support substrate.

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