CMOS IMAGE SENSOR FOR RGB IMAGING AND DEPTH MEASUREMENT WITH LASER SHEET SCAN

    公开(公告)号:US20200041258A1

    公开(公告)日:2020-02-06

    申请号:US16595461

    申请日:2019-10-07

    Abstract: An imaging unit includes a light source and a pixel array. The light source projects a line of light that is scanned in a first direction across a field of view of the light source. The line of light oriented in a second direction that is substantially perpendicular to the first direction. The pixel array is arranged in at least one row of pixels that extends in a direction that is substantially parallel to the second direction. At least one pixel in a row is capable of generating two-dimensional color information of an object in the field of view based on a first light reflected from the object and is capable of generating three-dimensional (3D) depth information of the object based on the line of light reflecting from the object. The 3D-depth information includes time-of-flight information.

    CMOS IMAGE SENSOR FOR 2D IMAGING AND DEPTH MEASUREMENT WITH AMBIENT LIGHT REJECTION

    公开(公告)号:US20190101379A1

    公开(公告)日:2019-04-04

    申请号:US16191415

    申请日:2018-11-14

    Abstract: Using the same image sensor to capture both a two-dimensional (2D) image of a three-dimensional (3D) object and 3D depth measurements for the object. A laser point-scans the surface of the object with light spots, which are detected by a pixel array in the image sensor to generate the 3D depth profile of the object using triangulation. Each row of pixels in the pixel array forms an epipolar line of the corresponding laser scan line. Timestamping provides a correspondence between the pixel location of a captured light spot and the respective scan angle of the laser to remove any ambiguity in triangulation. An Analog-to-Digital Converter (ADC) in the image sensor generates a multi-bit output in the 2D mode and a binary output in the 3D mode to generate timestamps. Strong ambient light is rejected by switching the image sensor to a 3D logarithmic mode from a 3D linear mode.

    DEVICE STRUCTURE FOR HIGH FILL-FACTOR SPAD PIXEL WITH CMOS IN-PIXEL CIRCUITS

    公开(公告)号:US20240153983A1

    公开(公告)日:2024-05-09

    申请号:US18096012

    申请日:2023-01-11

    Abstract: A pixel cell for a CMOS image sensor includes an isolation structure that isolates a pixel transistor region from a pixel photodiode region. On a front side of the image sensor, the isolation structure includes a first shallow trench isolation (STI) structure, a second STI structure and a semiconductor region between the first STI structure and the second STI structure, and an implant region formed from a p-type semiconductor that is in contact with the semiconductor region and extends toward a backside of the image sensor. The semiconductor region is formed from the first type semiconductor. On a backside of the image sensor, the isolation structure includes a trench isolation structure extending from the backside toward the front side and that contacts the implant region.

    LWIR SENSOR WITH CAPACITIVE MICROBOLOMETER AND HYBRID VISIBLE/LWIR SENSOR

    公开(公告)号:US20230016984A1

    公开(公告)日:2023-01-19

    申请号:US17950083

    申请日:2022-09-21

    Abstract: A pixel for an image sensor includes a microbolometer sensor portion, a visible image sensor portion and an output path. The microbolometer sensor portion outputs a signal corresponding to an infrared (IR) image sensed by the microbolometer sensor portion. The visible image sensor portion outputs a signal corresponding to a visible image sensed by the visible image sensor portion. The output path is shared by the microbolometer and the visible image sensor portions, and is controlled to selectively output the signal corresponding to the IR image or the signal corresponding to the visible image. The output path may be further shared with a visible image sensor portion of an additional pixel, in which case the output path may be controlled to selectively to also output the signal corresponding to a visible image of the additional pixel.

    TIMESTAMP CALIBRATION OF THE 3D CAMERA WITH EPIPOLAR LINE LASER POINT SCANNING

    公开(公告)号:US20220321819A1

    公开(公告)日:2022-10-06

    申请号:US17847132

    申请日:2022-06-22

    Abstract: Using the same image sensor to capture a two-dimensional (2D) image and three-dimensional (3D) depth measurements for a 3D object. A laser point-scans the surface of the object with light spots, which are detected by a pixel array in the image sensor to generate the 3D depth profile of the object using triangulation. Each row of pixels in the pixel array forms an epipolar line of the corresponding laser scan line. Timestamping provides a correspondence between the pixel location of a captured light spot and the respective scan angle of the laser to remove any ambiguity in triangulation. An Analog-to-Digital Converter (ADC) in the image sensor operates as a Time-to-Digital (TDC) converter to generate timestamps. A timestamp calibration circuit is provided on-board to record the propagation delay of each column of pixels in the pixel array and to provide necessary corrections to the timestamp values generated during 3D depth measurements.

    NEURAL PROCESSING ACCELERATOR
    49.
    发明申请

    公开(公告)号:US20220292049A1

    公开(公告)日:2022-09-15

    申请号:US17751487

    申请日:2022-05-23

    Abstract: A system for calculating. A scratch memory is connected to a plurality of configurable processing elements by a communication fabric including a plurality of configurable nodes. The scratch memory sends out a plurality of streams of data words. Each data word is either a configuration word used to set the configuration of a node or of a processing element, or a data word carrying an operand or a result of a calculation. Each processing element performs operations according to its current configuration and returns the results to the communication fabric, which conveys them back to the scratch memory.

    SYSTEM AND METHOD FOR HISTOGRAM BINNING FOR DEPTH DETECTION

    公开(公告)号:US20210389462A1

    公开(公告)日:2021-12-16

    申请号:US16940237

    申请日:2020-07-27

    Abstract: Provided is a depth detection system and method of histogram binning for depth detection. The depth detection system includes a light source configured to emit a light pulse toward an object, an optical sensor configured to detect the light pulse reflecting off the object, the optical sensor including a first sensing pixel configured to detect the light pulse for a first event count according to the light pulse reflecting off the object, and a second sensing pixel configured to detect the light pulse for a second event count according to the light pulse reflecting off the object, and a processing circuit configured to determine a first aggregated histogram corresponding to the first sensing pixel based on the first event count and the second event count and determine a first peak of the first aggregated histogram to determine a first time of flight associated with the first sensing pixel.

Patent Agency Ranking