公开(公告)号：US08531842B2

公开(公告)日：2013-09-10

申请号：US12855593

申请日：2010-08-12

申请人： Michiko Johnson ,  Kiyofumi Sakaguchi ,  Takanori Suzuki ,  Masashi Kitani

发明人： Michiko Johnson ,  Kiyofumi Sakaguchi ,  Takanori Suzuki ,  Masashi Kitani

IPC分类号： H05K7/00

CPC分类号： G02F1/133308 ,  G02F2001/133331 ,  G02F2202/28

摘要： A display module includes a display panel, a unit disposed on an outer side of the display panel, and an adhesive sheet with which the display panel and the unit are stuck together. The adhesive sheet has a first adhesive surface adhering to the display panel and a second adhesive surface adhering to the unit. The edge of the first adhesive surface and the edge of the second adhesive surface are displaced from each other in the adhesive surface direction.

摘要翻译： 显示模块包括显示面板，设置在显示面板的外侧的单元和粘合片，显示面板和单元通过该粘合片粘合在一起。 粘合片具有附着在显示面板上的第一粘合面和附着在该单元上的第二粘接面。 第一粘合剂表面的边缘和第二粘合剂表面的边缘在粘合剂表面方向上彼此偏移。

公开(公告)号：US20120211640A1

公开(公告)日：2012-08-23

申请号：US13371284

申请日：2012-02-10

申请人： Takanori Suzuki

发明人： Takanori Suzuki

IPC分类号： H01L27/146

CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/10253 ,  H04N5/2253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01033

摘要： An intermediate member is disposed between a peripheral region and a third region, having been fixed to an imaging plate and a retaining plate. The intermediate member does not extend to between at least a part of a middle region and a forth region, such that a void is provided. The difference between the linear expansion coefficient of the imaging plate and the linear expansion coefficient of the intermediate member is smaller than the difference between the linear expansion coefficient of the retaining plate and the linear expansion coefficient of the intermediate member.

摘要翻译： 中间构件设置在已经固定到成像板和保持板的周边区域和第三区域之间。 中间构件不延伸到中间区域和第四区域的至少一部分之间，使得提供空隙。 成像板的线膨胀系数与中间构件的线膨胀系数的差小于保持板的线膨胀系数与中间构件的线膨胀系数之差。

公开(公告)号：US20120052612A1

公开(公告)日：2012-03-01

申请号：US13211161

申请日：2011-08-16

申请人： Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

发明人： Yasuhiro Matsuki ,  Takanori Suzuki ,  Koji Tsuduki ,  Shin Hasegawa ,  Tadashi Kosaka ,  Akiya Nakayama

IPC分类号： H01L31/18

CPC分类号： H01L27/14618 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing an optical sensor includes the steps of providing a semiconductor wafer having a plurality of pixel areas; forming a grid-like rib enclosing each pixel area on the semiconductor wafer, the grid-like rib having a predetermined width and being formed from a fixing member; providing a light-transmissive substrate having a gap portion on a main surface thereof, the gap portion having at least one of a groove having a width smaller than the grid-like rib and a plurality of through-holes; fixing the semiconductor wafer and the light-transmissive substrate such that the grid-like rib and the gap portion face each other; and cutting the fixed semiconductor wafer and light-transmissive substrate into pieces such that each piece includes one pixel area.

摘要翻译： 一种制造光学传感器的方法包括以下步骤：提供具有多个像素区域的半导体晶片; 形成包围所述半导体晶片上的每个像素区域的格栅状肋，所述格子状肋具有预定的宽度并由固定构件形成; 提供在其主表面上具有间隙部分的透光基板，所述间隙部分具有宽度小于所述格子状肋条的槽和多个通孔中的至少一个; 固定所述半导体晶片和所述透光基板，使得所述格子状肋和所述间隙部彼此面对; 并且将固定的半导体晶片和透光基板切割成片，使得每个片包括一个像素区域。

公开(公告)号：US20120050590A1

公开(公告)日：2012-03-01

申请号：US13211102

申请日：2011-08-16

申请人： Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

发明人： Takanori Suzuki ,  Tadashi Kosaka ,  Koji Tsuduki ,  Yasuhiro Matsuki ,  Shin Hasegawa ,  Akiya Nakayama

IPC分类号： H04N5/335 ,  H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/13

摘要： A method of manufacturing an optical sensor includes providing a semiconductor wafer including a plurality of pixel areas, providing a light transmissive substrate including a light transmissive wafer with a plurality of light transmissive members attached thereto, the plurality of light transmissive members being arranged on a first main surface of the light transmissive wafer and each of plurality of light transmissive members emitting α rays, an amount of the α rays being smaller than or equal to 0.05 c/cm2·h, fixing the light transmissive substrate onto the semiconductor wafer together by a fixing member, and dividing the semiconductor wafer and the light transmissive substrate that are fixed together into individual pieces.

摘要翻译： 一种制造光学传感器的方法，包括提供包括多个像素区域的半导体晶片，提供包括具有附接到其上的多个透光构件的透光晶片的透光基板，所述多个透光构件布置在第一 透光晶片的主表面和发射α射线的​​多个透光部件中的每一个，α射线的量小于或等于0.05c / cm 2·h，将透光基板固定在半导体晶片上一起由 固定部件，并且将固定在一起的半导体晶片和透光性基板分割成单独的片。

公开(公告)号：US07986068B2

公开(公告)日：2011-07-26

申请号：US12486221

申请日：2009-06-17

申请人： Takanori Suzuki ,  Tatsuya Fukushima

发明人： Takanori Suzuki ,  Tatsuya Fukushima

IPC分类号： H02K15/02

CPC分类号： H02K1/276 ,  H02K1/28

摘要： A motor including: a rotatably supported shaft; and a rotor section press-fitted and fixed coaxially to the shaft, wherein the rotor section is provided with: a rotor yoke; a housing hole formed on an end surface of the rotor yoke along the axial direction of the shaft; a permanent magnet housed within the housing hole; and a pair of end surface plates: that have a ring-shaped plate that is provided so as to cover at least an opening section of the housing hole and that is made of a non-magnetic material, and a supporting plate that supports the ring-shaped plate, that is press-fitted and fixed on the shaft, and that has a coefficient of linear expansion equivalent to that of the shaft; that are provided on axial end portions of the rotor yoke; and that clamp the rotor yoke so as to hold the permanent magnet within the housing hole.

摘要翻译： 一种电动机，包括：可旋转地支撑的轴; 以及与所述轴同轴地压配合并固定的转子部，其中，所述转子部设置有：转子轭; 壳体孔，沿着轴的轴向形成在转子轭的端面上; 容纳在所述容纳孔内的永磁体; 以及一对端面板，其具有环状板，所述环状板设置成覆盖所述壳体孔的至少一个开口部并且由非磁性材料制成，并且支撑所述环 形状的板，其被压配并固定在轴上，并且具有与轴的线膨胀系数相等的线膨胀系数; 设置在转子轭的轴向端部上; 并且夹紧转子轭以将永磁体保持在壳体孔内。

公开(公告)号：US07955903B2

公开(公告)日：2011-06-07

申请号：US12490656

申请日：2009-06-24

申请人： Koji Tsuduki ,  Takanori Suzuki

发明人： Koji Tsuduki ,  Takanori Suzuki

IPC分类号： H01L21/00 ,  H01L23/48

CPC分类号： H01L21/56 ,  H01L23/3121 ,  H01L2224/45144 ,  H01L2224/49171 ,  H01L2924/00

摘要： A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern.

摘要翻译： 半导体模块包括密封的半导体芯片，其封装树脂被防止从外边缘的内侧溢出的布线图案延伸部分沿着沿阻焊图案的外边缘延伸的布线图案延伸部分在外部边缘处 阻焊图案。

公开(公告)号：US07913665B2

公开(公告)日：2011-03-29

申请号：US12238802

申请日：2008-09-26

申请人： Hidekazu Oomura ,  Yukio Tomiita ,  Yoshinori Yamashita ,  Koichi Sugiyama ,  Hideaki Ichihara ,  Yoshihiro Nakase ,  Takanori Suzuki

发明人： Hidekazu Oomura ,  Yukio Tomiita ,  Yoshinori Yamashita ,  Koichi Sugiyama ,  Hideaki Ichihara ,  Yoshihiro Nakase ,  Takanori Suzuki

IPC分类号： F02B15/00

CPC分类号： F02M61/145 ,  F02B2275/16 ,  F02M61/1853 ,  Y02T10/123

摘要： A cylinder of an internal combustion engine is communicated with intake ports. Each of intake valves and each of fuel injection valves are provided to a corresponding one of the intake ports to inject fuel into a combustion chamber through a curved portion and an opening of the corresponding intake port. An injection axis of each fuel injection valve intersects with a surface of the corresponding intake valve placed in a close position at an intersecting point that is located on an upstream side of a central axis of the corresponding intake valve.

摘要翻译： 内燃机的气缸与进气口连通。 每个进气门和每个燃料喷射阀设置到相应的一个进气口中，以通过弯曲部分和对应的进气口的开口将燃料喷射到燃烧室中。 每个燃料喷射阀的喷射轴线与位于相应进气门的中心轴上游侧的交叉点处的关闭位置处的相应进气门的表面相交。

公开(公告)号：US20110020666A1

公开(公告)日：2011-01-27

申请号：US12933578

申请日：2009-04-21

申请人： Taisei Wakisaka ,  Tokuji Okumura ,  Takanori Suzuki

发明人： Taisei Wakisaka ,  Tokuji Okumura ,  Takanori Suzuki

IPC分类号： B32B15/01 ,  B23K1/19 ,  B23K20/24 ,  C22C18/00

CPC分类号： B23K35/282 ,  B23K1/0056 ,  B23K1/14 ,  B23K1/19 ,  B23K26/24 ,  B23K35/28 ,  B23K35/3053 ,  B23K2103/20 ,  B32B15/01 ,  Y10T428/12736 ,  Y10T428/12757

摘要： In joining an Fe-based metallic member comprising an Fe-based material and an Al-based metallic member comprising an Al-based material by a Zn-based brazing filler metal, a joined part of the Fe-based metallic member is heated at a temperature higher than a melting point of the Fe-based material.

摘要翻译： 在通过Zn基钎料将由Fe基材料和Al系金属构成的Al系金属构件接合在Fe基金属构件中时，将Fe系金属构件的接合部加热至 温度高于Fe基材料的熔点。

公开(公告)号：US07439404B2

公开(公告)日：2008-10-21

申请号：US10591439

申请日：2005-03-03

申请人： Keiji Kuma ,  Takanori Suzuki

发明人： Keiji Kuma ,  Takanori Suzuki

IPC分类号： C07C409/00 ,  C07C407/00

CPC分类号： B01J4/001 ,  B01J4/002 ,  B01J19/26 ,  C07C37/08 ,  C07C407/00 ,  C07C409/10 ,  C07C39/04

摘要： A process for the continuous production of cumene hydroperoxide (CHP) by oxidizing cumene in a liquid phase in a reactor in the presence of an oxygen-containing gas, wherein the oxygen content of the whole gas fed into the liquid phase in the reactor is adjusted to 22 to 50 mol % and the oxidation is carried out under the condition that: (1) the CHP production per unit volume of the reaction fluid in the reactor is at least 22 kg/m3/hr, (2) the oxygen content of the exhaust gas from the reactor is 2 to 10 mol %, or (3) the oxygen-containing gas is fed into the reactor by the use of a sparger whose aperture pitch is at least twice the aperture diameter. The process enhances CHP production per unit volume of the reaction fluid in the reactor, thus downsizing the reactor permitting required CHP production or enabling increased CHP production in an existing reactor.

摘要翻译： 通过在含氧气体的存在下在反应器中的液相中氧化异丙基苯来连续生产氢过氧化枯烯（CHP）的方法，其中调节进料到反应器中液相的整个气体的氧含量 至22至50摩尔％，并且在以下条件下进行氧化：（1）反应器中每单位体积的反应流体的CHP产量为至少22kg / m 3 / hr ，（2）来自反应器的废气的氧含量为2至10摩尔％，或（3）通过使用孔径为孔的至少两倍的喷射器将含氧气体进料到反应器中 直径。 该方法提高反应器中每单位体积反应流体的CHP产量，从而使反应器小型化，允许所需的CHP生产或使现有反应器中的CHP生产增加。

公开(公告)号：US20080157400A1

公开(公告)日：2008-07-03

申请号：US11955504

申请日：2007-12-13

申请人： Koji Tsuduki ,  Takanori Suzuki

发明人： Koji Tsuduki ,  Takanori Suzuki

IPC分类号： H01L23/31

CPC分类号： H01L21/56 ,  H01L23/3121 ,  H01L2224/45144 ,  H01L2224/49171 ,  H01L2924/00

摘要： A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern.

摘要翻译： 半导体模块包括密封的半导体芯片，其封装树脂被防止从外边缘的内侧溢出的布线图案延伸部分沿着沿阻焊剂图案的外边缘从布线图案延伸的布线图案延伸部分 阻焊图案。