摘要:
A three-dimensional (3-D) display system using a variable focal length lens includes at least one two-dimensional (2-D) display device, configured to display at least one two-dimensional image. The display system also includes an array of micromirror array lenses optically coupled to the display device, each micromirror array lens of the array of micromirror array lenses placed at a different location with respect to the display device, configured to focus the at least one two-dimensional image from each different location to provide a three-dimensional (3-D) image. The advantages of the present invention include increased viewing angles and wide depth range of three-dimensional images.
摘要:
A semiconductor device and a method for manufacturing the same are disclosed. A pattern of a polysilicon layer for a gate electrode and another pattern of a polysilicon layer for a resistor are respectively formed on an active region of a salicide region and a device isolation film of a non-salicide region by respectively interposing a gate insulating film between the one pattern and the active region and between the other pattern and the device isolation film. A spacer is then formed at sidewalls of the polysilicon layer for the gate electrode and a salicide prevention film is formed to encircle the polysilicon layer for the resistor. Subsequently, source and drain regions are formed on the active region of the salicide region and a salicide layer is formed on the gate electrode and the source and drain regions of the salicide region.
摘要:
A termination device for use in a WDM-SCM PON system can effectively support a multi-channel integration function of a WDM/SCM PON system. The termination device contained in a termination end of a WDM/SCM (Wavelength Division Multiplexing/Sub-Carrier Multiplexing) PON (Passive Optical Network) to connect the PON with either a subscriber or an Ethernet service network includes: an Ethernet interface module connected to the Ethernet service network or the subscriber to perform an Ethernet interface function; a WDM/SCM physical layer module physically connected to the WDM/SCM PON to transmit/receive optical signals to/from the WDM/SCM PON; and a MAC (Media Access Control)-bridge module for performing a multiplexing/demultiplexing operation based on a MAC address upon receipt of transmission/reception frames, and reconstructing preambles of the frames while being classified according to channels so that individual Ethernet frames are matching-processed while being classified according to SCM channels of the WDM/SCM physical layer module.
摘要:
A dryer rack for use with an apparatus for drying an object inside a drum is disclosed, wherein the dryer rack includes a platform for having an upper surface for supporting the object. The platform may include at least one grip for loading and unloading the dryer rack into an interior space of the drum. The at least one grip is flush with the upper surface of the platform. The at least one grip is formed in a forward portion of the platform, to be near an access point of the drum.
摘要:
The present invention discloses a method for manufacturing a semiconductor device, comprising the steps of: providing a semiconductor substrate on which cell strings are formed and in which a plurality of conductive regions are formed; sequentially forming a first interlayer insulation film and a first etch barrier film on the semiconductor substrate; forming a plurality of contact holes by exposing the plurality of conductive regions formed in the semiconductor substrate, wherein an impurity concentration of the conductive regions is reduced due to the process for forming the contact holes; filling a metal material in the contact holes and forming a plurality of contact plugs; sequentially forming a second interlayer insulation film, a second etch barrier film and a third interlayer insulation film over a resulting structure including the contact plugs; forming a plurality of metal line patterns, wherein the metal line patterns pass through the third interlayer insulation film, the second etch barrier film and the second interlayer insulation film and contact to the contact plugs; forming a fourth interlayer insulation film over a resulting structure including the plurality of metal line patterns; forming a plurality of metal line contact holes by patterning the fourth interlayer insulation film; and forming a plurality of metal line contact plugs in the plurality of metal line contact holes by filling a metal material in the metal line contact holes.
摘要:
Memory subsystems and methods, such as those involving a memory cell array formed over a semiconductor material of a first type, such as p-type substrate. In at least one such subsystem, all of the transistors used to selectively access cells within the array are transistors of a second type, such as n-type transistors. Local word line drivers are coupled to respective word lines extending through the array. Each local word line drivers includes at least one transistor. However, all of the transistors in the local word line drivers are of the second type. A well of semiconductor material of the second type, is also formed in the material of the first type, and a plurality of global word line drivers are formed using the well. Other subsystems and methods are disclosed.
摘要:
Memory subsystems and methods, such as those involving a memory cell array formed over a semiconductor material of a first type, such as p-type substrate. In at least one such subsystem, all of the transistors used to selectively access cells within the array are transistors of a second type, such as n-type transistors. Local word line drivers are coupled to respective word lines extending through the array. Each local word line drivers includes at least one transistor. However, all of the transistors in the local word line drivers are of the second type. A well of semiconductor material of the second type, is also formed in the material of the first type, and a plurality of global word line drivers are formed using the well. Other subsystems and methods are disclosed.
摘要:
A low voltage sensing scheme reduces active power down standby leakage current in a memory device. A clamping device or diode is used between a Psense amplifier control line (e.g. ACT) and Vcc and/or between an Nsense amplifier control line (e.g. RNL*) and Vss (ground potential). The clamping diode is not enabled during normal memory operations, but is turned on during active power down mode to reduce leakage current through ACT and/or RNL* nodes. The clamping device connected to the ACT node may reduce the voltage on the ACT line during power down mode, whereas the clamping device connected to the RNL* node may increase the voltage on the RNL* line during power down mode to reduce sense amplifier leakage current through these nodes. Because of the rules governing abstracts, this abstract should not be used to construe the claims.
摘要:
Provided are a system and method for controlling a device through changes in a pressure of a deformable chamber such as may be controlled by a user through a user's hand and/or body. In one example, a device with a deformable chamber detects pressure level changes from a baseline and modifies output parameters including modifications on the playback of stored patterns. In another example, a massage device with a deformable chamber records the most recent pressure level changes in a sequence, interprets the pressure level sequence as a sequence of power levels to a vibratory motor, and repeats back the interpretation until a further pressure input is received above a baseline. In another example, the massage device interprets the currently input sequence of pressure levels in real-time into a sequence of power levels delivered to the vibratory motor.
摘要:
A low voltage sensing scheme reduces active power down standby leakage current in a memory device. During memory's active power down state, the leak current may increase because of the use of P and Nsense amplifiers having low threshold voltages (Vth) for low Vcc sensing of data signals. A clamping device or diode is used between a Psense amplifier control line (e.g. ACT) and Vcc and/or between an Nsense amplifier control line (e.g. RNL*) and Vss (ground potential). The clamping diode is not enabled during normal memory operations, but is turned on during active power down mode to reduce leakage current through ACT and/or RNL* nodes. The clamping device connected to the ACT node may reduce the voltage on the ACT line during power down mode, whereas the clamping device connected to the RNL* node may increase the voltage on the RNL* line during power down mode to reduce sense amplifier leakage current through these nodes. Because of the rules governing abstracts, this abstract should not be used to construe the claims.