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公开(公告)号：US20210111098A1
公开(公告)日：2021-04-15
申请号：US16597133
申请日：2019-10-09
Inventor： Shailesh N. Joshi , Yanghe Liu
IPC: H01L23/427 , H01L23/373 , H01L21/48
Abstract: Direct-bonded metal substrates of electronic assemblies are disclosed. For example, the direct-bonded metal substrate includes a ceramic substrate and a first conductive layer. The first conductive layer is bonded to a first surface of the ceramic substrate, and the first conductive layer includes a first core and a first encapsulating layer that encapsulates the first core. The first core includes a phase change material having a first melting temperature, the first encapsulating layer includes an encapsulating material having a second melting temperature, and the second temperature is greater than the first melting temperature.
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公开(公告)号：US10896865B2
公开(公告)日：2021-01-19
申请号：US16189502
申请日：2018-11-13
Inventor： Shailesh N. Joshi , Naoya Take , Ercan Mehmet Dede , Yanghe Liu
IPC: H01L23/473 , H05K7/20 , H01L23/373
Abstract: A power electronics module includes a power electronics device, and an electrically-conductive substrate directly coupled to the power electronics device, the electrically-conductive substrate defining a plurality of channels extending through the electrically-conductive substrate, and a plurality of electrical pathways extending through the electrically-conductive substrate around the plurality of channels.
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公开(公告)号：US20180295748A1
公开(公告)日：2018-10-11
申请号：US15481821
申请日：2017-04-07
Inventor： Hiroshi Ukegawa , Yanghe Liu , Feng Zhou , Shailesh N. Joshi , Ercan Dede
IPC: H05K7/20
CPC classification number: H05K7/20509 , H01L23/367 , H01L23/3733 , H01L23/473 , H05K7/20254 , H05K7/20336 , H05K7/209 , H05K7/20927
Abstract: Electronics assemblies incorporating three-dimensional heat flow structures are disclosed herein. In one embodiment, an electronics assembly includes a substrate having a surface defining a plane, a heat generating component coupled to the surface of the substrate, a cooling device positioned outside of the plane defined by the surface of the substrate, and a three-dimensional heat flow structure. The three-dimensional heat flow structure includes a first portion thermally coupled to the heat generating component and a second portion extending from the first portion. At least a portion of the first portion is parallel to the plane defined by the substrate. The second portion is transverse to the plane defined by the surface of the substrate. The second portion is thermally coupled to the cooling device such that the three-dimensional heat flow structure thermally couples the heat generating component to the cooling device.
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公开(公告)号：US20180099363A1
公开(公告)日：2018-04-12
申请号：US15288327
申请日：2016-10-07
Inventor： Feng Zhou , Yanghe Liu , Ercan Mehmet Dede , Shailesh N. Joshi
IPC: B23P15/26
Abstract: Systems and methods for degassing and charging phase-change thermal devices are disclosed. In one embodiment, a system includes a flask, a first shut-off valve fluidly coupled to an outlet of the flask, and a first valve fluidly coupled to the first shut-off valve by a fluid line. The system further includes a second valve fluidly coupled to the first valve, wherein the second valve is operable to be fluidly coupled to the phase-change thermal device, a second shut-off valve fluidly coupled to the second valve, a third valve fluidly coupled to the first valve, a vacuum pump fluidly coupled to the third valve, and a fluid injection device fluidly coupled to the fluid line between the first valve and the first shut-off valve. The fluid injection device draws the working fluid from the flask and injects a desired amount into the phase-change thermal device.
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公开(公告)号：US12300653B2
公开(公告)日：2025-05-13
申请号：US17701086
申请日：2022-03-22
Inventor： Feng Zhou , Yanghe Liu , Hiroshi Ukegawa
Abstract: In one embodiment, an electronics assembly includes a cold plate assembly having a first surface, at least one power electronic device disposed within a recess on the first surface of the cold plate assembly, and a printed circuit board disposed on a surface of the at least one power electronic device. The printed circuit board includes a first insulation layer, a second insulation layer, an electrically conductive power layer between the first insulation layer and the second insulation layer, a first set of thermal vias extending from the electrically conductive power layer and toward the first surface of the cold plate assembly, and a second set of thermal vias extending from the first surface of the cold plate assembly toward the electrically conductive power layer. The first set of thermal vias is electrically isolated from the second set of thermal vias.
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Patent Agency Ranking
46.发明申请公开(公告)号：US20250016935A1
公开(公告)日：2025-01-09
申请号：US18346566
申请日：2023-07-03
Inventor： Yanghe Liu , Feng Zhou , Ercan M. Dede
Abstract: A method, computer program product, and apparatus for a rectifier. The rectifier may be fabricated, wherein fabricating the rectifier may include fabricating a power device area in a printed circuit board (PCB). Fabricating the rectifier may include fabricating a passive component area in the PCB. Fabricating the rectifier may include fabricating an inductor area in the PCB, wherein each component of the power device area, the passive component area, and copper windings of the inductor area may be entirely embedded within the PCB. One or more ferrite blocks may be assembled into the PCB.
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公开(公告)号：US12068711B2
公开(公告)日：2024-08-20
申请号：US17166380
申请日：2021-02-03
Inventor： Yanghe Liu , Qunfang Wu , Mengqi Wang , Weiyang Zhou , Chungchih Chou , Hiroshi Ukegawa
IPC: H02P5/46 , H02P25/024
CPC classification number: H02P5/46 , H02P25/024
Abstract: Methods, apparatuses and systems provide technology for a high frequency alternating-current (HFAC) distribution network for a vehicle that includes a plurality of HFAC zones coupled to a direct-current (DC) power source, the plurality of HFAC zones disbursed within the vehicle, where each HFAC zone includes a HFAC resonant inverter to convert DC power to HFAC power and a HFAC bus coupled to the HFAC resonant inverter, the HFAC bus to distribute the HFAC power to one or more loads. The technology includes a CLCL resonant tank circuit having two capacitors and two inductors, a push-pull circuit coupled to the CLCL resonant tank circuit, the push-pull circuit including a pair of switches, and a transformer to couple the inverter to the HFAC bus.
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公开(公告)号：US11938875B2
公开(公告)日：2024-03-26
申请号：US17164166
申请日：2021-02-01
Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , The Regents Of The University Of Michigan
Inventor： Yanghe Liu , Chungchih Chou , Hiroshi Ukegawa , Qunfang Wu , Mengqi Wang , Weiyang Zhou
IPC: B60R16/023 , B60R16/03 , H02J50/40 , H02J50/80 , H04B1/02
CPC classification number: B60R16/023 , B60R16/03 , H02J50/40 , H02J50/80 , H04B1/02
Abstract: Systems and methods are provided for wireless power transfer in a vehicle. A wireless power transfer system can include a high-frequency alternating current (HFAC) inverter electrically coupled to the power source and a transmitter to wirelessly transmit a HFAC power signal to at least one device of a vehicle, such as sensors (e.g., LiDAR, GPS etc.) and cameras. The HFAC power signal provides wireless power and a data signal to the at least one device of a vehicle. The wireless power transfer system can eliminate the need for cabling and wires to provide power to the device. Wireless power transfer can include use or a data modulation circuit and a pulse current source to inject a pulse current to the HFAC power signal as superimposed data. System configurations can power a plurality of devices. Systems can includes a plurality of HFAC inverters and transmitters to power multiple sets of devices.
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公开(公告)号：US20230395897A1
公开(公告)日：2023-12-07
申请号：US17830683
申请日：2022-06-02
Inventor： Yanghe Liu , Feng Zhou , Hiroshi Ukegawa
IPC: H01M10/6568 , H01M50/505
CPC classification number: H01M10/6568 , H01M50/505
Abstract: A coolant manifold assembly is provided. The coolant manifold assembly may include a manifold body having a coolant delivering channel delivering coolant to a charging module fluidly communicating with the coolant delivering channel, and a coolant receiving channel receiving the coolant from the charging module fluidly communicating with the coolant receiving channel. The coolant manifold further include a bus bar disposed on the manifold body, the bus bar transmits power received from the charging module to a battery.
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50.发明公开公开(公告)号：US20230307406A1
公开(公告)日：2023-09-28
申请号：US17701086
申请日：2022-03-22
Inventor： Feng Zhou , Yanghe Liu , Hiroshi Ukegawa
CPC classification number: H01L24/24 , H01L25/16 , H05K7/2089 , H01L25/072 , H01L24/25 , H01L25/50 , H01L24/82 , H01L23/3735
Abstract: In one embodiment, an electronics assembly includes a cold plate assembly having a first surface, at least one power electronic device disposed within a recess on the first surface of the cold plate assembly, and a printed circuit board disposed on a surface of the at least one power electronic device. The printed circuit board includes a first insulation layer, a second insulation layer, an electrically conductive power layer between the first insulation layer and the second insulation layer, a first set of thermal vias extending from the electrically conductive power layer and toward the first surface of the cold plate assembly, and a second set of thermal vias extending from the first surface of the cold plate assembly toward the electrically conductive power layer. The first set of thermal vias is electrically isolated from the second set of thermal vias.
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