Power device assemblies and methods of fabricating the same

    公开(公告)号:US11997838B2

    公开(公告)日:2024-05-28

    申请号:US17590232

    申请日:2022-02-01

    IPC分类号: H05K7/20 H01L23/367

    摘要: Disclosed herein are apparatus and methods for a power electronics assembly that includes a cold plate assembly and one or more power device assemblies. The cold plate assembly has a manifold having a heat sink cavity in a first surface and a heat sink that includes one or more substrate cavities. The heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly includes an S-cell, a power device, and a direct bonded metal substrate bonded to the S-Cell. The S-cell includes a base layer constructed at least of graphite or a graphite-composite, a conductive layer at least partially surrounding the base layer, and a power device cavity. The power device is positioned in the power device cavity and is electrically coupled to the conductive layer.

    AERIAL VEHICLE
    9.
    发明申请

    公开(公告)号:US20230133184A1

    公开(公告)日:2023-05-04

    申请号:US17514080

    申请日:2021-10-29

    IPC分类号: B64C25/60 B64C39/02 B64F1/00

    摘要: An aerial vehicle includes a body and a wireless charging receiver pad connected to the body, whereby the aerial vehicle is configured to be wirelessly charged when parked above a wireless charging transmitter pad. The aerial vehicle includes landing gear connected to the body and extending underneath the body. The landing gear is configured for actuation to control the location of the receiver pad with respect to the transmitter pad.

    Manifold structures having an integrated fluid channel system and assemblies comprising the same

    公开(公告)号:US10334756B1

    公开(公告)日:2019-06-25

    申请号:US15907926

    申请日:2018-02-28

    摘要: Embodiments described herein generally relate to an assembly including a manifold structure. The manifold structure includes a fluid inlet and a fluid outlet. The fluid inlet is for receiving a cooling fluid into the manifold structure and the fluid outlet is for removing the cooling fluid from the manifold structure. The manifold structure also includes a first cooling surface and an opposite second cooling surface. The first cooling surface includes a cooling chip inlet opening fluidly coupled to a cooling chip outlet opening. The fluid inlet is fluidly coupled to the cooling chip inlet opening. The second cooling surface includes a cavity. A first integrated fluid channel fluidly couples the cooling chip outlet opening to the cavity and a second integrated fluid channel fluidly couples the cavity to the fluid outlet. A cooling chip includes a plurality of microchannels, which fluidly couple the cooling chip to the first cooling surface.