摘要:
To restrict a bowing amount of a piezoelectric actuator, provided is a switching apparatus comprising a contact point section including a first contact point; and an actuator that moves a second contact point to contact or move away from the first contact point. The actuator includes a first piezoelectric film that expands and contracts according to a drive voltage to change a bowing amount of the actuator, and a second piezoelectric film that is provided in parallel with the first piezoelectric film and restricts bowing of the actuator when the drive voltage is not being supplied to the first piezoelectric film.
摘要:
An optical pickup, mounting a lens actuator 101 thereon, the lens actuator comprises: a lens 1 having an optical axis in direction in parallel with an optical disc; a holder 2, which holds the lens thereon; a first guide shaft 3 holding the holder, so as to regulate the holder to change a position thereof, into an inner surface direction of a surface having the optical axis of the lens as a normal line vector thereof; a second guide shaft 4, which regulates the holder to change the position thereof, into a normal line vector of an optical disc; and a reed screw, which moves the holder into direction of the optical axis of the lens, wherein a distance between the optical axis of the lens and the optical disc, a distance between a central axis of the first guide shaft and the optical disc, and a distance between a central axis of the second guide shaft and the optical disc are lager than a distance between a central axis of the reed screw and the optical disc.
摘要:
A semiconductor electronic device comprises a substrate; a buffer layer formed on said substrate, having two or more layers of composite layers in which a first semiconductor layer comprising nitride based compound semiconductor having smaller lattice constant and greater coefficient of thermal expansion than the substrate and a second semiconductor layer comprising nitride based compound semiconductor having smaller lattice constant and smaller coefficient of thermal expansion than the first semiconductor layer are alternately laminated; a semiconductor operating layer comprising nitride based compound semiconductor formed on said buffer layer; a dislocation reducing layer comprising nitride based compound semiconductor, formed in a location between a location directly under said buffer layer and inner area of said semiconductor operating layer, and comprising a lower layer area and an upper layer area each having an uneven boundary surface, wherein threading dislocation extending from the lower layer area to the upper layer area is bent at said boundary surface.
摘要:
A nonvolatile semiconductor memory device including a memory cell including a resistance memory element which changes from a low resistance state into a high resistance state by application of a voltage which is higher than a reset voltage and lower than a set voltage and changes from the high resistance state into the low resistance state by application of a voltage higher than the set voltage; a first transistor including a first source/drain diffused layer, and having one end of the first source/drain diffused layer coupled to one end of the resistance memory element; and a second transistor including a second source/drain diffused layer, and having one end of the second source/drain diffused layer coupled to said one end of the resistance memory element and the other end of the second source/drain diffused layer coupled to the other end of the resistance memory element.
摘要:
A semiconductor electronic device comprises a substrate; a buffer layer formed on the substrate, the buffer layer including not less than two layers of composite layer in which a first semiconductor layer formed of a nitride-based compound semiconductor layer having a lattice constant smaller than a lattice constant of the substrate and a thermal expansion coefficient larger than a thermal expansion coefficient of the substrate and a second semiconductor layer formed of a nitride-based compound semiconductor having a lattice constant smaller than a lattice constant of the first semiconductor layer and a thermal expansion coefficient larger than a thermal expansion coefficient of the substrate are alternately laminated; an intermediate layer provided between the substrate and the buffer layer, the intermediate layer being formed of a nitride-based compound semiconductor having a lattice constant smaller than a lattice constant of the first semiconductor layer and a thermal expansion coefficient larger than a thermal expansion coefficient of the substrate; and a semiconductor active layer formed on the buffer layer, the semiconductor active layer being formed of a nitride-based compound semiconductor, wherein: thicknesses of the first semiconductor layers in the buffer layer are non-uniform thereamong, and at least one of the first semiconductor layer has a thickness greater than a critical thickness, the critical thickness being a thickness above which a direction of warp caused by the first semiconductor layer to the substrate is inverted.
摘要:
A semiconductor device comprises a first MIS transistor and a second MIS transistor. The first MIS transistor includes a first gate insulating film formed on a first active region, and a first gate electrode formed on the first gate insulating film. The second MIS transistor includes a second gate insulating film formed on a second active region and made of an insulating material different from that of the first gate insulating film, and a second gate electrode formed on the second gate insulating film. Upper regions of the first gate electrode and the second gate electrode are electrically connected to each other on the isolation region located between the first active region and the second active region, and lower regions thereof are separated from each other with a sidewall insulating film made of the same insulating material as that of the first gate insulating film being interposed therebetween.
摘要:
In a method for forming an insulating film by performing plasma nitriding process to an oxide film on a substrate and then by annealing the substrate in a process chamber (51), the substrate is annealed under a low pressure of 667 Pa or lower. The annealing is performed for 5 or 45 seconds. The plasma nitriding process is performed by microwave plasma by using a planar antenna whereupon a multitude of slot holes are formed.
摘要:
In the present invention, when a gate insulation film in a DRAM is formed, an oxide film constituting a base of the gate insulation film is plasma-nitrided. The plasma nitridation is performed with microwave plasma generated by using a plane antenna having a large number of through holes. Nitrogen concentration in the gate insulation film formed by the plasma nitridation is 5 to 20% in atomic percentage. Even without subsequent annealing, it is possible to effectively prevent a boron penetration phenomenon in the DRAM and to reduce traps in the film causing deterioration in driving capability of the device.
摘要:
In an MRAM, a curved region (206) is formed in a bit line (202), and this curved region (206) is in bent shape, with a TMR element (203) serving as a center, in this case, in rough U shape (in the illustrated example, in roughly inverted U shape). The bit line (202) in which the curved region (206) is formed includes the TMR element (203) in a space formed by the curved region (206). Thanks to such relatively simple construction, this construction realizes a highly reliable MRAM which ensures that power is substantially saved during data writing into a memory cell while meeting requirements for further miniaturization of the device.
摘要:
A secondary battery for electronic appliance to be installed in an electronic appliance, thereby feeding an electric power to the electronic appliance, is disclosed, which includes: a battery cell in which a positive electrode, a negative electrode and an electrolyte are accommodated in a pack, and a positive electrode terminal and a negative electrode terminal from the positive electrode and the negative electrode, respectively are lead out from the same side face of the pack; a metallic battery can in which one opening from which the battery cell is inserted is formed and which accommodates the battery cell therein such that the side face from which the positive electrode terminal and the negative electrode terminal are lead out is faced towards the opening side; and a lid made of a synthetic resin in which a positive electrode terminal part and a negative electrode terminal part to be connected to the electrodes of the electronic appliance upon being connected to the positive electrode terminal and the negative electrode terminal and being faced outwardly are provided and which plugs the opening of the battery can.