摘要:
In a substrate processing apparatus configured to perform a predetermined process on a target substrate accommodated in a process chamber, the process chamber is cleaned by alternately performing an operation of generating plasma of a gas containing oxygen within the process chamber, and an operation of generating plasma of a gas containing nitrogen within the process chamber.
摘要:
Related keywords having certain relations to a target keyword are extracted from a unit storing keywords according to relations among each other. Expressions corresponding to the target keyword and related keywords are read from a unit storing expressions correspondingly with each stored keyword, each expression having been extracted from a content containing the corresponding keyword. A commonness between the expressions corresponding to each related keyword and the target keyword is calculated. An association between each related keyword and the target keyword is calculated using a distance for each related keyword from the target keyword and the commonness. A related keyword having a certain association is extracted as a same-region keyword in a same region as the target keyword. A drawing including the target keyword and related keywords arranged according to the associations is output with the same-region keyword displayed distinguishably from other related keywords not included in the same region.
摘要:
In a substrate processing apparatus configured to perform a predetermined process on a target substrate accommodated in a process chamber, the process chamber is cleaned by alternately performing an operation of generating plasma of a gas containing oxygen within the process chamber, and an operation of generating plasma of a gas containing nitrogen within the process chamber.
摘要:
In a substrate processing apparatus configured to perform a predetermined process on a target substrate accommodated in a process chamber, the process chamber is cleaned by alternately performing an operation of generating plasma of a gas containing oxygen within the process chamber, and an operation of generating plasma of a gas containing nitrogen within the process chamber.
摘要:
In a method for forming an insulating film by performing plasma nitriding process to an oxide film on a substrate and then by annealing the substrate in a process chamber (51), the substrate is annealed under a low pressure of 667 Pa or lower. The annealing is performed for 5 or 45 seconds. The plasma nitriding process is performed by microwave plasma by using a planar antenna whereupon a multitude of slot holes are formed.
摘要:
A wafer is disposed in a chamber, a plasma generating space is formed in the chamber, plasma processing is performed to the front surface of the processing object while keeping at least the front surface of the processing object in contact with the plasma generating space. The plasma processing is performed with the plasma generating space being kept in contact with at least the peripheral region of the back surface of the processing object.
摘要:
Related keywords having certain relations to a target keyword are extracted from a unit storing keywords according to relations among each other. Expressions corresponding to the target keyword and related keywords are read from a unit storing expressions correspondingly with each stored keyword, each expression having been extracted from a content containing the corresponding keyword. A commonness between the expressions corresponding to each related keyword and the target keyword is calculated. An association between each related keyword and the target keyword is calculated using a distance for each related keyword from the target keyword and the commonness. A related keyword having a certain association is extracted as a same-region keyword in a same region as the target keyword. A drawing including the target keyword and related keywords arranged according to the associations is output with the same-region keyword displayed distinguishably from other related keywords not included in the same region.
摘要:
The total film thickness T1N of silicon oxynitride film and silicon oxide film remaining as its underlying layer is measured. A measurement target substrate is re-oxidized, and, after the re-oxidization, the total film thickness (T2N) of the silicon oxynitride film, silicon oxide film and silicon oxide film resulting from the re-oxidization on the target substrate is measured. Separately, a reference substrate provided with silicon oxide film is re-oxidized, and, after the re-oxidization, the total film thickness T2 of the silicon oxide film and silicon oxide film resulting from the re-oxidization on the reference substrate is measured. Re-oxidization rate reduction ratio RORR of the measurement target substrate is calculated by the following formula (1) from the values of total film thicknesses T1N, T2N and T2. The nitrogen concentration of the silicon oxynitride film of the target substrate is determined from the calculated re-oxidization rate reduction ratio RORR. RORR (%)={(T2−T2N)/(T2−T1N)}×100 (1).
摘要:
In a method for forming an insulating film by performing plasma nitriding process to an oxide film on a substrate and then by annealing the substrate in a process chamber (51), the substrate is annealed under a low pressure of 667 Pa or lower. The annealing is performed for 5 or 45 seconds. The plasma nitriding process is performed by microwave plasma by using a planar antenna whereupon a multitude of slot holes are formed.
摘要:
A plasma surface treatment method for performing a surface treatment on a quartz member used under a plasma-exposed environment by using a plasma having an ion energy greater than about 5.3 eV. The plasma has, near a surface of the quartz member, an electron temperature higher than or equal to about 2 eV. Further, in a plasma processing apparatus for generating a plasma by introducing a microwave into a processing chamber through a planar antenna having a plurality of slots, the surface treatment is carried out for about 30-300 seconds by using a plasma of a processing gas containing Ar gas and N2 gas under conditions of a processing pressure lower than or equal to about 15 Pa and a microwave power higher than or equal to about 0.9 W/cm2, the surface treatment being repeated 25 to 2000 times.
摘要翻译:一种等离子体表面处理方法,用于通过使用离子能量大于约5.3eV的等离子体在等离子体暴露环境下使用的石英构件进行表面处理。 等离子体在石英构件的表面附近具有高于或等于约2eV的电子温度。 此外,在通过具有多个槽的平面天线将微波引入处理室来产生等离子体的等离子体处理装置中,通过使用包含有多个槽的处理气体的等离子体进行表面处理约30〜300秒 Ar气体和N 2气体,处理压力低于或等于约15Pa,微波功率高于或等于约0.9W / cm 2的条件下,表面处理重复25〜2000次。