摘要:
An object of the present invention is to provide a heater having an insulating substrate and a heating resistance so that the temperature on the heating face can be easily controlled without the necessity of providing a temperature controlling member separate from the insulating substrate. The heater 1 comprises a substrate 2 comprising an insulating material and a heating resistance 3 provided in the substrate 2. The heating resistance 3 comprises parallel-connected portions 6A to 6J each comprising a plurality of heat generating parts 6a, 6b and 6c connected in parallel. For example, at least one of the heat generating portions 6a, 6b and 6c has a resistance adjusting means 8A, 8B or 8C.
摘要:
An electrostatic chuck includes (a) a cooling device serving as an RF electrode, including a gas supply port penetrating through the cooling device, the gas supply port extending from one main surface to the other main surface, and a main counter bore portion having a diameter larger than that of the gas supply port, the main counter bore portion provided in an opening of the gas supply port; (b) an arc prevention member buried in the main counter bore portion and made of an insulating member, wherein a gas path is provided, the gas path is configured to communicate with the gas supply port; and (c) an electrostatic chuck body arranged on the cooling device, defining a work mounting surface on a top surface of the electrostatic chuck body, provided with a pore in communication with the gas supply port via the gas path.
摘要:
A heater includes a heating member formed in a plate shape that includes a substrate-heating surface on which a substrate is mounted and a heating member rear surface which is on the opposite side of the substrate-heating surfaces. The heater also has a resistance heating element embedded therein. An auxiliary member is placed on the side of the heating member rear surface of the heating member and has an opposing surface which opposes the heating member rear surface. A planar gas path for gas ejected on the substrate-heating surface is formed between the heating member rear surface and the opposing surface.
摘要:
A heating device includes: a plate-shaped heating substrate; and a hollow rod material an end face of which is joined to one surface of the heating substrate, and the heating substrate includes a lateral surface portion and a concave surface portion in the vicinity of a joint with the hollow rod material. The lateral surface portion forms a same plane surface with an outer peripheral surface of the hollow rod material, and the concave surface portion connects to the lateral surface portion. Moreover, an edge of a joint interface of the heating substrate and the hollow rod material is located between the lateral surface portion of the heating substrate and the outer peripheral surface of the hollow rod material.
摘要:
A heating device includes: a base containing ceramics, in which a resistance heating body is embedded; gas flow passages formed in an inside of the base; and adjustment members which vary flow rates of gas in the gas flow passages.
摘要:
A supporting structure is provided, including a ceramic susceptor to be heated and having a mounting face and a back face. A ceramic supporting member is joined with the back face of the susceptor. The ceramic supporting member has an outer wall surface, a joining face joined with the susceptor and an end face opposing the joining face. A curved part is formed between the outer wall surface and back face, and has a radius of curvature R in a range of 4 mm to 25 mm in the longitudinal direction of the ceramic supporting member.
摘要:
A manufacturing method for a substrate heating device comprises forming a base plate having a substrate heating surface in which a resistance heating element is buried, forming a tubular member, joining the tubular member to the base plate, measuring temperature distribution in the substrate heating surface by supplying power to the resistance heating element, and grinding the tubular member according to a grinding condition based on a measurement result of the temperature distribution.
摘要:
A wafer heating system 1 has a substrate portion 2a having a mounting face 2c for mounting and heating a wafer “W” and a side wall portion 2b surrounding the side edge of the wafer “W”. The height “D” of the side wall portion 2b from the mounting face 2c is not smaller than the thickness “C” of the wafer “W”.
摘要:
A heating system 25 has a main electric heat-generating element 3 and a heating surface 4a for heating an object, auxiliary electric heat-generating elements 5A to 5D, and a main power source 1 for supplying power to the main heating element. The system 25 further has an auxiliary power source 2 for supplying power to the auxiliary heating elements, and a power source controller for controlling the power supplied to the main heating element and to the auxiliary heating elements respectively and independently. Power supplied to the main heating element 3 is controlled by the controller within a first power range and power supplied to the auxiliary heating elements is controlled by the controller within a second power range. The second power range has a width smaller than that of the first power range so as to control temperature distribution on the heating surface 4a.
摘要:
A method for manufacturing a ceramic shell-and tube type heat exchanger provided with fins includes the steps of: inserting heat transfer tubes of sintered tubular ceramic into throughholes of tubular plates of unsintered plate-like ceramic each having a plurality of the throughholes for fixing the heat transfer tubes inserted thereinto; standing the heat transfer tubes vertically to a floor surface; positioning the tubular plates at both the upper and lower end portions of the heat transfer tubes; disposing between the tubular plates many fin plates of unsintered ceramic so as to pile up the fin plates in the direction of a length of the heat transfer tubes, each of the fin plates including a thin plate having a plurality of throughholes for fixing the heat transfer tubes inserted thereinto, and protrusions formed on both edge portions of the thin plate; firing the components so as to unitarily join them by the utilization of differences of firing shrinkage ratios among the heat transfer tubes, the tubular plates, and the fin plates; and removing the protrusions from the fin plates.