摘要:
Provided are a multiple-gate MOS (metal oxide semiconductor) transistor and a method of manufacturing the same. The transistor includes a single crystalline active region having a channel region having an upper portion of a streamlined shape (∩) obtained by patterning an upper portion of a bulk silicon substrate with an embossed pattern, and having a thicker and wider area than the channel region; a nitride layer formed at both side surfaces of the single crystalline active region to expose an upper portion of the single crystalline active region at a predetermined height; and a gate electrode formed to be overlaid with the exposed upper portion of the single crystalline active region of the channel region.
摘要:
Provided are a multiple-gate MOS (metal oxide semiconductor) transistor and a method of manufacturing the same. The transistor includes a single crystalline active region having a channel region having an upper portion of a streamlined shape (∩) obtained by patterning an upper portion of a bulk silicon substrate with an embossed pattern, and having a thicker and wider area than the channel region; a nitride layer formed at both side surfaces of the single crystalline active region to expose an upper portion of the single crystalline active region at a predetermined height; and a gate electrode formed to be overlaid with the exposed upper portion of the single crystalline active region of the channel region.
摘要:
Provided are a dual structure FinFET and a method of fabricating the same. The FinFET includes: a lower device including a lower silicon layer formed on a substrate and a gate electrode vertically formed on the substrate; an upper device including an upper silicon layer formed on the lower device and the vertically formed gate electrode; and a first solid source material layer, a solid source material interlayer insulating layer, and a second solid source material layer sequentially formed between the lower silicon layer and the upper silicon layer. Therefore, the FinFET can be provided which enhances the density of integration of a circuit, suppresses thin film damages due to ion implantation using solid phase material layers, and has a stabilized characteristic by a simple and low-cost process. Also, mobility of an upper device can be improved to enhance current drivability of the upper device, isolation can be implemented through a buried oxide layer to reduce an effect due to a field oxide layer, and raised source and drain can be implemented to reduce serial resistance components of the source and drain to increase current drivability.
摘要:
Provided are high voltage metal oxide semiconductor field effect transistor (HVMOSFET) having a Si/SiGe heterojunction structure and method of manufacturing the same. In this method, a substrate on which a Si layer, a relaxed SiGe epitaxial layer, a SiGe epitaxial layer, and a Si epitaxial layer are stacked or a substrate on which a Si layer having a well region, a SiGe epitaxial layer, and a Si epitaxial layer are stacked is formed. For the device having the heterojunction structure, the number of conduction carriers through a potential well and the mobility of the carriers increase to reduce an on resistance, thus increasing saturation current. Also, an intensity of vertical electric field decreases so that a breakdown voltage can be maintained at a very high level. Further, a reduction in vertical electric field due to the heterojunction structure leads to a gain in transconductance (Gm), with the results that a hot electron effect is inhibited and the reliability of the device is enhanced.
摘要:
A process for manufacturing a silicon on insulator (SOI) substrate is described. The process includes forming a buried oxidation layer in a first wafer and forming an oxidation layer on the first wafer. A buried hydrogen layer is formed in the first wafer deeper than the buried oxidation layer. A second wafer is bonded onto the first oxidation layer. The first wafer is removed below the buried hydrogen layer to expose the first wafer between the buried oxidation layer and the buried hydrogen layer. The exposed first wafer and the buried oxidation layer are sequentially removed to expose the first wafer between the buried oxidation layer and the first oxidation layer. Finally, a predetermined thickness of the first wafer exposed in the previous step is removed. Accordingly, a highly uniform and ultra thin SOI substrate is formed without employing a CMP process.
摘要:
Provided is a multiple-gate metal oxide semiconductor (MOS) transistor and a method for manufacturing the same, in which a channel is implemented in a streamline shape, an expansion region is implemented in a gradually increased form, and source and drain regions is implemented in an elevated structure by using a difference of a thermal oxidation rate depending on a crystal orientation of silicon and a geographical shape of the single-crystal silicon pattern. As the channel is formed in a streamline shape, it is possible to prevent the degradation of reliability due to concentration of an electric field and current driving capability by the gate voltage is improved because the upper portion and both sides of the channel are surrounded by the gate electrodes. In addition, a current crowding effect is prevented due to the expansion region increased in size and source and drain series resistance is reduced by elevated source and drain structures, thereby increasing the current driving capability.
摘要:
Provided is a multiple-gate metal oxide semiconductor (MOS) transistor and a method for manufacturing the same, in which a channel is implemented in a streamline shape, an expansion region is implemented in a gradually increased form, and source and drain regions is implemented in an elevated structure by using a difference of a thermal oxidation rate depending on a crystal orientation of silicon and a geographical shape of the single-crystal silicon pattern. As the channel is formed in a streamline shape, it is possible to prevent the degradation of reliability due to concentration of an electric field and current driving capability by the gate voltage is improved because the upper portion and both sides of the channel are surrounded by the gate electrodes. In addition, a current crowding effect is prevented due to the expansion region increased in size and source and drain series resistance is reduced by elevated source and drain structures, thereby increasing the current driving capability.
摘要:
Provided are a successive approximation register analog-to-digital converter and an operation method thereof. The method includes latching input signals which respectively correspond to bits of a first series of bits as digital data by directly transmitting the input signals to a latch; latching input signals which respectively correspond to bits of a second series of bits as digital data by transmitting the input signals to the latch after amplifying the input signals during a first period of amplification by using a preamplifier; and latching input signals which respectively correspond to bits of a third series of bits as digital data by transmitting the input signals to the latch after amplifying the input signals during a second period of amplification by using the preamplifier.
摘要:
An operational amplifier includes a differential amplifier portion for amplifying input signals and having an amplification path defined by plural series connected first switching devices extending between a supply and a ground, each of said first switching devices having a control input. The operational amplifier further includes an output portion for outputting signals amplified by the amplifier portion and having an output path defined by plural series connected switching devices extending between the supply and the ground, each of the switching devices having a control input and each respectively connected to the control input of said amplification portion. A resistance of the output path is less than a resistance of the amplification path such that a current flow through the amplification path is less than that of the output path. In this manner, power consumption is reduced.
摘要:
Disclosed is an analog-digital converter which includes a pre-amplifier configured to output a comparison result between a sampled analog input signal and a reference signal and to control a power supply operation in response to a power control signal; a digital signal processor configured to generate a digital signal based on the comparison result; a power controller configured to generate an amplifier operation clock signal for controlling the pre-amplifier; and a counter configured to count the number of falling edges of the amplifier operation clock signal and to detect a power interruption point of time of the pre-amplifier according to the counted falling edge number. The power controller generates the power control signal for interrupting a power to be supplied to the pre-amplifier when the power interruption point of time of the pre-amplifier is detected.