Abstract:
A method of determining a distance to an object is presented. A first photon and a second photon are simultaneously generated. The first photon is reflected off an object. The second photon is directed to an optical cavity. An arrival of the first photon is correlated with an arrival of the second photon, and the distance to the object is at least partially determined using the correlation.
Abstract:
A connector system is provided. The system includes a substantially circular interconnecting hub, and a plurality of circuit board bays configured substantially radially around the substantially circular interconnecting hub. Each circuit board bay has a plurality of aligned connectors configured to receive a circuit board. The interconnecting circuit hub has, for each individual circuit board bay, a direct data pathway connecting the individual circuit board bay to all remaining circuit board bays of the plurality of circuit board bays. Each of the plurality of circuit board bays can directly communicate through the interconnecting hub with each of the remaining circuit boards bays.
Abstract:
The invention comprises methods for filling holes in printed wiring boards and printed wiring boards produced by these methods. The methods involve plating metal conductors inside the holes of the printed wiring boards while protecting the conducting surfaces of the printed wiring boards from being plated using photoresist film. The side surfaces of a printed wiring board are covered with photoresist. The photoresist is exposed to developing light, except the photoresist covering the holes on one side of the board is masked to prevent exposure of the holes to the developing light. The undeveloped photoresist covering the holes is removed. The board is subjected to a plating process, which deposits conductive materials in the holes, but the photoresist on the conducting surfaces of the board prevents conductive materials to be plated on the surfaces of the board.
Abstract:
A method and apparatus for real-time in-line encryption of data transmitted over a serial channel from a source device to a target device. An encryption unit includes logic configured to receive data packets including headers with control information and data on the channel, which may be a fiber channel bus, serial ATA, serial SCSI, USB or the like. The encryption unit encrypts the data and passes the control information to the target device along with the encrypted data. The encryption unit may filter, convert or reject predetermined commands or types of information in the header to prevent covert channel transmissions. There may be one or multiple source devices, e.g. host computers, and one or multiple target devices, e.g. storage systems, configured in a variety of network topologies. The encryption unit also decrypts data and remaps control information transmitted from the target device(s) to the source device(s).
Abstract:
A telemetry system is described in which a plurality of channels are coupled to a bus. A control subsystem controls the channels so that one of the channels presents to the bus during its designated time period a channel characteristic. The control subsystem interrogates in the analog domain each of the channels during its designated time period, and forms a signal representative of the channel characteristic. The control subsystem may combine one or more of the signals into a digital packet, and transmit the same via transceiver over a wireless network. The channels may be contained within a submersible enclosure and displaced at intervals along the bus, thereby forming an array for monitoring waterborne threats. The array may lie along an ocean floor, may be towed by a marine vehicle, or may suspended from a deployable buoy containing the control subsystem, transceiver, and a remote power source. The array may further comprise a defensive countermeasure deployable responsive to detecting a threat.
Abstract:
A connector is provided. A plurality of parallel pins is mounted in a connector. A circuit board is connected to the connector. Some of the pins are configured to communicate signals from the circuit board and others of the pins are configured to communicate corresponding signal grounds from the circuit board. The pins are organized on the connector such that at least two out of every three of the pins that are configured to communicate signals do not have any neighboring aggressor pins.
Abstract:
A method of and architecture for controlling board elements in an orthogonal system architecture is provided. The method and architecture preferably utilize an internal bus architecture between control boards, such that a first control board can access board elements in its stack via I/O on a second control board and the second control board can access board elements in its stack via I/O on the first control board. Most preferably the internal bus architecture is a HyperTransport bus architecture.
Abstract:
A method of determining a distance to an object is presented. A first photon and a second photon are simultaneously generated. The first photon is reflected off an object. The second photon is directed to an optical cavity. An arrival of the first photon is correlated with an arrival of the second photon, and the distance to the object is at least partially determined using the correlation.
Abstract:
A connector is provided. A plurality of parallel pins is mounted in a connector. A circuit board is connected to the connector. Some of the pins are configured to communicate signals from the circuit board and others of the pins are configured to communicate corresponding signal grounds from the circuit board. The pins are organized on the connector such that at least two out of every three of the pins that are configured to communicate signals do not have any neighboring aggressor pins.
Abstract:
An embodiment of the invention generally pertains to a method of compensating for temperature variations in an eddy current sensor signal. The method may include the steps of receiving an initial signal from an eddy current sensor (ECS) in response to a conductive element passing the ECS and sensing an ECS temperature and an ECS board temperature. The method may also include determining a subset of correction coefficients based on the ECS temperature and the ECS board temperature and determining a temperature correction factor from the subset of correction coefficients. The method may then compute a temperature corrected signal from the initial signal and the temperature correction factor.