公开(公告)号：US08955983B2

公开(公告)日：2015-02-17

申请号：US13581006

申请日：2011-02-28

Applicant: Bradley E. Reis ,  Robert A. Reynolds, III ,  Yin Xiong ,  Greg P. Kramer ,  Robert J. Umpleby

Inventor： Bradley E. Reis ,  Robert A. Reynolds, III ,  Yin Xiong ,  Greg P. Kramer ,  Robert J. Umpleby

IPC: G03B21/16 ,  H05K7/20 ,  H01L23/34 ,  F21V29/00 ,  H05K1/02 ,  H04N9/31

CPC classification number: G03B21/16 ,  F21V29/00 ,  F21V29/85 ,  F21V29/86 ,  F21V29/89 ,  H04N9/31 ,  H04N9/3144 ,  H05K1/02 ,  H05K1/0201 ,  H05K1/0203 ,  H05K7/20445

Abstract: A handheld device (10), including a projector module (20) which includes a light source having a laser or at least one light emitting diode; a thermal management system which includes a heat collector (30) formed of a material having a thermo-mechanical design constant of at least 10 mm-W/m*K and having a non-planar shape, the heat collector in thermal contact with the light source; a heat spreader (40) having a surface area at least 1.5 times that of the surface area of the heat collector and a thermo-mechanical design constant of at least 10 mm-W/m*K, the heat spreader positioned in thermal contact with the heat collector, wherein thermo-mechanical design constant of a material is defined by thermal conductivity of the material multiplied by its average thickness.

Abstract translation: 一种手持式设备（10），包括投影仪模块（20），其包括具有激光或至少一个发光二极管的光源; 一种热管理系统，其包括由具有至少10mm-W / m×K的热机械设计常数且具有非平面形状的材料形成的集热器（30），所述集热器与所述热收集器 光源; 具有至少1.5倍于热收集器表面面积的表面积的散热器（40）和热机械设计常数至少为10mm-W / m×K，散热器定位成与 热收集器，其中材料的热机械设计常数由材料的热导率乘以其平均厚度限定。

公开(公告)号：US20140364742A1

公开(公告)日：2014-12-11

申请号：US14301741

申请日：2014-06-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Il CHO ,  Bae Hyung KIM ,  Young Il KIM ,  Jong Keun SONG ,  Seung Heun LEE

IPC: H05K7/20 ,  A61B8/00

CPC classification number: A61B8/4444 ,  A61B8/546 ,  H05K7/20445 ,  Y10T29/49005

Abstract: Disclosed herein is an ultrasonic probe capable of emitting heat generated by a transducer outside the ultrasonic probe using a heat radiation plate. The ultrasonic probe includes a transducer configured to generate an ultrasonic wave, a heat spreader provided on a surface of the transducer, the heat spreader being configured to absorb heat generated by the transducer, at least one heat radiation plate which contacts at least one side of the heat spreader, and at least one board installed on the at least one heat radiation plate so as to transfer heat generated by the at least one board to the at least one heat radiation plate.

Abstract translation: 这里公开了一种能够使用散热板在超声波探头外部发射由换能器产生的热量的超声波探头。 所述超声波探头包括构造成产生超声波的换能器，设置在所述换能器的表面上的散热器，所述散热器被配置为吸收由所述换能器产生的热量;至少一个热辐射板，其接触所述换能器的至少一侧 散热器和安装在至少一个散热板上的至少一个板，以将由至少一个板产生的热量传递到至少一个散热板。

公开(公告)号：US08902588B2

公开(公告)日：2014-12-02

申请号：US13514699

申请日：2010-12-02

Applicant: Darin Bradley Ritter ,  Mickey Jay Hunt ,  Mark William Gysin

Inventor： Darin Bradley Ritter ,  Mickey Jay Hunt ,  Mark William Gysin

IPC: H05K7/20

CPC classification number: H05K7/20445

Abstract: The set-top box includes an outer casing having micro-perforations, an interior bottom frame having a centrally located heatsink, a circuit board on the bottom frame and a louvered heatsinking element over the circuit board and in thermal contact with the heatsink.

Abstract translation: 机顶盒包括具有微穿孔的外壳，具有中心定位的散热器的内底框架，底框架上的电路板和位于电路板上并与散热片热接触的百叶窗散热元件。

公开(公告)号：US08891240B2

公开(公告)日：2014-11-18

申请号：US13222454

申请日：2011-08-31

Applicant: Choon Meng Chua ,  Lian Ser Koh ,  Sze Wei Choong ,  Jacob Chee Hong Phang

Inventor： Choon Meng Chua ,  Lian Ser Koh ,  Sze Wei Choong ,  Jacob Chee Hong Phang

IPC: H05K7/20 ,  H01L21/66 ,  H01L23/473 ,  G01N21/00

CPC classification number: H01L23/473 ,  F28F3/12 ,  G01N21/00 ,  H01L22/30 ,  H01L2924/0002 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/2039 ,  H05K7/20436 ,  H05K7/20445 ,  H05K7/20454 ,  H05K7/2049 ,  H01L2924/00

Abstract: An apparatus and method for cooling a semiconductor device. The apparatus comprises a chamber configured for receiving a cooling fluid; and a plurality of contact elements comprising respective first ends disposed within the chamber; wherein, during operation, respective second ends of contact elements contact a surface of the semiconductor device for transferring heat generated in the semiconductor device to the cooling fluid.

Abstract translation: 一种用于冷却半导体器件的设备和方法。 该装置包括：一个构造成容纳冷却流体的腔室; 以及多个接触元件，包括设置在所述腔室内的相应的第一端部; 其中，在操作期间，接触元件的相应第二端接触半导体器件的表面，用于将在半导体器件中产生的热传递到冷却流体。

公开(公告)号：US20140063746A1

公开(公告)日：2014-03-06

申请号：US13610891

申请日：2012-09-12

Applicant: TSUNG-MING CHEN ,  YAO-TING CHANG

Inventor： TSUNG-MING CHEN ,  YAO-TING CHANG

IPC: H05K7/20

CPC classification number: H01L23/36 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20445 ,  H01L2924/00

Abstract: An electronic device includes a sidewall, a circuit board arranged on the sidewall, an electronic component set on a side of the circuit board opposite to the sidewall, and a heat dissipation assembly connected between the sidewall and the circuit board.

Abstract translation: 电子设备包括侧壁，布置在侧壁上的电路板，设置在与侧壁相对的电路板侧的电子部件，以及连接在侧壁和电路板之间的散热组件。

公开(公告)号：US08654533B2

公开(公告)日：2014-02-18

申请号：US13368645

申请日：2012-02-08

Applicant: Mark Alan Schultz ,  Robert Warren Schmidt

Inventor： Mark Alan Schultz ,  Robert Warren Schmidt

IPC: H05K7/20

CPC classification number: H05K7/20445 ,  H01B7/428

Abstract: A power cord (14) for an electronic product (10) such as a set-top box or the like provides a reduced thermal resistance path from a heat generating portion of the set-top to the ambient air to improve heat dissipation. In a preferred embodiment, the power cord includes a ground wire having a size in excess of that necessary to carry ground current to as to increase heat conduction from the ground plane of the set-top box circuit board.

Abstract translation: 用于诸如机顶盒等的电子产品（10）的电源线（14）提供从机顶盒的发热部分到环境空气的减小的热阻路径，以改善散热。 在优选实施例中，电源线包括接地线，其尺寸超过承载接地电流所必需的尺寸，以增加从机顶盒电路板的接地平面的热传导。

公开(公告)号：US20140029202A1

公开(公告)日：2014-01-30

申请号：US13844421

申请日：2013-03-15

Applicant: ZHONGSHAN BROAD-OCEAN MOTOR MANUFACTURING CO., LTD.

Inventor： Wenqing BIAN ,  Chongsheng ZENG

IPC: H01L23/36

CPC classification number: H01L23/36 ,  H01L2924/0002 ,  H05K7/20445 ,  H05K7/209 ,  H01L2924/00

Abstract: A motor controller, including: a control box (1), the control box (1) including a bottom, the bottom including a plurality of first bosses (11); a control panel (2); a plurality of IGBT modules (3); and a heat dissipation boss (12), the heat dissipation boss (12) including an end surface. The control panel (2) is disposed and fixed on the first bosses (11) by screws. The IGBT modules (3) are disposed on the control panel (2). The heat dissipation boss (12) is disposed on the bottom of the control box (1) outside the control panel (2). The IGBT modules (3) are attached to and fixed on the end surface of the heat dissipation boss (12) by a locking device.

Abstract translation: 一种电动机控制器，包括：控制箱（1），所述控制箱（1）包括底部，所述底部包括多个第一凸台（11）; 控制面板（2）; 多个IGBT模块（3）; 和散热凸台（12），所述散热凸台（12）包括端面。 控制面板（2）通过螺钉设置并固定在第一凸台（11）上。 IGBT模块（3）设置在控制面板（2）上。 散热毂（12）在控制面板（2）的外侧设置在控制箱（1）的底部。 IGBT模块（3）通过锁定装置固定在散热用凸台（12）的端面上并固定。

公开(公告)号：US20130329372A1

公开(公告)日：2013-12-12

申请号：US13493803

申请日：2012-06-11

Applicant: Donald Frank Wilkins

Inventor： Donald Frank Wilkins

IPC: H05K7/16 ,  H05K13/00

CPC classification number: H05K7/20445 ,  H05K9/0047 ,  Y10T29/49002

Abstract: A chassis system includes a body, a lid, a cavity, a backplane, and an electrically conductive connector. The lid is removably attached to the body such that when the lid is attached to the body a cavity within the body is completely enclosed by the body and the attached lid. The lid and the body are made of at least one material that does not allow electromagnetic waves to enter the cavity. The backplane is attached to the body or the lid. The electrically conductive connector is attached to the body or lid. The connector is in wired or wireless communication with the backplane for allowing electricity or data to flow between the electrically conductive connector and the backplane. The chassis system may be used to environmentally protect one or more electronic modules inserted into the cavity of the chassis system.

Abstract translation: 底盘系统包括主体，盖，空腔，背板和导电连接器。 盖可移除地附接到主体，使得当盖被附接到主体时，主体内的空腔被主体和附接的盖完全包围。 盖和主体由至少一种不允许电磁波进入空腔的材料制成。 背板连接到主体或盖子上。 导电连接器连接到主体或盖子上。 连接器与背板进行有线或无线通信，以允许电或数据在导电连接器和背板之间流动。 底盘系统可以用于环境保护插入到底盘系统的空腔中的一个或多个电子模块。

公开(公告)号：US20130322022A1

公开(公告)日：2013-12-05

申请号：US13488412

申请日：2012-06-04

Applicant: Tung-Feng WU ,  Tze-Yun SUNG

Inventor： Tung-Feng WU ,  Tze-Yun SUNG

IPC: H05K7/20

CPC classification number: H05K7/20445

Abstract: The present disclosure provides a heat-dissipating apparatus for printed circuit board. The heat-dissipating apparatus adopts a ceramic device arranged between the printed circuit board and ground. Therefore, the apparatus can achieve the purpose of heat dissipation and save space of the printed circuit board and save cost of using a fan and cooling fins.

Abstract translation: 本公开提供了一种用于印刷电路板的散热装置。 散热装置采用布置在印刷电路板和地之间的陶瓷装置。 因此，该装置可以实现散热的目的，并且节省了印刷电路板的空间，并节省了使用风扇和散热片的成本。

公开(公告)号：US20130201629A1

公开(公告)日：2013-08-08

申请号：US13368645

申请日：2012-02-08

Applicant: Mark Alan Schultz ,  Robert Warren Schmidt

Inventor： Mark Alan Schultz ,  Robert Warren Schmidt

IPC: H05K7/20 ,  H01R13/652 ,  H01B7/42

CPC classification number: H05K7/20445 ,  H01B7/428

Abstract: A power cord (14) for an electronic product (10) such as a set-top box or the like provides a reduced thermal resistance path from a heat generating portion of the set-top to the ambient air to improve heat dissipation. In a preferred embodiment, the power cord includes a ground wire having a size in excess of that necessary to carry ground current to as to increase heat conduction from the ground plane of the set-top box circuit board.

Abstract translation: 用于诸如机顶盒等的电子产品（10）的电源线（14）提供从机顶盒的发热部分到环境空气的减小的热阻路径，以改善散热。 在优选实施例中，电源线包括接地线，其尺寸超过承载接地电流所必需的尺寸，以增加从机顶盒电路板的接地平面的热传导。