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公开(公告)号:US20240012142A1
公开(公告)日:2024-01-11
申请号:US18347784
申请日:2023-07-06
申请人: Ouster, Inc.
发明人: Angus Pacala , Mark Frichtl
IPC分类号: G01S17/08 , G01S17/89 , G01S7/497 , G01S7/481 , G01S17/10 , G01S7/4863 , B81B5/00 , G01S17/931 , G06V20/58 , H01L31/02 , G01S17/88 , G02B27/30 , H01L27/146 , G02B26/10
CPC分类号: G01S17/08 , G01S17/89 , G01S7/497 , G01S7/4817 , G01S17/10 , G01S7/4863 , G01S7/4815 , B81B5/00 , G01S17/931 , G06V20/58 , H01L31/02027 , G01S17/88 , G02B27/30 , H01L27/14643 , G02B26/10 , G02B3/0068
摘要: Embodiments describe a solid state electronic scanning LIDAR system that includes a scanning focal plane transmitting element and a scanning focal plane receiving element whose operations are synchronized so that the firing sequence of an emitter array in the transmitting element corresponds to a capturing sequence of a photosensor array in the receiving element. During operation, the emitter array can sequentially fire one or more light emitters into a scene and the reflected light can be received by a corresponding set of one or more photosensors through an aperture layer positioned in front of the photosensors. Each light emitter can correspond with an aperture in the aperture layer, and each aperture can correspond to a photosensor in the receiving element such that each light emitter corresponds with a specific photosensor in the receiving element.
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公开(公告)号:US11809136B2
公开(公告)日:2023-11-07
申请号:US16486747
申请日:2018-02-07
CPC分类号: G04B17/06 , G04B29/022 , G04B29/027 , G04D3/0069 , B81B3/00 , B81B5/00 , B81C1/00142
摘要: A micromechanical timepiece, and a method for making the same, having a plurality of mutually secured functional sub-assemblies stacked in a direction (Z) to form a multistage assembly, wherein each functional sub-assembly comprises a single semiconductor material and is secured to another sub-assembly via bridges made of the semiconductor material, and in that at least one sub-assembly comprises at least two portions, the portions being movable relative to each other and relative to another sub-assembly to which at least one of the portions is secured via at least one deformable link integrally formed between the portions.
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公开(公告)号:US20220171341A1
公开(公告)日:2022-06-02
申请号:US17672782
申请日:2022-02-16
摘要: A micro-electromechanical systems (MEMS) driving arrangement for an electronic device, the micro-electromechanical systems (MEMS) driving arrangement including a driven wheel; a driving actuation assembly for causing rotation of the driven wheel; an indicator assembly including an indicator; and a force absorbing assembly coupled intermediate the indicator assembly and the driven wheel; whereby a force acting upon the indicator assembly is absorbed by the force absorbing assembly so as to inhibit rotation of the driven wheel relative to the driving actuation assembly.
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公开(公告)号:US20210380402A1
公开(公告)日:2021-12-09
申请号:US17353305
申请日:2021-06-21
摘要: A MEMS system includes a first permanent-magnetic microstructure and a second permanent-magnetic microstructure. The first permanent-magnetic microstructure is movable along a first direction. The second permanent-magnetic microstructure is arranged to be spaced apart from the first permanent-magnetic microstructure, wherein, by moving the first permanent-magnetic microstructure along the first direction, the second permanent-magnetic microstructure or one or more elements of the second permanent-magnetic microstructure are either moved or actuated in a second direction or undergo rotation.
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公开(公告)号:US11186481B2
公开(公告)日:2021-11-30
申请号:US16179644
申请日:2018-11-02
发明人: Chen Hsiung Yang , Chun-Wen Cheng , Jiou-Kang Lee
摘要: A sensor device includes a microelectromechanical system (MEMS) force sensor, and a capacitive acceleration sensor. In the method of manufacturing the sensor device, a sensor portion of the MEMS force sensor is prepared over a front surface of a first substrate. The sensor portion includes a piezo-resistive element and a front electrode. A bottom electrode and a first electrode are formed on a back surface of the first substrate. A second substrate having an electrode pad and a second electrode to the bottom of the first substrate are attached such that the bottom electrode is connected to the electrode pad and the first electrode faces the second electrode with a space therebetween.
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公开(公告)号:US20210318434A1
公开(公告)日:2021-10-14
申请号:US17239410
申请日:2021-04-23
申请人: Ouster, Inc.
发明人: Angus PACALA , Mark FRICHTL
IPC分类号: G01S17/08 , G01S17/89 , G01S7/497 , G01S7/481 , G01S17/10 , G01S7/4863 , B81B5/00 , G01S17/931 , H01L31/02 , G01S17/88 , G02B27/30 , H01L27/146 , G02B26/10 , G06K9/00
摘要: Embodiments describe a solid state electronic scanning LIDAR system that includes a scanning focal plane transmitting element and a scanning focal plane receiving element whose operations are synchronized so that the firing sequence of an emitter array in the transmitting element corresponds to a capturing sequence of a photosensor array in the receiving element. During operation, the emitter array can sequentially fire one or more light emitters into a scene and the reflected light can be received by a corresponding set of one or more photosensors through an aperture layer positioned in front of the photosensors. Each light emitter can correspond with an aperture in the aperture layer, and each aperture can correspond to a photosensor in the receiving element such that each light emitter corresponds with a specific photosensor in the receiving element.
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公开(公告)号:US11078072B2
公开(公告)日:2021-08-03
申请号:US16861669
申请日:2020-04-29
发明人: Thoralf Kautzsch , Steffen Bieselt , Heiko Froehlich , Andre Roeth , Maik Stegemann , Mirko Vogt
摘要: A method for manufacturing a microelectromechanical systems (MEMS) device, includes forming a cavity in a bulk semiconductor substrate; defining a movably suspended mass in the bulk semiconductor substrate by one or more trenches extending from a main surface area of the bulk semiconductor substrate to the cavity; arranging a cap structure on the main surface area of the bulk semiconductor substrate; and forming a capacitive structure. Forming the capacitive structure includes arranging a first electrode structure on the movably suspended mass; and providing a second electrode structure at the cap structure such that the first electrode structure and the second electrode structure are spaced apart in a direction perpendicular to the main surface area of the bulk semiconductor substrate.
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公开(公告)号:US11016193B2
公开(公告)日:2021-05-25
申请号:US16028178
申请日:2018-07-05
申请人: Ouster, Inc.
发明人: Angus Pacala , Mark Frichtl
IPC分类号: G01S17/00 , G01S17/08 , G01S17/89 , G01S7/497 , G01S7/481 , G01S17/10 , G01S7/4863 , B81B5/00 , G01S17/931 , H01L31/02 , G01S17/88 , G02B27/30 , H01L27/146 , G02B26/10 , G06K9/00 , G02B3/00 , G02B26/08 , H01L25/16 , H01S5/183 , H01S5/40
摘要: Embodiments describe a solid state electronic scanning LIDAR system that includes a scanning focal plane transmitting element and a scanning focal plane receiving element whose operations are synchronized so that the firing sequence of an emitter array in the transmitting element corresponds to a capturing sequence of a photosensor array in the receiving element. During operation, the emitter array can sequentially fire one or more light emitters into a scene and the reflected light can be received by a corresponding set of one or more photosensors through an aperture layer positioned in front of the photosensors. Each light emitter can correspond with an aperture in the aperture layer, and each aperture can correspond to a photosensor in the receiving element such that each light emitter corresponds with a specific photosensor in the receiving element.
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公开(公告)号:US10996237B2
公开(公告)日:2021-05-04
申请号:US16115629
申请日:2018-08-29
发明人: Satoru Tanaka
IPC分类号: G01P15/08 , G01P15/125 , B81B5/00 , G01C19/5628 , B81B3/00
摘要: A physical quantity sensor includes a movable flat plate having a plurality of openings passing therethrough that is swingable around an axis of rotation, a support substrate linked to the flat plate via a column to suspend the movable flat plate over the support substrate via a gap, and a protrusion protruding toward the movable element. In a plan view, the openings are excluded from a D/2-width annular range surrounding the outer circumference of the protrusion, where D is the maximum outer diametrical dimension of the protrusion.
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公开(公告)号:US10732196B2
公开(公告)日:2020-08-04
申请号:US15828304
申请日:2017-11-30
申请人: InvenSense, Inc.
IPC分类号: G01P15/08 , B81B7/02 , G01P15/125 , B81B5/00
摘要: A microelectromechanical (MEMS) accelerometer senses linear acceleration perpendicular to a MEMS device plane of the MEMS accelerometer based on a rotation of a proof mass out-of-plane about a rotational axis. A symmetry axis is perpendicular to the rotational axis. The proof mass includes a symmetric portion that is symmetric about the symmetry axis and that is contiguous with an asymmetric portion that is asymmetric about the symmetry axis.
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