公开(公告)号：US2049935A

公开(公告)日：1936-08-04

申请号：US74938334

申请日：1934-10-22

申请人： WOODWARD FRANK E

发明人： WOODWARD FRANK E

IPC分类号： B24B7/10

CPC分类号： B24B7/10

公开(公告)号：US1688212A

公开(公告)日：1928-10-16

申请号：US1137725

申请日：1925-02-24

申请人： DERVORT ADRIAN O VAN

发明人： DERVORT ADRIAN O VAN

IPC分类号： B24B7/10

CPC分类号： B24B7/10 ,  Y10T29/44

公开(公告)号：US12108922B2

公开(公告)日：2024-10-08

申请号：US18433696

申请日：2024-02-06

申请人： Dennis Matrunola ,  Michael Matrunola

发明人： Dennis Matrunola ,  Michael Matrunola

IPC分类号： A47L7/00 ,  B24B7/06 ,  B24B7/10 ,  B24B27/00 ,  B24B39/06 ,  B24B41/06 ,  B24B55/04 ,  B24B55/06 ,  B24B9/10 ,  B24B41/053

CPC分类号： A47L7/0095 ,  B24B7/06 ,  B24B7/10 ,  B24B27/0069 ,  B24B27/0076 ,  B24B39/065 ,  B24B41/068 ,  B24B55/04 ,  B24B55/06 ,  B24B9/10 ,  B24B27/0023 ,  B24B41/053

摘要： A machine for processing a screen printing frame includes an upstream end and an opposed downstream end, a grinding assembly located between the upstream and downstream locations, wherein the grinding assembly includes a first grinder configured to grind a first pattern into the screen printing frame and a second grinder configured to grind a second pattern into the screen printing frame different from the first grinding pattern.

公开(公告)号：US10766081B2

公开(公告)日：2020-09-08

申请号：US15979282

申请日：2018-05-14

申请人： URBAN Machinery Corporation

发明人： Thomas Urban

IPC分类号： B23C3/12 ,  B23C1/10 ,  B23C1/12 ,  B23P23/02 ,  B25J11/00 ,  B24B27/04 ,  B25J15/00 ,  B24B7/10 ,  B23D45/00 ,  B23Q39/02

摘要： The invention relates to a finishing device for removing the weld bead generated during welding of a window or door frame or frame section at the mitered surfaces, wherein the finishing device comprises a support surface for the frame or frame section and a processing arm for supporting a tool holder, and the processing arm consists of a plurality of arm elements that move in hinged fashion relative to one another but can also be fixed in place, wherein the tool holder comprises at least two cutting tools driven by a rotational drive, said tools rotating about a tool axis and at least one tool laterally next to the blade of the tool, contact sides.

公开(公告)号：US20190193229A1

公开(公告)日：2019-06-27

申请号：US16288753

申请日：2019-02-28

申请人： THE BOEING COMPANY

发明人： Daniel L. Toberman ,  David L. Fritsche ,  Michael R. Miller ,  Robert M. Wolf

IPC分类号： B24B7/10 ,  B64F5/40

CPC分类号： B24B7/10 ,  B64F5/40

摘要： A material removal device for removing material from a substrate includes a holder extending between first and second sides and a grinding wheel supported by the holder and being operable to remove the material from the substrate. The holder has a guide frame at the first side and a support frame at the second side. The guide frame has a first bottom surface and the support frame has a second bottom surface. The first and second bottom surfaces are vertically offset from each other. The grinding wheel has an axle supported by the guide frame and the support frame. The grinding wheel has a grinding surface located below the first bottom surface and above the second bottom surface.

公开(公告)号：US10322488B2

公开(公告)日：2019-06-18

申请号：US15305645

申请日：2015-02-03

申请人： XEBEC TECHNOLOGY CO., LTD. ,  TAIMEI CHEMICALS CO., LTD.

发明人： Hiroyuki Okada ,  Suguru Matsushita

IPC分类号： B24B5/40 ,  B24B29/00 ,  B24D13/14 ,  B24B23/08 ,  B24D13/20 ,  B24B7/10

摘要： A rotating tool includes a tool body including a polishing tool and a shank, and a flange part provided in the tool body. The polishing tool includes a plurality of linear grinding members and a grinding member holder to hold the linear grinding members. The flange part is an annular member, and attached to the grinding member holder, so as to be movable in the direction of an axial line and rotatable about the axial line. When the inner circumferential surface of a hole formed in a workpiece is processed, the grinding member holder and the annular member are inserted into the hole. When run-out on the front side of the rotating tool occurs, the annular member comes into contact with the peripheral wall surface of the hole, whereby the run-out of the tool body is reduced.

公开(公告)号：US20130273717A1

公开(公告)日：2013-10-17

申请号：US13448648

申请日：2012-04-17

申请人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Bor-Ping Jang ,  Hsin-Hung Liao ,  Lin-Wei Wang ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Bor-Ping Jang ,  Hsin-Hung Liao ,  Lin-Wei Wang ,  Chung-Shi Liu

IPC分类号： H01L21/78 ,  B24B7/10 ,  B23K26/38 ,  B26D7/01

CPC分类号： B28D5/00 ,  B23K26/02 ,  B23K26/083 ,  B28D5/029 ,  H01L21/67092 ,  Y10T83/748

摘要： The present disclosure is directed to an apparatus for the singulation of a semiconductor substrate or wafer. In some embodiments the singulation apparatus comprises a plurality of cutting devices. The cutting devices are configured to form multiple concurrent cutting lines in parallel on a surface of the semiconductor wafer. In some embodiments, the singulation apparatus comprises at least two dicing saws or laser modules. The disclosed singulation apparatus can dice the semiconductor wafer into individual chips by dicing in a direction across a complete circumferential edge of the wafer, thereby decreasing process time and increasing throughput.

摘要翻译： 本公开涉及一种用于单个半导体衬底或晶片的装置。 在一些实施例中，分割装置包括多个切割装置。 切割装置被配置为在半导体晶片的表面上并行地形成多个并行切割线。 在一些实施例中，分割装置包括至少两个切割锯或激光模块。 所公开的分割装置可以通过在晶片的整个圆周边缘上的切割方式将半导体晶片切割成单独的芯片，从而减少处理时间并增加产量。

公开(公告)号：US20120258650A1

公开(公告)日：2012-10-11

申请号：US13402570

申请日：2012-02-22

申请人： Karl Robert HOFMANN

发明人： Karl Robert HOFMANN

IPC分类号： B24B7/10 ,  B24B41/06

CPC分类号： B24B7/005 ,  B22D11/12 ,  B22D11/1265 ,  B24B27/033 ,  B24B27/04

摘要： An apparatus for grinding a continuously cast slab having a longitudinal axis and a rectangular cross-sectional shape with two opposite wide faces and two opposite narrow faces apparatus has a frame, two transversely spaced grinders carried on the frame, and a holder having two transversely spaced grippers engageable with the opposite faces of the slab in a vertical position with the wide faces of the slab vertical for grinding of the wide faces of the slab by the grinders and in a horizontal position offset by 90° to the vertical position with the wide faces of the slab horizontal for grinding of the narrow faces of the slab.

摘要翻译： 用于研磨具有两个相对的宽面和两个相对的窄面装置的具有纵向轴线和矩形横截面形状的连续铸造板坯的装置具有框架，承载在框架上的两个横向间隔开的研磨机和具有两个横向间隔开的保持器 夹具可与板坯的相对面垂直接合，其中板的宽面垂直，用于通过研磨机研磨板坯的宽面，并在与垂直位置偏移90°的水平位置处与宽面 的板坯水平，用于研磨板坯的窄面。

公开(公告)号：US20110165823A1

公开(公告)日：2011-07-07

申请号：US12748109

申请日：2010-03-26

申请人： Satoru IDE ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

发明人： Satoru IDE ,  Moriyuki Kashiwa ,  Kazuo Kobayashi ,  Noriyuki Motimaru ,  Eiichi Yamamoto ,  Tomio Kubo ,  Hiroaki Kida

IPC分类号： B24B1/00 ,  B24B41/00 ,  B24B7/10

CPC分类号： B24B37/00

摘要： A planarization apparatus and method that thins and planarizes a substrate by grinding and polishing the rear surface of the substrate with high throughput, and that fabricates a semiconductor substrate with reduced adhered contaminants. A planarization apparatus that houses various mechanism elements in semiconductor substrate loading/unloading stage chamber, a rear-surface polishing stage chamber, and a rear-surface grinding stage chamber. The throughput time of the rear-surface polishing stage that simultaneously polishes two substrates is typically about double the throughput time of the rear-surface grinding stage that grinds one substrate.

摘要翻译： 一种平面化装置和方法，其通过以高生产量研磨和抛光衬底的后表面来使衬底平坦化，并且制造具有减少的附着污染物的半导体衬底。 一种在半导体衬底装载/放电室中容纳各种机构元件的平面化装置，后表面抛光台室和后表面研磨台室。 同时抛光两个基材的后表面抛光阶段的生产时间通常是研磨一个基板的后表面研磨阶段的生产时间的两倍。

公开(公告)号：US20110053473A1

公开(公告)日：2011-03-03

申请号：US12990703

申请日：2009-04-20

申请人： Tore Eklund

发明人： Tore Eklund

IPC分类号： B24B7/10

CPC分类号： B24B3/546 ,  B24D15/081

摘要： A grinding apparatus includes at least two oppositely arranged series of surfaces in slanting relative orientation and alternately overlapping each other, forming this way a groove into which an edge or cutting edge is insertable for polishing by the surfaces. The surfaces of each series of surfaces are arranged in a common plane forming a side in a respective block, the blocks arranged in a holder by which each block is spring biased towards the opposite block, the blocks operated in reciprocating movement transversely to the longitudinal direction of the edge/cutting edge while the surfaces contact opposite sides of the edge/cutting edge under spring action. A grinding block utilized in the grinding apparatus includes a series of individual surfaces arranged in a common plane forming one side of a block divided into sections, which are separated through intermediate recesses into which corresponding sections of an oppositely positioned block intermesh in a toothed engagement while forming a groove between the surfaces.

摘要翻译： 研磨装置包括至少两个相对布置的倾斜相对取向的表面，并且彼此交替重叠，从而形成一个凹槽，边缘或切割边缘可插入该凹槽中，用于通过表面抛光。 每个系列表面的表面被布置在共同的平面中，在相应的块中形成一侧，所述块布置在保持器中，每个块通过该保持器弹簧偏置朝向相对的块，所述块在横向于纵向的往复运动中操作 的边缘/切割边缘，同时表面在弹簧作用下接触边缘/切割边缘的相对侧。 在研磨装置中使用的研磨块包括布置在公共平面中的一系列单独的表面，其形成分为多个区段的块的一侧，该区段通过中间凹槽分开，相对定位的块的相应部分相互啮合成相互啮合， 在表面之间形成凹槽。