摘要:
An integrated device for grinding and polishing a diamond and a method thereof are provided. The integrated device for grinding and polishing the diamond comprises a base device and a grinding and polishing device, the base device comprises a base configured rotate around a Z-axis, the base comprises a fixture configured to clamp the diamond, the grinding and polishing device comprises a shaft disposed along the Z-axis, the outer polishing wheel surrounds the inner grinding wheel, the shaft drives the inner grinding wheel and the outer polishing wheel to rotate together, an upper and lower position relationship between the inner grinding wheel and the outer polishing wheel along the Z-axis is configured to be adjusted, and the diamond on the fixture is ground and polished by rotations of the inner grinding wheel and the outer polishing wheel, feeding, and a rotation of the base.
摘要:
A machine for working glass slabs includes a supporting structure, a slab grinding section having grinding heads, a conveyor assembly adapted to move the glass slab, and a slab drilling section having a conveyor adjacent to the conveyor assembly. The slab grinding section has suckers for keeping the glass slab next to a working plane spaced and/or offset with respect to the advancement plane, and a computerized numeric control assembly to perform workings on the glass slab.
摘要:
An apparatus for chemical-mechanical polishing is provided, including: a plurality of polishing sections spaced apart from one another, each polishing section including: a bracket, a carrier head and a platen, the carrier head being disposed on the bracket and configured to move between a polishing position and a conveying position, in which when the carrier head is located at the polishing position, the carrier head is located above the platen; and a conveying assembly, the conveying assembly including: a rotating plate and a plurality of loading and unloading tables, the plurality of loading and unloading tables being spaced apart from one another, disposed on the rotating plate and configured to rotate along with the rotating plate, in which when the carrier head is located at the conveying position, the carrier head is corresponding to one of the plurality of loading and unloading tables.
摘要:
A method for producing one or more bearing components along a production line, comprising honing the bearing components along the production line, cleaning the bearing components along the production line, grinding the bearing components along the production line, and transporting the bearing components along the production line utilizing one or more transport units.
摘要:
A system and a method for processing of optical lenses in which the processing takes place using different processing apparatus between which there is a respective transfer apparatus. The transfer apparatus are used both for longitudinal and also cross conveyance. Each processing apparatus has its own conveyor apparatus which is controlled by the processing apparatus itself. The transfer apparatus are controlled by a central transfer control.
摘要:
A double-disc straight groove cylindrical-component surface grinding disc, includes a first grinding disc and a second grinding disc, rotating relative to each other; the the first grinding disc's working face is planar; the second grinding disc's surface, opposite the first grinding disc, includes a set of radial straight grooves, with groove faces of the straight grooves are the working face of the second grinding disc; the cross-sectional outline of the working face of the second grinding disc is arcuate or V-shaped or is a V-shape having an arc; during grinding, a workpiece spins inside the straight grooves, while under the effect of an advancing apparatus, the workpiece slides in translational motion along the straight grooves. The described grinding disc device has high-volume production capabilities, and the shape accuracy and size consistency of the cylindrical roller's cylindrical surface and the efficiency in machining are improved, and machining cost is reduced.
摘要:
A grinding machine includes a base with a U-shaped frame on the base. The U-shaped frame has two extensions and each have a first hole and a second hole which is an oval hole. A grinding roller is connected to the frame. An adjustment device includes a first shaft and a second shaft. The first shaft extends through a portion of the base and the two respective first holes of the extensions. The second shaft extends through the second holes of the two extensions. An eccentric sleeve and an adjustment member are located in the second hole of one of the extensions, and each have an eccentric hole. The adjustment member is mounted to the eccentric sleeve. The second shaft extends through the two eccentric holes. When rotating the adjustment member and the eccentric sleeve, the frame and the grinding roller are pivoted about the first shaft.
摘要:
A grinding machine for bearing rings, the machine includes a frame, a rotating grinding wheel movable in rotation around a first rotation axis, and a working station where a bearing ring stands during a grinding operation of one of its surfaces. The grinding machine also includes a holding subsystem for holding a bearing ring in the working station and transfer subsystem for transferring bearing rings to and from the working station. The transfer subsystem includes at least a multi-axis robot and a ring moving arm provided with a gripping subsystem for temporarily gripping a bearing ring, the ring moving arm being rotatable around a second rotation axis, parallel to the first rotation axis, and movable in translation along the second rotation axis.
摘要:
A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to the polishing section or the cleaning section to which the test mode is set.
摘要:
A method for deburring a ground metal part includes loading a ground metal part into a carrier, contacting a first planar surface of the ground metal part with a first grinding wheel, and contacting a second planar surface of the ground metal part with a second grinding wheel. The first grinding wheel is rotated in a first rotational direction. The second grinding wheel is rotated also in the first rotational direction. After the first grinding wheel is rotated in the first rotational direction, the first grinding wheel is then rotated in a second rotational direction, which is opposite to the first rotational direction. After the second grinding wheel is rotated in the first rotational direction, the second grinding wheel is also rotated in the second rotational direction.