公开(公告)号：US10730073B2

公开(公告)日：2020-08-04

申请号：US15691292

申请日：2017-08-30

Applicant: STMicroelectronics S.r.l.

Inventor： Davide Ugo Ghisu ,  Sandro Rossi ,  Andrea Gambero

IPC: H04B1/02 ,  B06B1/02 ,  G01S15/89 ,  G01S7/524 ,  G01S7/52 ,  B06B1/06

Abstract: A circuit for an ultrasonic channel has a first and a second terminal between which extend a resistive and diode signal paths including a pair of diodes with opposing polarities, for example in anti-parallel. Switching circuitry is coupled with the resistive and diode signal paths and is switchable between first and second states. In the first state, the first and the second terminals are coupled with one another via the resistive signal path. In the second state, the first and the second terminals are coupled with one another via the diode signal path. The switching circuitry includes first and second transistor discharge circuits coupled between first and second drive lines and current paths of these transistors, and coupled to control terminals of these transistors. The control terminals are coupled to the first or second drive line and are non-conductive and conductive in first and second operating states, respectively.

公开(公告)号：US20200243496A1

公开(公告)日：2020-07-30

申请号：US16773711

申请日：2020-01-27

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Davide Giuseppe PATTI ,  Mario Antonio ALEO

IPC: H01L25/16 ,  H01L21/762 ,  H01L21/763 ,  H01L25/00

Abstract: A semiconductor die includes a structural body that has a power region and a peripheral region surrounding the power region. At least one power device is positioned in the power region. Trench-insulation means extend in the structural body starting from the front side towards the back side along a first direction, adapted to hinder conduction of heat from the power region towards the peripheral region along a second direction orthogonal to the first direction. The trench-insulation means have an extension, in the second direction, greater than the thickness of the structural body along the first direction.

公开(公告)号：US10727734B2

公开(公告)日：2020-07-28

申请号：US15916697

申请日：2018-03-09

Applicant: STMicroelectronics S.r.l.

Inventor： Giovanni Gritti

IPC: H02M1/42 ,  H02M3/156 ,  H02M1/00

Abstract: A control unit for a switching converter has an inductor element coupled to an input and a switch element coupled to the inductor element and generates a command signal having a switching period to switch the switch element and determine a first time period in which an inductor current is flowing in the inductor element for storing energy and a second time period in which energy is transferred to a load. An input current is distorted relative to a sinusoid by a distortion factor caused by current ripple on the inductor current. The duration of the first time period is determined based on a comparison between a peak value of the inductor current and a current reference that is a function of an output voltage of said voltage converter. A reference modification stage modifies one of the current reference and sensed value of the inductor current to compensate for distortion introduced by the distortion factor on the input current.

公开(公告)号：US10720840B2

公开(公告)日：2020-07-21

申请号：US16222557

申请日：2018-12-17

Applicant: STMicroelectronics Design and Application s.r.o. ,  STMicroelectronics S.r.l.

Inventor： Matthieu Thomas ,  Michele Suraci ,  Massimo Mazzucco

IPC: H02M3/158 ,  H02M1/08 ,  H02M1/00

Abstract: A DC-DC converter circuit including at least: a first step down converter having a first pair of switching devices in a half bridge configuration. A second step down converter includes a second pair of switching devices in a half bridge configuration. The first and second step down converters are connected in parallel to an output node connected to an output coil and receive command signals. A feedback loop includes a synchronization module receiving the gate control signals of high side switching devices and adjusts as a function of the gate control signals a delay in a signal path from the command signal to each gate control signal of the high side switching device to synchronize the gate control signals.

公开(公告)号：US20200221968A1

公开(公告)日：2020-07-16

申请号：US16734264

申请日：2020-01-03

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alessandro GUMIERO ,  Marco PASSONI ,  Luigi DELLA TORRE ,  Stefano ROSSI

IPC: A61B5/0408

Abstract: A wearable sensing device includes a connector socket provided with contact pads connectable to sensing electrodes for sensing biological electrical signals. A supply module is provided with a battery, which is housed in a first casing configured for reversible coupling with the connector socket. A control module is housed in a second casing distinct from the first casing and configured for coupling with the supply module and with the connector socket. The control module is equipped with a processing unit configured to process biological electrical signals detectable through the contact pads. Mechanical-connection members couple the supply module to the connector socket. Electrical-connection members distinct from the mechanical-connection members are configured to connect the battery and the contact pads to the control module.

公开(公告)号：US10715143B1

公开(公告)日：2020-07-14

申请号：US16271474

申请日：2019-02-08

Applicant: STMicroelectronics S.r.l.

Inventor： Agatino Antonino Alessandro ,  Carmelo Ardizzone

IPC: H03K19/003 ,  H03K19/007

Abstract: Disclosed herein is a circuit including first and second input circuits. The first input circuit is configured to receive first and second logic signals and to source current to first and second control nodes if at least one of the first and second logic signals is at a logic low. The second input circuit is configured to receive the first and second logic signals and to sink current from the first and second control nodes if at least one of the first and second logic signals is at a logic high. A first output circuit is configured to source current to an output node when current is sunk from the first control node. A second output circuit is configured to sink current from the output node when current is sourced to the second control node. A latch is coupled to the output node.

公开(公告)号：US20200221234A1

公开(公告)日：2020-07-09

申请号：US16813477

申请日：2020-03-09

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fabrizio CERINI ,  Silvia ADORNO ,  Federico VERCESI

IPC: H04R17/02 ,  B81B3/00 ,  B81C1/00 ,  H01L41/113

Abstract: A piezoelectric MEMS transducer formed in a body of semiconductor material, which has a central axis and a peripheral area and comprises a plurality of beams, transverse to the central axis and having a first end, coupled to the peripheral area of the body, and a second end, facing the central axis; a membrane, transverse to the central axis and arranged underneath the plurality of beams; and a pillar, parallel to the central axis and rigid with the second end of the beams and to the membrane. The MEMS transducer further comprises a plurality of piezoelectric sensing elements arranged on the plurality of beams.

公开(公告)号：US20200220444A1

公开(公告)日：2020-07-09

申请号：US16239211

申请日：2019-01-03

Applicant: STMicroelectronics S.r.l.

Inventor： Lucio Renna

IPC: H02K41/03 ,  H02K11/33 ,  H02K15/02 ,  B25J9/10

Abstract: An artificial muscle fiber includes an external fiber and an internal fiber. The external fiber includes a first linear array of actuators having protrusions directed in a first direction. The internal fiber includes a second linear array of actuators having protrusions directed in a second direction opposite to the first direction. Protrusions of the first linear array of actuators and protrusions of the second linear array of actuators are separated by a non-zero gap, and each actuator of the first linear array of actuators and the second linear array of actuators includes a soft magnetic material.

公开(公告)号：US20200219799A1

公开(公告)日：2020-07-09

申请号：US16824429

申请日：2020-03-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Cristina SOMMA

IPC: H01L23/495 ,  H01L23/498

Abstract: One or more embodiments are directed to semiconductor packages and methods in which one or more electrical components are positioned between a semiconductor die and a surface of a substrate. In one embodiment, a semiconductor package includes a substrate having a first surface. One or more electrical components are electrically coupled to electrical contacts on the first surface of the substrate. A semiconductor die is positioned on the one or more electrical components, and the semiconductor die has an active surface that faces away from the substrate. An adhesive layer is on the first surface of the substrate and on the one or more electrical components, and the semiconductor die is spaced apart from the one or more electrical components by the adhesive layer. Wire bonds are provided that electrically couples the active surface of the semiconductor die to the substrate.

公开(公告)号：US10700220B2

公开(公告)日：2020-06-30

申请号：US16228483

申请日：2018-12-20

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Massimo Cataldo Mazzillo ,  Piero Fallica ,  Salvatore Lombardo

IPC: H01L31/107 ,  H01L31/0216 ,  H01L27/146 ,  G01J1/44 ,  H01L27/144 ,  H01L31/02

Abstract: An array of Geiger-mode avalanche photodiodes is formed in a die and includes: an internal dielectric structure, arranged on the die; and an external dielectric region arranged on the internal dielectric structure. The external dielectric region is formed by an external material that absorbs radiation having a wavelength that falls in a stop-band with low wavelength and transmits radiation having a wavelength that falls in a pass-band with high wavelength, at least part of the pass-band including wavelengths in the infrared. The internal dielectric structure is formed by one or more internal materials that substantially transmit radiation having a wavelength that falls in the stop-band and in the pass-band and have refractive indices that fall in an interval having an amplitude of 0.4. In the stop-band and in the pass-band the external dielectric region has a refractive index with the real part that falls in the above interval.