Single photon avalanche gate sensor device

    公开(公告)号:US10861997B2

    公开(公告)日:2020-12-08

    申请号:US16222542

    申请日:2018-12-17

    Inventor: Francois Roy

    Abstract: A semiconductor substrate doped with a first doping type is positioned adjacent an insulated gate electrode that is biased by a gate voltage. A first region within the semiconductor substrate is doped with the first doping type and biased with a bias voltage. A second region within the semiconductor substrate is doped with a second doping type that is opposite the first doping type. Voltage application produces an electrostatic field within the semiconductor substrate causing the formation of a fully depleted region within the semiconductor substrate. The fully depleted region responds to absorption of a photon with an avalanche multiplication that produces charges that are collected at the first and second regions.

    IMAGE SENSOR AND METHOD FOR CONTROLLING SAME
    523.
    发明申请

    公开(公告)号:US20200382738A1

    公开(公告)日:2020-12-03

    申请号:US16890877

    申请日:2020-06-02

    Abstract: An image sensor includes pixels each including: a first transistor and a first switch that are connected in series between a first node configured to receive a first potential and an internal node of the pixel, a gate of the first transistor being coupled with a floating diffusion node of the pixel; a capacitive element, a first terminal of which is connected to the floating diffusion node of the pixel; and several assemblies each including a capacitance connected in series with a second switch coupling the capacitance to the internal node. The sensor also includes a control circuit configured to control, each time a voltage is stored in one of the assemblies of a pixel, an increase of a determined value of a difference in potential between the floating diffusion node and the internal node of the pixel.

    INTERCONNECTION ELEMENT AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20200381297A1

    公开(公告)日:2020-12-03

    申请号:US16881689

    申请日:2020-05-22

    Inventor: Magali GREGOIRE

    Abstract: An interconnection element of an interconnection structure of an integrated circuit is manufactures by a method where a cavity is etched in an insulating layer. A silicon nitride layer is then deposited on walls and a bottom of the cavity. The nitrogen atom concentration in the silicon nitride layer increasing as a distance from an exposed surface of the silicon nitride layer increases. A copper layer is deposited on the silicon nitride layer. The cavity is further filled with copper. A heating process is performed after the deposition of the copper layer, to convert the copper layer and the silicon nitride layer to form a copper silicide layer which has a nitrogen atom concentration gradient corresponding to the gradient of the silicon nitride layer.

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