公开(公告)号：US20200303348A1

公开(公告)日：2020-09-24

申请号：US16818792

申请日：2020-03-13

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Didier CAMPOS

IPC: H01L25/065 ,  H01L23/31 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00

Abstract: The disclosure concerns an electronic device and methods of making an electronic device. The electronic device includes a circuit that is at least partially formed in an active region of a substrate. An electronic package is stacked on the substrate. A via extends through the circuit from the active region of the substrate to a surface of the substrate that is opposite the active region. At least one contacting element connects the via to the electronic package.

公开(公告)号：US10784858B2

公开(公告)日：2020-09-22

申请号：US16249065

申请日：2019-01-16

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics S.r.l.

Inventor： Sergio Lecce ,  Gilles Troussel

IPC: H03K17/687 ,  H03K19/0185 ,  H03K17/10 ,  H03K17/0814 ,  G05F3/26 ,  G06F13/20 ,  H04L12/40

Abstract: A driver circuit includes a supply node, a control node configured to receive a control signal, and an output node. An output transistor is coupled to the output node to provide the CAN bus drive signal via the current path through the output transistor. A current mirror is in a current line from the supply node to the output node through the output transistor. The current line includes an intermediate portion between the current mirror and the output transistor. The current mirror is configured to be switched, as a function of the control signal between a first, dominant mode, with the CAN bus drive signal applied to the output node via the output transistor, and a second, recessive mode, with the output transistor providing a high output impedance at the output node.

公开(公告)号：US20200256925A1

公开(公告)日：2020-08-13

申请号：US16787358

申请日：2020-02-11

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean CAMIOLO

IPC: G01R31/40 ,  G06F13/42 ,  G06F1/26

Abstract: An apparatus is adapted to test a power supply device of the USB-PD type which includes at least one USB Type-C connector. The USB Type-C connector is intended to be connected to the power supply device to be tested. The device is separate from the apparatus.

公开(公告)号：US10742145B2

公开(公告)日：2020-08-11

申请号：US16281604

申请日：2019-02-21

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Rousset) SAS

Inventor： Gwenael Maillet ,  Jean-Louis Labyre ,  Gilles Bas

IPC: H02P7/29 ,  H02P7/00 ,  G05B19/042 ,  G06K19/07 ,  H02P7/03 ,  G06K19/00

Abstract: Control over the operation of an electrically-controlled motor is supported by an interface circuit between the electrically-controlled motor and a near-field radio frequency communication controller. The interface circuit includes a first circuit that receives at least one control set point through a near-field radio frequency communication issued by the near-field radio frequency communication controller. A second circuit of the interface generates one or more electric signals in pulse width modulation based on the control set point.

公开(公告)号：US20200233081A1

公开(公告)日：2020-07-23

申请号：US16741401

申请日：2020-01-13

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Pascal Mellot

IPC: G01S17/04 ,  H01L31/02 ,  H01L31/107 ,  G01S7/4863 ,  G01S7/4865 ,  G01S17/10

Abstract: The present disclosure relates to a proximity detection device. The proximity detection device includes one or more photodetectors and a readout circuit configured to sample one or more output signals from the one or more photodetectors at regular intervals throughout a detection period. The proximity detection device includes a pulse transmission circuit configured to transmit into the scene a first optical pulse having a first pulse duration and a second optical pulse having a second pulse duration that is at least 50 percent longer than the first pulse duration.

公开(公告)号：US20200220462A1

公开(公告)日：2020-07-09

申请号：US16819721

申请日：2020-03-16

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： David Chesneau ,  Francois Amiard

IPC: H02M3/158 ,  H02M3/155 ,  H02M1/08

Abstract: A method includes switching a switching circuit of the switched-mode power supply in a synchronous mode by turning on and off switches of the switching circuit in synchrony with a clock signal, wherein the switching circuit is coupled to an inductive element, and wherein the synchronous mode comprises a charging phase and a discharging phase; switching the switching circuit in an asynchronous mode by turning on and off switches of the switching circuit without being synchronized with the clock signal, wherein the asynchronous mode comprises a charging phase and a discharging phase; charging the inductive element during the charging phase of the synchronous mode; discharging the inductive element during the discharging phase of the synchronous mode; charging the inductive element during the charging phase of the asynchronous mode; and discharging the inductive element during the discharging phase of the asynchronous mode.

公开(公告)号：US10651101B2

公开(公告)日：2020-05-12

申请号：US15978439

申请日：2018-05-14

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Marika Sorrieul

IPC: H01L23/055 ,  H01L23/00 ,  H01L33/48 ,  H01L31/0203 ,  H01L23/04 ,  G01S17/02 ,  H01L23/10 ,  G01S7/481 ,  H01L31/16 ,  H01L25/16

Abstract: A support plate has a front face with an electronic chip mounted on the front face. A cover for encapsulating the electronic chip includes a front wall extending in front of the electronic chip and a peripheral wall having an end edge fixed on a peripheral area of the support plate. The support plate and the encapsulating cover define a chamber in which the electronic chip is located. A local slot is arranged to extend between the peripheral wall of the encapsulating cover and the support plate. The local slot has an exterior opening and an interior opening leading into said chamber.

公开(公告)号：US10600704B2

公开(公告)日：2020-03-24

申请号：US16133065

申请日：2018-09-17

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics (Malta) Ltd

Inventor： Jerome Lopez ,  Roseanne Duca

IPC: H01L23/495 ,  H01L23/10 ,  H01L23/31 ,  H01L21/50 ,  H01L23/498

Abstract: A support substrate has a face above which at least one electronic component is fixed. A peripheral area of the face includes an annular local metal layer. An encapsulating cover for the electronic component includes a peripheral wall having an end edge that is mounted above the peripheral area. The annular metal local layer includes, at the periphery thereof, a series of spaced-apart teeth with notches formed therebetween. The teeth extend as far as the peripheral edge of the support substrate.

公开(公告)号：US20200075436A1

公开(公告)日：2020-03-05

申请号：US16551241

申请日：2019-08-26

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Olivier Franiatte ,  Richard Rembert

IPC: H01L23/04 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538

Abstract: A cover for an integrated circuit package includes a central plate and a peripheral frame surrounding the central plate. The peripheral frame is vertically spaced from and parallel to the central plate. The peripheral frame includes through openings formed therein. The cover can be used to package a semiconductor chip that is mounted to a substrate.

公开(公告)号：US20200072446A1

公开(公告)日：2020-03-05

申请号：US16552419

申请日：2019-08-27

Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Romain COFFY ,  Jean-Michel RIVIERE

IPC: F21V17/10 ,  F21V23/00 ,  F21V17/06 ,  F21V17/08 ,  F21V3/04

Abstract: The present disclosure relates to a light-emitting device comprising: a light source mounted on a substrate; a wire for providing a supply voltage or activation signal to the light source, a cap covering the light source and having a diffuser adapted to diffuse light generated by the light source; and either: a volume of glue fixing an intermediate section of the wire to the cap; or an arm fixed to the cap and extending between the intermediate section of the wire and the substrate.