公开(公告)号：US20190310103A1

公开(公告)日：2019-10-10

申请号：US16433874

申请日：2019-06-06

Applicant: STMicroelectronics S.r.l.

Inventor： Stefano Paolo Rivolta ,  Andrea Labombarda ,  Alberto Zancanato

IPC: G01C22/00

Abstract: An activity tracking device, such as a step-counting device includes an interface configured to receive one or more acceleration signals and signal processing circuitry. The signal processing circuitry generates an indication of condition of an accelerometer, such as a body position of the accelerometer, based on one or more accelerometer signals, generates an event signal, such as an event flag, based on one or more accelerometer signals and the indication of the condition of the accelerometer, and generates an activity signal, such as step flag based on the event signal, the indication of the condition of the accelerometer and one or more acceleration signals. The signal processing circuitry may generate a noise signal based on one or more acceleration signals and generate the activity signal based on the noise signal.

公开(公告)号：US10439569B2

公开(公告)日：2019-10-08

申请号：US15984942

申请日：2018-05-21

Applicant: STMicroelectronics S.r.l.

Inventor： Stefano Ramorini ,  Alberto Cattani ,  Germano Nicollini ,  Alessandro Gasparini

IPC: H03F3/21 ,  H03F3/217 ,  H03F3/45 ,  G01R1/30 ,  G01R19/00

Abstract: A switching amplifier, such as a Class D amplifier, includes a current sensing circuit. The current sensing circuit is formed by replica loop circuits that are selectively coupled to corresponding output inverter stages of the switching amplifier. The replica loop circuits operated to produce respective replica currents of the output currents generated by the output inverter stages. A sensing circuitry is coupled to receive the replica currents from the replica loop circuits and operates to produce an output sensing signal as a function of the respective replica currents.

公开(公告)号：US20190305775A1

公开(公告)日：2019-10-03

申请号：US16371919

申请日：2019-04-01

Applicant: STMicroelectronics S.r.l.

Inventor： Alessandro PARISI ,  Nunzio GRECO ,  Nunzio SPINA ,  Egidio RAGONESE ,  Giuseppe PALMISANO

IPC: H03K17/722 ,  H03B5/06

Abstract: An oscillator is coupled to a first side of a galvanic barrier for supplying thereto an electric supply signal. The oscillator is configured to be alternatively turned on and off as a function of a PWM drive signal applied thereto. A receiver circuit coupled to the galvanic barrier receives therefrom a PWM power control signal. A signal reconstruction circuit coupled between the receiver circuit block and the oscillator provides to the oscillator a PWM drive signal reconstructed from the PWM power control signal. The signal reconstruction circuit includes a PLL circuit coupled to the receiver circuit block and configured to lock to the PWM control signal from the receiver circuit block. A PLL loop within the PLL circuit is sensitive to the PWM drive signal applied to the oscillator. The PLL loop is configured to be opened as a result of the power supply oscillator being turned off.

公开(公告)号：US20190296004A1

公开(公告)日：2019-09-26

申请号：US16353658

申请日：2019-03-14

Applicant: STMicroelectronics (Tours) SAS ,  STMicroelectronics S.r.l.

Inventor： Aurelie Arnaud ,  Andrea Brischetto

IPC: H01L27/02 ,  H01L29/861 ,  H01L29/16 ,  H02H9/04

Abstract: An ESD protection circuit includes a terminal connected to the cathode of a first diode and to the anode of a second diode, where the cathode of the second diode is not made of epitaxial silicon.

公开(公告)号：US20190295934A1

公开(公告)日：2019-09-26

申请号：US15934783

申请日：2018-03-23

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Paolo CREMA

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48

Abstract: The present disclosure is directed to a leadframe package with a surface mounted semiconductor die coupled to leads of the leadframe package through wire bonding. The leads are partially exposed outside the package and configured to couple to another structure, like a printed circuit board (PCB). The exposed portions, namely outer segments, of the leads include a plating or coating layer of a material that enhances the solder wettability of the leads to the PCB through solder bonding. The enclosed portions, namely inner segments, of the leads do not include the plating layer of the outer segment and, thus, include a different surface material or surface finish.

公开(公告)号：US20190292045A1

公开(公告)日：2019-09-26

申请号：US16442199

申请日：2019-06-14

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani ,  Alessandro Motta

IPC: B81C1/00 ,  G01L9/00 ,  B81B3/00 ,  B81B7/00

Abstract: A method for making an integrated micro-electromechanical device includes forming a first body of semiconductor material having a first face and a second face opposite the first face. The first body includes a buried cavity forming a diaphragm delimited between the buried cavity and the first face. The diaphragm is monolithic with the first body. The method further includes forming at least one first magnetic via extending between the second face and the buried cavity of the first body, forming a first magnetic region extending over the first face of the first body, and forming a first coil extending over the second face of the first body and being magnetically coupled to the first magnetic via.

公开(公告)号：US10422968B2

公开(公告)日：2019-09-24

申请号：US15985860

申请日：2018-05-22

Applicant: STMicroelectronics S.r.l.

Inventor： Antonio Fincato ,  Luca Maggi

IPC: G02B6/42 ,  H01L23/58 ,  G02B6/30 ,  G02B6/28 ,  G02B6/12

Abstract: A semiconductor chip provides an optical medium for light propagation. The semiconductor chip includes a chip surface with an outer perimeter and a cavity in the chip surface. The cavity includes a peripheral wall and a bottom surface surrounded by the peripheral wall, the bottom surface adiabatically couplable to an optical waveguide. The cavity is located at an area of the chip surface spaced from the outer perimeter thereof.

公开(公告)号：US20190287880A1

公开(公告)日：2019-09-19

申请号：US15925420

申请日：2018-03-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Cristina SOMMA ,  Fulvio Vittorio FONTANA

IPC: H01L23/495

Abstract: One or more embodiments are directed to quad flat no-lead (QFN) semiconductor packages, devices, and methods in which one or more electrical components are positioned between a die pad of a QFN leadframe and a semiconductor die. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and at least one electrical component that has a first contact on the die pad and a second contact on the lead. A semiconductor die is positioned on the at least one electrical component and is spaced apart from the die pad by the at least one electrical component. The device further includes at least one conductive wire, or wire bond, that electrically couples the at least one lead to the semiconductor die.

公开(公告)号：US10416142B2

公开(公告)日：2019-09-17

申请号：US15782626

申请日：2017-10-12

Applicant: STMicroelectronics S.R.L.

Inventor： Massimo Cataldo Mazzillo ,  Antonella Sciuto

IPC: H01L31/103 ,  H01L31/101 ,  H01L31/0232 ,  H01L31/02 ,  H01L27/144 ,  G01N33/00 ,  G01N27/414 ,  G01N21/84 ,  G01N21/33 ,  G01N21/31 ,  G01N21/25

Abstract: An optoelectronic device for detecting volatile organic compounds is described, including a die with a semiconductor body, the die forming a MOSFET transistor and at least one photodiode. The optoelectronic device is optically couplable to an optical source that emits radiation with a spectrum at least partially overlapping the absorption spectrum range of the semiconductor body. The MOSFET transistor is planar and includes a gate region and a catalytic region that is arranged on the gate region such that, in the presence of a gas mixture including volatile organic compounds, the MOSFET transistor can be biased to generate an electrical signal indicating the overall concentration of the gas mixture. The photodiode generates a photocurrent that is a function of the concentration of one or more polycyclic aromatic hydrocarbons present in the gas mixture.

公开(公告)号：US20190280635A1

公开(公告)日：2019-09-12

申请号：US16294573

申请日：2019-03-06

Applicant: STMicroelectronics S.r.l.

Inventor： Giuseppe D'Angelo

IPC: H02P27/08 ,  H02M7/5387 ,  H02P6/08

Abstract: A half-bridge driver circuit is configured to generate drive signals based on control signals. A processing circuit is configured to generate high side and low side control signals based on a control signal. An edge detector is configured to generate first and second signals in response to rising and falling edges in the control signal. A state machine transitions between states in response to the first and second signals, and is configured to sequentially, in response to the first signal, set the high side and low side control signals low; in response to the second signal, set the high side control signal high and the low side control signal low; in response to the first signal, set the high side and low side control signals low; and in response to the second signal, set the high side control signal low and the low side control signal high.