公开(公告)号：US11270894B2

公开(公告)日：2022-03-08

申请号：US15876046

申请日：2018-01-19

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Godfrey Dimayuga

IPC: H01L21/48 ,  H05K3/32 ,  H01L23/498 ,  H05K3/28 ,  G01P15/08 ,  H05K3/34 ,  H01L23/31

Abstract: One or more embodiments are directed to methods of forming one or more cantilever pads for semiconductor packages. In one embodiment a recess is formed in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.

公开(公告)号：US11250224B2

公开(公告)日：2022-02-15

申请号：US17108646

申请日：2020-12-01

Applicant: STMicroelectronics, Inc.

Inventor： John N. Tran

IPC: G06K7/10 ,  G06K19/07

Abstract: A method includes providing a power supply package (PSP) that includes a power supply, an RFID tag, and a power switch, where a control terminal of the power switch is coupled to an output terminal of the RFID tag, and load path terminals of the power switch are coupled between an output terminal of the PSP and a first terminal of the power supply, where a control register of the RFID tag is pre-programmed with a first value such that the RFID tag is configured to generate a first control signal that turns off the power switch; receiving, by the RFID tag, a second value for the control register of the RFID tag; and writing, by the RFID tag, the second value to the control register of the RFID tag such that the RFID tag is configured to generate a second control signal that turns on the power switch.

公开(公告)号：US20210409914A1

公开(公告)日：2021-12-30

申请号：US17356180

申请日：2021-06-23

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS S.r.l.

Inventor： Karimuddin SAYED ,  Chandandeep Singh PABLA ,  Lorenzo BRACCO ,  Federico RIZZARDINI

IPC: H04W4/38 ,  H04W4/70 ,  G01D9/00 ,  G01D5/244

Abstract: In an embodiment, a device comprises a memory, which, in operation, stores data samples associated with a plurality of data sensors, and circuitry, coupled to the memory, wherein the circuitry, in operation, generates synchronized output data sets associated with the plurality of data sensors. Generating a synchronized output data set includes: determining a reference sample associated with a sensor of the plurality of sensors; verifying a timing validity of a data sample associated with another sensor of the plurality of sensors; identifying a closest-in-time data sample associated with the another sensor of the plurality of sensors with respect to the reference sample; and generating the synchronized output data set based on interpolation.

公开(公告)号：US20210313255A1

公开(公告)日：2021-10-07

申请号：US17353684

申请日：2021-06-21

Applicant: STMICROELECTRONICS, INC.

Inventor： Ian Harvey ARELLANO ,  Aaron CADAG ,  Ela Mia CADAG

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: The present disclosure is directed to leadless semiconductor packages with improved wettable flanks that encourage the formation of solder fillets when the leadless semiconductor package is mounted to a substrate. The solder fillets are consistently formed and are easily detectable by inspection systems, such as automated optical inspection (AOI) systems.

公开(公告)号：US11140750B2

公开(公告)日：2021-10-05

申请号：US16233926

申请日：2018-12-27

Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTD ,  STMICROELECTRONICS, INC.

Inventor： Fuchao Wang ,  Olivier Leneel ,  Ravi Shankar

IPC: H05B3/00 ,  H05B1/02 ,  H05B3/34 ,  H05B3/12 ,  H01L23/34 ,  H05B3/02 ,  H05B3/06

Abstract: An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.

公开(公告)号：US11096593B2

公开(公告)日：2021-08-24

申请号：US16783569

申请日：2020-02-06

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics International N.V.

Inventor： Mahesh Chowdhary ,  Arun Kumar ,  Ghanapriya Singh ,  Rajendar Bahl

IPC: A61B5/0205 ,  A63B69/00 ,  A61B5/00 ,  A61B5/024 ,  A61B5/11 ,  G16H40/63 ,  A61B5/0245 ,  A61B5/22 ,  G16H50/20

Abstract: Motion activity data is collected from at least one sensor. An initial motion activity classifier function is applied to the motion activity data to produce an initial motion activity posteriorgram. Pre-processing and segmenting the motion activity data into windows produces segmented motion activity data from which sensor specific features are extracted. An updated motion activity classifier function is generated from the extracted sensor specific features. Subsequent motion activity data is also collected from the at least one sensor, and the updated motion activity classifier function is applied to the subsequent motion activity data to produce an updated motion activity posteriorgram.

公开(公告)号：US11093197B2

公开(公告)日：2021-08-17

申请号：US16045269

申请日：2018-07-25

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics International N.V.

Inventor： Benedetto Vigna ,  Mahesh Chowdhary ,  Matteo Dameno

IPC: G06F3/14 ,  G01P1/07

Abstract: A method includes receiving, at a master agent, announcements from candidate consumer agents indicating the presence of the candidate consumer agents. Each announcement includes display parameters for a display of the corresponding candidate consumer agent. The method further includes receiving at the master agent content parameters from a producer agent, the content parameters defining characteristics of content to be provided by the consumer agent. A mosaic screen is configured based on the received announcements and the content parameters. This configuring of the mosaic screen includes selecting ones of the consumer agents for which an announcement was received and generating content distribution parameters based on the content parameters and the display parameters of the selected ones of the consumer agents. The generated content distribution parameters are provided to the consumer agent.

公开(公告)号：US11085769B2

公开(公告)日：2021-08-10

申请号：US16243876

申请日：2019-01-09

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS, INC. ,  STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Carlo Valzasina ,  Huantong Zhang ,  Matteo Fabio Brunetto ,  Gert Ingvar Andersson ,  Erik Daniel Svensson ,  Nils Einar Hedenstierna

IPC: G01C19/5776 ,  G01C19/5719 ,  G01C19/574 ,  G01C19/5747

Abstract: A gyroscope includes a substrate, a first structure, a second structure and a third structure elastically coupled to the substrate and movable along a first axis. The first and second structure are arranged at opposite sides of the third structure with respect to the first axis A driving system is configured to oscillate the first and second structure along the first axis in phase with one another and in phase opposition with the third structure. The first, second and third structure are provided with respective sets of sensing electrodes, configured to be displaced along a second axis perpendicular to the first axis in response to rotations of the substrate about a third axis perpendicular to the first axis and to the second axis.

公开(公告)号：US11069682B2

公开(公告)日：2021-07-20

申请号：US16751036

申请日：2020-01-23

Applicant: STMICROELECTRONICS, INC.

Inventor： Qing Liu ,  Prasanna Khare ,  Nicolas Loubet

IPC: H01L27/088 ,  H01L21/84 ,  H01L29/66 ,  H01L29/78 ,  H01L29/08 ,  H01L21/265 ,  H01L29/417 ,  H01L21/8238 ,  H01L21/225 ,  H01L21/8234

Abstract: A multi-fin FINFET device may include a substrate and a plurality of semiconductor fins extending upwardly from the substrate and being spaced apart along the substrate. Each semiconductor fin may have opposing first and second ends and a medial portion therebetween, and outermost fins of the plurality of semiconductor fins may comprise an epitaxial growth barrier on outside surfaces thereof. The FINFET may further include at least one gate overlying the medial portions of the semiconductor fins, a plurality of raised epitaxial semiconductor source regions between the semiconductor fins adjacent the first ends thereof, and a plurality of raised epitaxial semiconductor drain regions between the semiconductor fins adjacent the second ends thereof.

公开(公告)号：US11063112B2

公开(公告)日：2021-07-13

申请号：US16164481

申请日：2018-10-18

Applicant: STMicroelectronics, Inc.

Inventor： John H. Zhang

IPC: H01L27/108 ,  H01L21/02 ,  H01L21/28 ,  H01L49/02 ,  H01L27/11507

Abstract: An interconnect structure for use in coupling transistors in an integrated circuit is disclosed, including various configurations in which ferroelectric capacitors exhibiting negative capacitance are coupled in series with dielectric capacitors. In one embodiment, the negative capacitor includes a dielectric/ferroelectric bi-layer. When a negative capacitor is electrically coupled in series with a conventional dielectric capacitor, the series combination behaves like a stable ferroelectric capacitor for which the overall capacitance can be measured experimentally, and tuned to a desired value. The composite capacitance of a dielectric capacitor and a ferroelectric capacitor having negative capacitance coupled in series is, in theory, infinite, and in practice, very large. A series combination of positive and negative capacitors within a microelectronic interconnect structure can be used to make high capacity DRAM memory cells.