公开(公告)号：US07973266B2

公开(公告)日：2011-07-05

申请号：US11938876

申请日：2007-11-13

申请人： Toshihiro Nakajima ,  Jun Watanabe

发明人： Toshihiro Nakajima ,  Jun Watanabe

IPC分类号： H05B3/06 ,  A21B2/00

CPC分类号： H05B3/0047 ,  H01L21/67115

摘要： In a heat treatment apparatus, a reflector is provided to cover a plurality of flash lamps arranged in an array for emitting a flash of light, and a cooling box is provided over the reflector. The cooling box has a buffer space incorporated therein, and a plurality of jet openings in communication with the buffer space are formed through a bottom surface of the cooling box and the reflector. The plurality of jet openings are positioned just over gaps between the plurality of flash lamps in the lamp array. Nitrogen gas ejected from the plurality of jet openings passes through the gaps between adjacent ones of the flash lamps in the lamp array, and is then blown against a lamp light radiation window. The flash lamps are effectively cooled down by the direct cooling using the nitrogen gas and the decrease in temperature of the lamp light radiation window.

摘要翻译： 在热处理设备中，设置反射器以覆盖排列成阵列的多个闪光灯，以发射闪光，并且在反射器上设置冷却箱。 冷却箱内装有缓冲空间，并且通过冷却箱和反射器的底面形成与缓冲空间连通的多个喷射开口。 多个喷射开口恰好位于灯阵列中的多个闪光灯之间的间隙之上。 从多个喷射开口排出的氮气通过灯阵列中相邻的闪光灯之间的间隙，然后吹向灯光辐射窗。 通过使用氮气的直接冷却和灯光辐射窗的温度降低，闪光灯被有效地冷却。

公开(公告)号：US07959820B2

公开(公告)日：2011-06-14

申请号：US11548855

申请日：2006-10-12

申请人： Akio Hashizume

发明人： Akio Hashizume

IPC分类号： C03C15/00

CPC分类号： H01L21/67051 ,  H01L21/6708

摘要： According to the substrate processing method of the invention, a jet of droplets generated from a gas and a heated processing liquid is supplied to the surface of a substrate. A resist stripping liquid to strip off the resist from the surface of the substrate is then supplied to the surface of the substrate.

摘要翻译： 根据本发明的基板处理方法，将从气体和加热处理液体产生的液滴射流供给到基板的表面。 然后将从基板表面剥离抗蚀剂的抗蚀剂剥离液供给到基板的表面。

公开(公告)号：US07958899B2

公开(公告)日：2011-06-14

申请号：US12195521

申请日：2008-08-21

申请人： Takayoshi Tanaka ,  Masahiro Miyagi

发明人： Takayoshi Tanaka ,  Masahiro Miyagi

IPC分类号： B08B3/02

CPC分类号： B08B3/12 ,  H01L21/67051 ,  Y10S134/902

摘要： At a vibration applying position, ultrasonic vibration is applied upon a liquid film which is on a surface of a substrate. Concurrently with this, at a drop arrival position which is different from the vibration applying position, drops of a cleaning liquid are supplied to the liquid film, whereby wave-generating vibration which is different from the ultrasonic vibration is applied upon the liquid film. This dramatically improves removal of particles adhering to the surface of the substrate as compared with mere application of ultrasonic vibration. Hence, even when the output, the frequency and the like of the ultrasonic vibration are set to such an extent not damaging the substrate, it is possible to effectively remove particles with the wave-generating vibration and favorably clean the surface of the substrate.

摘要翻译： 在振动施加位置，对基板表面上的液膜施加超声波振动。 与此同时，在与振动施加位置不同的下落到达位置时，向液膜供给清洗液滴，由此在液膜上施加与超声波振动不同的波浪产生振动。 与仅施加超声波振动相比，这显着地改善了附着在基板表面上的颗粒的去除。 因此，即使将超声波振动的输出，频率等设定为不损害基板的程度，也可以有效地去除产生振动的微粒，有利地清洗基板的表面。

公开(公告)号：US07938129B2

公开(公告)日：2011-05-10

申请号：US11672284

申请日：2007-02-07

申请人： Toshio Hiroe ,  Hiroaki Uchida

发明人： Toshio Hiroe ,  Hiroaki Uchida

IPC分类号： B08B3/00

CPC分类号： H01L21/67051 ,  H01L21/67017 ,  Y10S134/902

摘要： A substrate processing apparatus of the present invention is to apply processing using a processing liquid to a substrate. The substrate processing apparatus includes a first-side plate disposed oppositely to a first surface of the substrate with a distance and provided with plural discharge ports and suction ports in a surface opposing the first surface, a first-side processing liquid supply mechanism that supplies a processing liquid to the discharge ports in the first-side plate, and a first-side suction mechanism that sucks insides of the suction ports in the first-side plate.

摘要翻译： 本发明的基板处理装置是使用处理液对基板进行处理。 基板处理装置包括与基板的第一表面相对设置的与第一表面相对的多个排出口和吸入口相对设置的第一侧板，第一侧处理液供给机构， 处理液体到第一侧板中的排出口，以及第一侧抽吸机构，其吸入第一侧板中的吸入口的内部。

公开(公告)号：US07883635B2

公开(公告)日：2011-02-08

申请号：US12401697

申请日：2009-03-11

申请人： Hiroaki Takahashi

发明人： Hiroaki Takahashi

IPC分类号： C03C15/00

CPC分类号： H01L21/67057 ,  H01L21/67086 ,  H01L21/67253

摘要： A substrate treating apparatus for treating substrates with a treating solution having a mixture of a chemical and a diluent. The apparatus includes a treating tank for storing the treating solution, a heating device for heating the treating solution, a supply pipe for supplying a gas at a fixed flow rate, the supply pipe having a detecting end at a predetermined depth in the treating tank, a pressure detecting device for detecting a pressure in the supply pipe, a converting device for converting the pressure detected by the pressure detecting device into a voltage, a storage device for storing, as a reference voltage, a voltage received from the converting device when a reference liquid at a reference temperature is stored in the treating tank, and a computing device for deriving an actual specific gravity of the treating solution from the reference voltage stored in the storage device, and a treatment voltage received from the converting device when the treating solution stored in the treating tank has been heated to a treating temperature by the heating device.

摘要翻译： 一种用具有化学品和稀释剂的混合物的处理溶液处理基材的基底处理装置。 该设备包括用于储存处理溶液的处理槽，用于加热处理溶液的加热装置，用于以固定流量供应气体的供应管，所述供应管具有处于处理槽中的预定深度的检测端， 用于检测供应管中的压力的​​压力检测装置，用于将由压力检测装置检测的压力转换为电压的转换装置，用于存储从转换装置接收的电压作为参考电压的存储装置，当a 将参考温度的参考液体存储在处理槽中，以及计算装置，用于根据存储在存储装置中的参考电压导出处理溶液的实际比重，以及从处理溶液接收的处理电压 储存在处理槽中的加热装置已经被加热到处理温度。

公开(公告)号：US20100285225A1

公开(公告)日：2010-11-11

申请号：US12842485

申请日：2010-07-23

申请人： Koji Kaneyama ,  Kazuhito Shigemori ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Shuichi Yasuda

发明人： Koji Kaneyama ,  Kazuhito Shigemori ,  Masashi Kanaoka ,  Tadashi Miyagi ,  Shuichi Yasuda

IPC分类号： B05D3/04

CPC分类号： H01L21/67051 ,  H01L21/67225

摘要： A substrate processing apparatus comprises an interface block. An exposure device is arranged adjacent to the interface block. The interface block includes first and second cleaning/drying processing units. A substrate W is subjected to cleaning and drying processing before exposure processing in the first cleaning/drying processing unit, while being subjected to cleaning and drying processing after the exposure processing in the second cleaning/drying processing unit.

摘要翻译： 基板处理装置包括接口块。 曝光装置设置在接口块附近。 界面块包括第一和第二清洁/干燥处理单元。 在第二清洗/干燥处理单元中进行曝光处理之后进行清洗和干燥处理之后，在第一清洗/干燥处理单元中对基板W进行曝光处理之前的清洗和干燥处理。

公开(公告)号：US07821672B2

公开(公告)日：2010-10-26

申请号：US11902562

申请日：2007-09-24

申请人： Hiroshi Asai

发明人： Hiroshi Asai

IPC分类号： G06K15/00

CPC分类号： H04N1/4055 ,  H04N1/52

摘要： In a printer, threshold matrixes are prepared so that, in a color halftone image generated with the threshold matrixes, cell centers are arranged randomly, a direction where intervals of cell centers for cyan are maximum and a direction where intervals of cell centers for magenta are maximum are different, and the both directions are tilted relatively to a column direction corresponding to a scan direction of a head. A check pattern is recorded with the threshold matrix for each color component by the head, print densities in positions in a width direction of the check pattern, which corresponds to an arrangement direction of outlets in the head, are measured to acquire modification coefficients and then pixel values of an original image are modified by using the modification coefficients. This makes it possible to print a color halftone image with less graininess, without causing a beat pattern and streak unevenness.

摘要翻译： 在打印机中，准备阈值矩阵，使得在用阈值矩阵生成的彩色半色调图像中，将小区中心随机排列，青色的小区中心间隔最大的方向以及品红色的小区中心间隔的方向为 最大值不同，并且两个方向相对于与头部的扫描方向对应的列方向倾斜。 通过头部对每个颜色分量的阈值矩阵记录检查图案，测量与检查图案的宽度方向上的位置的打印密度相对应的头部的出口的布置方向以获取修改系数，然后 通过使用修改系数修改原始图像的像素值。 这使得可以打印具有较少颗粒度的彩色半色调图像，而不会引起拍子图案和条纹不均匀。

公开(公告)号：US20100245444A1

公开(公告)日：2010-09-30

申请号：US12727028

申请日：2010-03-18

申请人： Hiroshi ASAI

发明人： Hiroshi ASAI

IPC分类号： B41J2/205

CPC分类号： B41J2/2128 ,  B41J2/2054 ,  H04N1/40087 ,  H04N1/6072

摘要： The low and high occupancy rate matrix sets are stored in the inkjet printer which performs printing with dots having different sizes. For the original image where banding unevenness easily appears, used is the low occupancy rate matrix set where the occupancy rate of all dots is lower than 100% in the maximum value of gray level and the proportion of the large dots is high in a high range of gray level. For the original image where reproducibility of details is required, used is the high occupancy rate matrix set where the occupancy rate of all dots becomes 100% in a value of gray level lower than the maximum value of gray level and the proportion of the small dots is high in a middle range of gray level. It is therefore possible to perform appropriate printing in accordance with the classification of the original image.

摘要翻译： 低和高占用率矩阵组存储在执行具有不同大小的点的打印的喷墨打印机中。 对于容易出现条纹不均匀的原始图像，使用低占空比矩阵集，其中所有点的占用率在灰度级的最大值中低于100％，并且大点的比例在高范围内高 的灰度级。 对于需要细节再现性的原始图像，使用高占用率矩阵集合，其中所有点的占用率在灰度值低于灰度级的最大值和小点的比例的情况下变为100％ 在中等范围的灰度级高。 因此，可以根据原始图像的分类来执行适当的打印。

公开(公告)号：US07801633B2

公开(公告)日：2010-09-21

申请号：US12170042

申请日：2008-07-09

申请人： Masahiro Yamamoto ,  Daigo Yamada

发明人： Masahiro Yamamoto ,  Daigo Yamada

IPC分类号： G06F19/00

CPC分类号： G05B19/41865 ,  G05B2219/32097 ,  G05B2219/32265 ,  G05B2219/32266 ,  G05B2219/45031 ,  Y02P90/20

摘要： A scheduling method for a substrate treating apparatus having a plurality of treating units for treating substrates, wherein, based on a procedure including a plurality of treating steps, a controller determines an order of treating a plurality of lots successively in the treating units. The method includes a step of preparing a plurality of schedules through execution of a basic allocating method, based on a systematic chart representing combinations of the treating steps for the respective lots, for allocating a first treating step of one of the lots, and thereafter, while following the systematic chart from the treating step, for searching and allocating as a next treating step a treating step selected from among succeeding treating steps in the lots, whose preceding treating step has an earliest expected completion time of all preceding treating steps; and a first allocating method for allocating treating steps based on the basic allocating method, and when a waiting time occurring with one of the treating steps exceeds an allowed time for enabling a standby at one of the treating units, for avoiding allocation of the one of the treating steps and restarting a search at one branching point before a branching point upstream of the one of said treating steps. The method further includes a step of selecting one schedule having been completed within a specified time, from the plurality of schedules prepared.

摘要翻译： 一种用于具有多个用于处理基板的处理单元的基板处理装置的调度方法，其中，基于包括多个处理步骤的过程，控制器确定处理单元中连续处理多个批次的顺序。 该方法包括：基于表示各批次的处理步骤的组合的系统图，通过执行基本分配方法来准备多个时间表的步骤，用于分配批次之一的第一处理步骤， 同时遵循处理步骤的系统图，作为下一处理步骤的搜索和分配，选择在批次中的后续处理步骤中的处理步骤，其前一处理步骤具有所有在先处理步骤的最早预期完成时间; 以及用于基于所述基本分配方法分配处理步骤的第一分配方法，以及当所述处理步骤中的一个处理步骤发生的等待时间超过允许在所述处理单元之一处的备用的允许时间时，用于避免分配 处理步骤，并且在所述处理步骤之一之前的分支点之前的一个分支点重新开始搜索。 该方法还包括从准备的多个计划中选择在指定时间内已经完​​成的一个日程表的步骤。

公开(公告)号：US07718925B2

公开(公告)日：2010-05-18

申请号：US11566507

申请日：2006-12-04

申请人： Shigehiro Goto ,  Keiji Matsuchika

发明人： Shigehiro Goto ,  Keiji Matsuchika

IPC分类号： H01L21/68 ,  H05B3/22

CPC分类号： H01L21/67103 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/6875

摘要： A heat-treating plate has, arranged on the upper surface thereof, support elements for supporting a substrate, and a first sealer for closing lateral areas of a first space formed between the heat-treating plate and the substrate supported. Further, second sealers ring-shaped in plan view are arranged around openings of perforations accommodating transfer pins. The second sealers close lateral areas of second spaces opposed to the perforations. Gastightness of the first space excluding the second spaces is never impaired through the perforations. By exhausting gas from the first space through exhaust bores, the substrate is effectively sucked for heat treatment.

摘要翻译： 热处理板在其上表面上布置有用于支撑基板的支撑元件，以及用于封闭形成在所述热处理板和所述基板之间形成的第一空间的横向区域的第一密封件。 此外，平面图中环形的第二密封件围绕容纳传送销的穿孔的开口布置。 第二个密封件封闭与穿孔相对的第二个空间的横向区域。 不包括第二个空间的第一个空间的气密性绝对不会因穿孔而受损。 通过从第一空间排出气体通过排气孔，基板被有效地吸入以进行热处理。