Device and method for manufacturing a cell stack

    公开(公告)号:US11984550B2

    公开(公告)日:2024-05-14

    申请号:US17605020

    申请日:2020-04-22

    IPC分类号: H01M10/04

    摘要: A device for manufacturing a cell stack having a plurality of cell assemblies. The device comprises several positioning units accommodating the plurality of cell assemblies. The positioning units each comprise a positioning jaw enclosing the plurality of cell assemblies disposed one above the other. The device further comprises a first moving unit moving the positioning unit. The first moving unit comprises a moving plate mounted in a movable manner and an actuator. The positioning units are disposed on the moving plate. The actuator moves the moving plate. The positioning units are arranged such that the individual cell assemblies are centered between the positioning jaws by the movement initiated by the first moving unit. Finally, the device comprises a support, which is decoupled from the movement of the first moving unit, wherein the plurality of cell assemblies and/or plies rest on the support.

    Pressure protector for high-voltage self-healing capacitor

    公开(公告)号:US11984263B2

    公开(公告)日:2024-05-14

    申请号:US17655460

    申请日:2022-03-18

    IPC分类号: H01G4/015 H01G2/14 H01G4/224

    CPC分类号: H01G4/015 H01G2/14 H01G4/224

    摘要: A pressure protector for a high-voltage self-healing capacitor. is composed of a box shell, a cover plate, a core, filled resin, a pressure protector and wiring terminals. The pressure protector is arranged in the capacitor, and the pressure protector is mainly composed of fixed studs, a protector shell, a movable bolt assembly, a fixed electrode assembly, a movable electrode assembly, first fixed bolts and a limiting bolt. The pressure protector for a high-voltage self-healing capacitor is simple in structure and convenient to install and use, the technical problem of relay protection of internal faults of the self-healing capacitor can be solved. Accidents can be effectively avoided, and the requirement for safe operation of the capacitor can be met.

    Footwear upper
    55.
    外观设计

    公开(公告)号:USD1024521S1

    公开(公告)日:2024-04-30

    申请号:US29836290

    申请日:2022-04-26

    设计人: Manny Roldan

    摘要: FIG. 1 is a front perspective view of a footwear upper showing my new design;
    FIG. 2 is a front elevational view thereof;
    FIG. 3 is a rear elevational view thereof;
    FIG. 4 is a side elevational view thereof;
    FIG. 5 is an opposite side elevational view thereof;
    FIG. 6 is a top plan view thereof; and,
    FIG. 7 is a bottom plan view thereof.
    The dash-dash broken lines in the drawings represent portions of the footwear upper and environmental structure that form no part of the claimed design. The dot-dash broken lines define the bounds of the claim and form no part thereof.

    Wafer forming method
    58.
    发明授权

    公开(公告)号:US11969916B2

    公开(公告)日:2024-04-30

    申请号:US17219984

    申请日:2021-04-01

    申请人: DISCO CORPORATION

    发明人: Keiji Nomaru

    IPC分类号: B28D5/00 B23K26/53 B23K103/00

    摘要: A wafer forming method includes a modified layer forming step of applying a laser beam of such a wavelength as to be transmitted through an ingot to the ingot with a focal point of the laser beam positioned inside from a side surface at a position corresponding to the thickness of a wafer to be formed, to form a modified layer over the whole circumference of the side surface, a peeling-off layer forming step of exerting an external force from an upper surface of the ingot and concentrating a stress on a crack extending from the modified layer to the inside, to cause the crack to develop from the side surface side toward the inside and form a peeling-off layer, and a wafer forming step of peeling off a wafer to be formed, from the ingot, with the peeling-off layer as a start point, to form the wafer.

    Grinding apparatus
    59.
    发明授权

    公开(公告)号:US11967506B2

    公开(公告)日:2024-04-23

    申请号:US17649625

    申请日:2022-02-01

    申请人: DISCO CORPORATION

    摘要: A grinding apparatus includes a first grinding mechanism, a second grinding mechanism, and a third grinding mechanism for grinding wafers held on respective chuck tables. The first grinding mechanism and the second grinding mechanism are positioned with respect to the chuck tables such that a second ground mark produced on a wafer by second grindstones of the second grinding mechanism as it grinds the wafer extends across a first ground mark produced on the wafer by first grindstones of the first grinding mechanism as it grinds the wafer. The second grinding mechanism and the third grinding mechanism are positioned with respect to the chuck tables such that a third ground mark produced on the wafer by third grindstones of the third grinding mechanism as it grinds the wafer extends across the second ground mark produced on the wafer by the second grindstones.