公开(公告)号：US11969916B2

公开(公告)日：2024-04-30

申请号：US17219984

申请日：2021-04-01

申请人： DISCO CORPORATION

发明人： Keiji Nomaru

IPC分类号： B28D5/00 ,  B23K26/53 ,  B23K103/00

CPC分类号： B28D5/0011 ,  B23K26/53 ,  B23K2103/56 ,  B28D5/0052

摘要： A wafer forming method includes a modified layer forming step of applying a laser beam of such a wavelength as to be transmitted through an ingot to the ingot with a focal point of the laser beam positioned inside from a side surface at a position corresponding to the thickness of a wafer to be formed, to form a modified layer over the whole circumference of the side surface, a peeling-off layer forming step of exerting an external force from an upper surface of the ingot and concentrating a stress on a crack extending from the modified layer to the inside, to cause the crack to develop from the side surface side toward the inside and form a peeling-off layer, and a wafer forming step of peeling off a wafer to be formed, from the ingot, with the peeling-off layer as a start point, to form the wafer.

公开(公告)号：US11845158B2

公开(公告)日：2023-12-19

申请号：US17065225

申请日：2020-10-07

申请人： DISCO CORPORATION

发明人： Nobuyuki Kimura ,  Keiji Nomaru

IPC分类号： B24B49/04 ,  G01B11/06 ,  H01L21/687 ,  H01L21/67

CPC分类号： B24B49/04 ,  G01B11/06 ,  H01L21/67253 ,  H01L21/687

摘要： A thickness measuring apparatus that measures a thickness of a workpiece held by a chuck table. The thickness measuring apparatus includes plural image sensors that detect intensity of light spectrally split on each wavelength basis by plural diffraction gratings and generate a spectral interference waveform and a thickness output unit that outputs thickness information from the spectral interference waveform generated by the plural image sensors. The thickness output unit includes a reference waveform recording section in which spectral interference waveforms corresponding to plural thicknesses are recorded as reference waveforms and a thickness deciding section that compares plural spectral interference waveforms generated by the plural image sensors with the reference waveforms recorded in the reference waveform recording section and decides the thickness corresponding to each spectral interference waveform from the reference waveform that corresponds to the spectral interference waveform in the waveform shape.

公开(公告)号：US11565347B2

公开(公告)日：2023-01-31

申请号：US17066714

申请日：2020-10-09

申请人： DISCO CORPORATION

发明人： Keiji Nomaru ,  Yuji Hadano

IPC分类号： B23K26/146 ,  B23K26/0622 ,  B23K26/06 ,  B23K26/08 ,  B23K26/142 ,  B23K26/064 ,  H01L21/67 ,  B23K103/00 ,  B23K101/18

摘要： A laser processing machine includes a condenser and a water pillar forming unit. The condenser condenses a laser beam emitted from a laser oscillator and irradiates it to a workpiece held on a chuck table. The water pillar forming unit is disposed on a lower end of the condenser and is configured to form a thread-shaped water pillar on a front side of the workpiece. The laser oscillator includes a first laser oscillator, which emits a first laser beam having a short pulse width, and a second laser oscillator, which emits a second laser beam having a long pulse width. After the laser beams emitted from the first and second laser oscillators have transmitted through the thread-shaped water pillar formed by the water pillar forming unit and have been irradiated to the workpiece, a plasma occurred in the water pillar forming unit applies processing to the workpiece.

公开(公告)号：US11065717B2

公开(公告)日：2021-07-20

申请号：US16157639

申请日：2018-10-11

申请人： DISCO CORPORATION

发明人： Yuji Hadano ,  Masatoshi Nayuki ,  Keiji Nomaru

IPC分类号： B23K26/142 ,  B23K26/06 ,  H01L21/67 ,  B23K26/53 ,  B23K26/146

摘要： A laser beam applying unit of a laser processing apparatus includes a laser oscillator, a condenser adapted to focus the laser beam emitted from the laser oscillator and apply the laser beam to a workpiece, and a liquid jetting apparatus disposed at a lower end portion of the condenser and adapted to jet a liquid to an upper surface of the workpiece. The liquid jetting apparatus includes: a transparent plate disposed at the lower end portion of the condenser and permitting transmission therethrough of the laser beam; a casing provided with a space defined by a ceiling wall composed of the transparent plate, side walls, and a bottom wall; an opening formed in the bottom plate, extending in a processing feeding direction, and permitting passage therethrough of the laser beam focused by the condenser; and a liquid supply section adapted to supply the liquid to the casing.

公开(公告)号：US20190076961A1

公开(公告)日：2019-03-14

申请号：US16130427

申请日：2018-09-13

申请人： DISCO CORPORATION

发明人： Keiji Nomaru

IPC分类号： B23K26/082 ,  B23K26/06 ,  B23K26/70 ,  H01L21/683 ,  H01L21/687 ,  H01L21/82

摘要： A laser processing apparatus includes a chuck table holding a workpiece thereon, a laser beam applying unit applying a pulsed laser beam to the workpiece held on the chuck table, and a processing feed unit feeding the chuck table and the laser beam applying unit relatively along an X-axis. The laser beam applying unit includes a laser oscillator emitting the pulsed laser beam, a polygon mirror dispersing the pulsed laser beam, a condenser condensing the pulsed laser beam dispersed by the polygon mirror and applying the condensed pulsed laser beam to the workpiece held on the chuck table, and an acousto-optic deflector, an electro-optic deflector, or a resonant scanner disposed between the laser oscillator and the polygon mirror, and controlling a dispersed region of the pulsed laser beam by causing the pulsed laser beam to follow a direction in which mirror facets of the polygon mirror are rotated.

公开(公告)号：US10207369B2

公开(公告)日：2019-02-19

申请号：US15080958

申请日：2016-03-25

申请人： DISCO CORPORATION

发明人： Keiji Nomaru ,  Hiroshi Morikazu

IPC分类号： B23K26/03 ,  B23K26/38 ,  B23K26/384 ,  B23K26/0622 ,  H01L21/768 ,  G01N21/71 ,  B23K26/40 ,  B23K26/382 ,  B23K103/16

摘要： A method for forming a laser processed hole in a workpiece configured by bonding a transparent first member formed of a first material and a second member formed of a second material. The method includes holding the workpiece by a chuck table with a side of the first member directed upward; applying a pulsed laser beam to the workpiece from the upward side of the first member; detecting a wavelength of plasma light generated by applying the pulsed laser beam to the workpiece; and controlling the laser beam according to a detection signal from the plasma light. The plasma is detected by: passing only the wavelength of plasma light generated from the first material, and detecting the plasma light generated from the first material and outputting a light intensity signal based on the detection. The processed hole extends entirely through the first member without melting the second member.

公开(公告)号：US10132619B2

公开(公告)日：2018-11-20

申请号：US15878178

申请日：2018-01-23

申请人： DISCO CORPORATION

发明人： Keiji Nomaru ,  Arata Osaki ,  Akimasa Nakamoto

IPC分类号： G01J1/00 ,  G01B11/24 ,  G01J1/42 ,  G01J1/04

摘要： A spot shape detection apparatus for detecting the spot shape of a laser beam oscillated from a laser oscillator includes: a focusing leans for focusing the laser beam oscillated by the oscillator; a rotary body (mirror holder) in which a plurality of mirrors for reflecting the laser beam having passed through the focusing lens are disposed on concentric circles; a drive source (motor) for rotating the rotary body at a predetermined period; a beam splitter for branching return beams of the laser beam reflected by the plurality of mirrors of the rotary body; an imaging unit which is disposed in a direction in which the return beams are branched by the beam splitter and which images spot shapes of the return beams; and a display unit for displaying images obtained by imaging by the imaging unit, in relation with the plurality of mirrors.

公开(公告)号：US09796049B2

公开(公告)日：2017-10-24

申请号：US14871084

申请日：2015-09-30

申请人： DISCO CORPORATION

发明人： Keiji Nomaru ,  Masatoshi Nayuki

IPC分类号： B23K26/364 ,  H01L21/67 ,  B23K26/082 ,  B23K103/00

CPC分类号： B23K26/364 ,  B23K26/0821 ,  B23K2103/56 ,  H01L21/67092

摘要： Disclosed herein is a laser processing apparatus including a beam swinging unit provided between a pulsed laser oscillator and a focusing unit for swinging the optical path of a pulsed laser beam oscillated from the pulsed laser oscillator and then introducing the pulsed laser beam to the focusing unit. The beam swinging unit includes a polygon scanner provided on the upstream side of the focusing unit for scanning the pulsed laser beam oscillated from the pulsed laser oscillator and introducing the pulsed laser beam scanned to the focusing unit and an acoustooptic deflecting unit provided on the upstream side of the polygon scanner and on the downstream side of the pulsed laser oscillator for deflecting the optical path of the pulsed laser beam oscillated from the pulsed laser oscillator and introducing the pulsed laser beam deflected to the polygon scanner.

公开(公告)号：US20160368088A1

公开(公告)日：2016-12-22

申请号：US15184682

申请日：2016-06-16

申请人： DISCO CORPORATION

发明人： Yu Kudo ,  Keiji Nomaru

IPC分类号： B23K26/082 ,  B23K26/382 ,  B23K26/402 ,  B23K26/06

CPC分类号： B23K26/082 ,  B23K26/382 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/56

摘要： A laser processing apparatus includes a laser beam applying unit. The laser beam applying unit includes a laser oscillator for oscillating a laser beam, a focusing lens for focusing the laser beam to apply the laser beam to a wafer, a first optical path changing part, a second optical path changing part, and a controller. The first optical path changing part has a pair of first-axis resonant scanners which are disposed on the downstream side with respect to the propagating direction of the laser beam oscillated from the laser oscillator and which change the optical path of the laser beam into a Y-axis direction. The second optical path changing part has a pair of second-axis resonant scanners which are disposed between the first optical path changing part and the focusing lens and which change the optical path of the laser beam into an X-axis direction.

摘要翻译： 激光加工装置包括激光束施加单元。 激光束施加单元包括用于振荡激光束的激光振荡器，用于聚焦激光束以将激光束施加到晶片的聚焦透镜，第一光路改变部分，第二光路改变部分和控制器。 第一光路改变部具有一对第一轴谐振扫描器，它们相对于从激光振荡器振荡的激光束的传播方向设置在下游侧，并且将激光束的光路改变为Y 方向。 第二光路改变部具有一对第二轴谐振扫描器，它们设置在第一光路改变部分和聚焦透镜之间，并将激光束的光路改变为X轴方向。

公开(公告)号：US20160139488A1

公开(公告)日：2016-05-19

申请号：US14933240

申请日：2015-11-05

申请人： DISCO CORPORATION

发明人： Keiji Nomaru

IPC分类号： G02F1/33 ,  G02B5/18 ,  H01S3/00

CPC分类号： G02F1/33 ,  B23K26/064 ,  B23K2103/56 ,  G02B5/1814

摘要： A laser oscillation mechanism includes a pulse laser oscillator which oscillates a pulse laser beam, and an optical path changing unit which changes an angle of an optical path of the pulse laser beam oscillated by the pulse laser oscillator. The optical path changing unit is configured from an acousto-optic deflection unit including an acousto-optic device for changing the optical path of the pulse laser beam oscillated by the pulse laser oscillator within an effective region, and a volume Bragg grating which excludes, from among pulse laser beams obtained by changing the angle of the optical path of the pulse laser beam by passing through the acousto-optic device, a pulse laser beam desired to be eliminated by refraction from within the effective region.

摘要翻译： 激光振荡机构包括振荡脉冲激光束的脉冲激光振荡器和改变由脉冲激光振荡器振荡的脉冲激光束的光路的角度的光路改变单元。 光路改变单元由声光​​偏转单元构成，该声光偏转单元包括用于改变由有效区域内的脉冲激光振荡器振荡的脉冲激光束的光路的声光装置，以及体积布拉格光栅，其不包括 在通过通过声光器件改变脉冲激光束的光路的角度获得的脉冲激光束中，期望通过有效区域内的折射消除的脉冲激光束。