Framework for Simultaneous Subject and Desk Capture During Videoconferencing

    公开(公告)号:US20250150654A1

    公开(公告)日:2025-05-08

    申请号:US18867930

    申请日:2023-05-30

    Applicant: Apple Inc.

    Abstract: Devices, methods, and non-transitory program storage devices are disclosed herein to: obtain, at a first electronic device, one more images captured by a first image capture device; crop a first portion of a first image of the one or more images, e.g., comprising a face of a human subject; apply a distortion correction operation to the cropped first portion; and then crop a second portion of the first image, wherein the second portion comprises a portion of a surface (e.g., a desktop or document) in the first image; apply a distortion correction operation to the cropped second portion; and transmit the distortion-corrected first and second portions to a second electronic device, e.g., after compositing the first and second portions into an output image to be transmitted. The first image capture device may be integrated into the first electronic device, or it may be connected in a wired or wireless fashion.

    PHOTONIC INTEGRATED CIRCUITS WITH CONTROLLED COLLAPSE CHIP CONNECTIONS

    公开(公告)号:US20250149850A1

    公开(公告)日:2025-05-08

    申请号:US19014076

    申请日:2025-01-08

    Applicant: Apple Inc.

    Abstract: Embodiments are directed to a photonic device that includes a first substrate defining a surface and a trench forming a depression along a portion of the surface, and a second substrate coupled with the surface and extending from the surface to form a raised portion around the trench. The photonic device can also include a laser die positioned within the trench, such that the laser die is surrounded by the second substrate, and an optical material positioned within a region between the laser die and the second substrate. The photonic device can further include a third substrate coupled with the second substrate such that the second substrate is positioned between the first substrate and the third substrate such that the second substrate is configured to at least partially isolate the laser die from mechanical stress exerted on the optical device.

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