Semiconductor package for improving characteristics for transmitting signals and power
    51.
    发明授权
    Semiconductor package for improving characteristics for transmitting signals and power 有权
    用于提高发射信号和功率特性的半导体封装

    公开(公告)号:US07859115B2

    公开(公告)日:2010-12-28

    申请号:US12346963

    申请日:2008-12-31

    Abstract: A semiconductor package includes a semiconductor chip having a first region and a second region. Bonding pads are formed and through-holes are defined in the first and second regions. Insulation layers are formed on sidewalls of the through-holes, and through-electrodes formed in the through-holes and connected with corresponding bonding pads. The insulation layers formed in the first and second regions have different thicknesses or dielectric constants.

    Abstract translation: 半导体封装包括具有第一区域和第二区域的半导体芯片。 形成接合焊盘并且在第一和第二区域中限定通孔。 绝缘层形成在通孔的侧壁上,通孔形成在通孔中并与相应的接合焊盘连接。 形成在第一和第二区域中的绝缘层具有不同的厚度或介电常数。

    Guitar having chest and arm rests and method of manufacturing same
    52.
    发明授权
    Guitar having chest and arm rests and method of manufacturing same 有权
    具有胸部和手臂的吉他及其制造方法

    公开(公告)号:US07795514B2

    公开(公告)日:2010-09-14

    申请号:US12365581

    申请日:2009-02-04

    Applicant: Jong Hoon Kim

    Inventor: Jong Hoon Kim

    CPC classification number: G10D3/02

    Abstract: Disclosed herein is a guitar, which includes a chest rest formed on a back plate of a main body so that the guitar can be gripped in a stable manner and can be played with a comfort of chest. The guitar further includes an arm rest formed on a top plate of the main body so that so that the guitar can be gripped in a stable manner and can be played with a comfort of chest and arm. A method of manufacturing the chest and arm rest is also disclosed.

    Abstract translation: 这里公开了一种吉他,其包括形成在主体的背板上的胸部休息台,使得吉他可以以稳定的方式被夹持并且可以舒适的胸部玩。 吉他还包括形成在主体的顶板上的扶手,使得能够以稳定的方式夹持吉他并且可以舒适的胸部和手臂进行演奏。 还公开了制造胸部和扶手的方法。

    SEMICONDUCTOR DEVICE
    53.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20100155886A1

    公开(公告)日:2010-06-24

    申请号:US12719979

    申请日:2010-03-09

    Applicant: Jong-Hoon KIM

    Inventor: Jong-Hoon KIM

    Abstract: A semiconductor device is provided. The semiconductor device includes a chip having a plurality of first power voltage terminals connected in common to a first power voltage line, a plurality of second power voltage terminals connected in common with a second power voltage line, a first connection terminal, a second connection terminal connected to the first power voltage line or the second power voltage line, and an on-die capacitor. The semiconductor device also includes a package having a plurality of third power voltage terminals connected to the first power voltage terminals through a first wire by wire bonding during a packaging process and a plurality of fourth power voltage terminals connected to the second power voltage terminals through a second wire by wire bonding during the packaging process, and configured to package the chip, wherein one end of the on-die capacitor is connected to the first connection terminal, and the first connection terminal is connected to the second connection terminal through a third wire by wire bonding during the packaging process.

    Abstract translation: 提供半导体器件。 半导体器件包括具有与第一电源线共同连接的多个第一电源电压端子,与第二电源电压线共同连接的多个第二电力电压端子的第一连接端子,第二连接端子 连接到第一电源线或第二电源线,以及片上电容器。 该半导体器件还包括具有多个第三电源电压端子的封装,该多个第三电源电压端子通过在封装工艺期间的引线接合而通过第一电线连接到第一电源电压端子,以及多个第四电力电压端子,其通过一个 在封装过程中通过引线接合的第二线,并且被配置为封装所述芯片,其中所述片上电容器的一端连接到所述第一连接端子,并且所述第一连接端子通过第三线连接到所述第二连接端子 通过在包装过程中的引线键合。

    Semiconductor device, related method, and printed circuit board
    55.
    发明授权
    Semiconductor device, related method, and printed circuit board 失效
    半导体器件,相关方法和印刷电路板

    公开(公告)号:US07724535B2

    公开(公告)日:2010-05-25

    申请号:US11797988

    申请日:2007-05-09

    Abstract: A semiconductor device, a method related to the semiconductor device, and a printed circuit board are disclosed. The semiconductor device includes a chip, a package including a plurality of power voltage terminals and a plurality of ground voltage terminals, wherein the chip is disposed in the package. The semiconductor device further includes an impedance circuit connected between a DC component power voltage terminal and a ground voltage, wherein the DC component power voltage terminal is one of the plurality of power voltage terminals, and an AC component interrupter connected between the DC component power voltage terminal and a power voltage. Both the AC component and a DC component of the power voltage are applied to each of the power voltage terminals except the DC component second power voltage terminal, and the ground voltage is applied to each of the ground voltage terminals.

    Abstract translation: 公开了半导体器件,与半导体器件相关的方法和印刷电路板。 半导体器件包括芯片,包括多个电源电压端子和多个接地电压端子的封装,其中芯片设置在封装中。 半导体装置还包括连接在直流分量电源端子和接地电压之间的阻抗电路,其中直流分量电源电压端子是多个电源电压端子中的一个,以及连接在直流分量电源电压 端子和电源电压。 除了直流分量第二电力电压端子之外,将电力电压的交流分量和直流分量都施加到各电力电压端子,并且将接地电压施加到每个接地电压端子。

    Liquid crystal display
    56.
    发明申请
    Liquid crystal display 有权
    液晶显示器

    公开(公告)号:US20100066657A1

    公开(公告)日:2010-03-18

    申请号:US12314806

    申请日:2008-12-17

    Abstract: Disclosed herein is a liquid crystal display capable of reducing a side effect during local LED dimming to reduce power consumption and improve display quality. The liquid crystal display includes a liquid crystal panel having a plurality of liquid crystal cells formed respectively in a plurality of pixel areas defined by intersections of a plurality of gate lines and a plurality of data lines, a data driver for supplying data voltages to the data lines, a gate driver for supplying scan signals to the gate lines, a timing controller for controlling the data driver and gate driver and outputting a plurality of dimming signals based on an average picture level (APL) detected based on video data supplied to the liquid crystal panel, and a light emitting diode (LED) backlight unit for partitioning the liquid crystal panel into a plurality of areas and supplying appropriate pulse width modulation (PWM) control signals based on the dimming signals to a plurality of LED arrays installed to correspond respectively to the partitioned areas, to supply light to the liquid crystal panel.

    Abstract translation: 这里公开了一种液晶显示器,其能够在局部LED调光期间减少副作用以降低功耗并提高显示质量。 液晶显示器包括具有分别形成在由多条栅极线和多条数据线的交点限定的多个像素区域中的多个液晶单元的液晶面板,用于向数据提供数据电压的数据驱动器 线路,用于向栅极线提供扫描信号的栅极驱动器,用于控制数据驱动器和栅极驱动器并基于基于提供给液体的视频数据检测到的平均图像电平(APL)输出多个调光信号的定时控制器 水晶面板和用于将液晶面板分割成多个区域的发光二极管(LED)背光单元,并且基于调光信号向安装的多个LED阵列提供适当的脉宽调制(PWM)控制信号,以分别对应 到分隔区域,以向液晶面板提供光。

    BINDING FOR MUSICAL INSTRUMENTS
    57.
    发明申请
    BINDING FOR MUSICAL INSTRUMENTS 审中-公开
    音乐仪器的绑定

    公开(公告)号:US20100037751A1

    公开(公告)日:2010-02-18

    申请号:US12365656

    申请日:2009-02-04

    Applicant: Jong Hoon Kim

    Inventor: Jong Hoon Kim

    CPC classification number: G10D3/02 Y10T428/24479

    Abstract: Disclosed herein is a binding for musical instruments. The binding comprises a combination of a base and a decoration strip. The base is formed with a groove having a sinuate shape. The decoration strip is formed of a plurality of thin and elongated materials having different colors. The thin and elongated materials are attached to each other into a single body. Thus, the musical instruments can be manufactured so as to have more beautiful appearances, and provide more active and meaningful feelings.

    Abstract translation: 本文公开了对乐器的约束。 装订包括基部和装饰条的组合。 基部形成有具有中心形状的凹槽。 装饰条由多种具有不同颜色的薄而细长的材料形成。 薄而细长的材料彼此连接成一体。 因此,可以制造乐器以具有更美观的外观,并提供更积极和有意义的感觉。

    MAGNETIC COVER
    58.
    发明申请
    MAGNETIC COVER 审中-公开
    磁性盖

    公开(公告)号:US20100024622A1

    公开(公告)日:2010-02-04

    申请号:US12365613

    申请日:2009-02-04

    Applicant: Jong Hoon Kim

    Inventor: Jong Hoon Kim

    CPC classification number: H01F7/0252 G10G7/00

    Abstract: The present invention relates to a magnetic cover that is coupled to a body of a product by means of a magnetic force, wherein the magnetic cover does not have any screw hole thereon since no screws are required to couple the magnetic cover to the body of the product, thereby providing good outer appearance to the product and conducting easy and convenient coupling and removing operations. In addition, even when the coupling and removing are carried out repeatedly or carelessly, no damage or deformation occurs, and further, no tool like a driver is needed for the coupling or removing.

    Abstract translation: 本发明涉及一种通过磁力联接到产品主体的磁性盖,其中磁性盖不具有任何螺孔,因为不需要任何螺丝来将磁性盖连接到磁性体的主体 产品,从而为产品提供良好的外观,并进行简单方便的联接和拆卸操作。 另外,即使重复地或不小心地进行联接和移除,也不会发生损坏或变形,并且不需要像驱动器这样的工具来进行联接或移除。

    Apparatus and method for driving image display device
    59.
    发明授权
    Apparatus and method for driving image display device 有权
    用于驱动图像显示装置的装置和方法

    公开(公告)号:US07629956B2

    公开(公告)日:2009-12-08

    申请号:US11301948

    申请日:2005-12-13

    Abstract: An apparatus and method for driving an image display device is disclosed, in which data signals are transmitted in a multilevel to reduce transmission frequencies, power consumption and transmission lines. The apparatus for driving an image display device includes a display panel including an image display unit for displaying images, a plurality of data driver integrated circuits supplying image signals to the image display unit, and a timing controller converting externally supplied i bit digital source data (i is a positive number) to a plurality of voltage levels to supply the converted voltage levels to the respective data driver integrated circuits and controlling the data driver integrated circuits.

    Abstract translation: 公开了一种用于驱动图像显示装置的装置和方法,其中数据信号以多级传输以减少传输频率,功耗和传输线。 用于驱动图像显示装置的装置包括:显示面板,包括用于显示图像的图像显示单元,向图像显示单元提供图像信号的多个数据驱动器集成电路;以及转换外部提供的i位数字源数据的定时控制器 i是正数)到多个电压电平,以将转换的电压电平提供给各个数据驱动器集成电路并控制数据驱动器集成电路。

    THROUGH-ELECTRODE, CIRCUIT BOARD HAVING A THROUGH-ELECTRODE, SEMICONDUCTOR PACKAGE HAVING A THROUGH-ELECTRODE, AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SEMICONDUCTOR CHIP OR PACKAGE HAVING A THROUGH-ELECTRODE
    60.
    发明申请
    THROUGH-ELECTRODE, CIRCUIT BOARD HAVING A THROUGH-ELECTRODE, SEMICONDUCTOR PACKAGE HAVING A THROUGH-ELECTRODE, AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SEMICONDUCTOR CHIP OR PACKAGE HAVING A THROUGH-ELECTRODE 失效
    通过电极,具有电极的电路板,具有电极的半导体封装,以及具有半导体芯片的堆叠半导体封装或具有电极的封装

    公开(公告)号:US20090261458A1

    公开(公告)日:2009-10-22

    申请号:US12209584

    申请日:2008-09-12

    Abstract: A stacked semiconductor package includes a first semiconductor package having a first semiconductor chip having a first pad and a through-hole passing through a the portion corresponding to the pad; a second semiconductor package disposed over the first semiconductor package, and including a second semiconductor chip having a second pad disposed at a portion corresponding to the first pad and blocking the through-hole; and a through-electrode disposed within the through-hole, and having a pillar shaped core supported by the second pad, a through-electrode unit disposed over a surface of the core and electrically connected with the second pad, a first metal layer interposed between the core and the through electrode unit, and a second metal layer interposed between an inner surface of the first semiconductor chip formed by the through-hole and the through-electrode unit.

    Abstract translation: 堆叠半导体封装包括具有第一半导体芯片的第一半导体封装,第一半导体芯片具有第一焊盘和穿过对应于焊盘的部分的通孔; 第二半导体封装,设置在所述第一半导体封装上,并且包括第二半导体芯片,所述第二半导体芯片具有设置在与所述第一焊盘对应的部分处并阻塞所述通孔的第二焊盘; 以及设置在所述通孔内的贯通电极,并具有由所述第二焊盘支撑的柱状芯,贯通电极单元,设置在所述芯的表面上并与所述第二焊盘电连接;第一金属层, 芯和贯通电极单元,以及插入在由通孔形成的第一半导体芯片的内表面和通孔单元之间的第二金属层。

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