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    PRINTED RADIO FREQUENCY INDENTIFICATION ANTENNAS
    54.
    发明申请
    PRINTED RADIO FREQUENCY INDENTIFICATION ANTENNAS 审中-公开

    公开(公告)号：US20170294702A1

    公开(公告)日：2017-10-12

    申请号：US15508983

    申请日：2015-09-04

    Applicant: VORBECK MATERIALS CORP.

    Inventor： Sriram Manivannan ,  Mathew A Hudspeth ,  Jeremy D Smith ,  Larry Hurson

    IPC: H01Q1/22 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/28

    CPC classification number: H01Q1/2208 ,  H01Q1/368 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/28

    Abstract: Embodiments of the present invention relate to a symmetrical printed radio frequency identification antenna and method of forming a radio frequency identification antenna. In one embodiment, the radio frequency identification antenna comprises a loop element having a plurality of sides. A first conductive element is in electrical communication with the loop element. A second conductive element is in electrical communication with the loop element. The first conductive element includes an integrated circuit pad. The first and second conductive elements extend in opposite directions substantially from a middle portion of a side included in the plurality of sides. The loop, first conductive element, and second conductive element are electrically conductive. The second conductive element includes a quadrilateral portion. The second conductive element has a width that is at least about the length of the side included in the plurality of sides.

    TRANSPONDER ANTENNA INLAY
    56.
    发明申请
    TRANSPONDER ANTENNA INLAY 审中-公开
    TRANSPONDER天线INLAY

    公开(公告)号：US20160294051A1

    公开(公告)日：2016-10-06

    申请号：US15090174

    申请日：2016-04-04

    Applicant: VORBECK MATERIALS CORP.

    Inventor： SRIRAM MANIVANNAN ,  KENNETH E FRITSCH ,  DAN F. SCHEFFER

    IPC: H01Q1/50 ,  H01Q1/40 ,  G06K19/077 ,  H01Q1/22

    CPC classification number: G06K19/07773 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/40

    Abstract: Embodiments of the present invention relate to radio transponders and radio transponder antenna inlays. In an embodiment, a radio transponder comprises an integrated circuit having a memory unit. A printed antenna inlay is in electrical communication with the integrated circuit. The antenna inlay comprises a non-metallic conductive compound. The antenna inlay is non-ferromagnetic. The antenna inlay is radiolucent at wavelengths of at least 0.01 nm. The antenna inlay has a thickness of about 0.8 μm to about 150 μm.

    Abstract translation: 本发明的实施例涉及无线电应答器和无线电应答器天线嵌体。 在一个实施例中，无线电应答器包括具有存储器单元的集成电路。 印刷天线嵌体与集成电路电连通。 天线嵌体包括非金属导电化合物。 天线嵌体是非铁磁性的。 天线嵌体在至少0.01nm的波长处是可透射的。 天线嵌体具有约0.8μm至约150μm的厚度。

    PERFORMANCE OUTDOOR FOOTWEAR
    58.
    发明申请
    PERFORMANCE OUTDOOR FOOTWEAR 审中-公开
    性能户外鞋

    公开(公告)号：US20160021969A1

    公开(公告)日：2016-01-28

    申请号：US14809168

    申请日：2015-07-24

    Applicant: VORBECK MATERIALS CORP.

    Inventor： Carl F. LETTOW, II ,  Raymond J. SAURO

    IPC: A43B1/14 ,  A43B23/08 ,  A43B13/26 ,  A43B13/04

    CPC classification number: A43B1/14 ,  A43B13/04 ,  A43B23/087

    Abstract: Embodiments of the present invention relate to footwear articles and a method for fabricating a footwear article. The footwear article comprises an upper and a sole that is comprised of a graphene-containing polymer composition and having one or more layers affixed to the upper. The method for fabricating the footwear article comprises forming a sole on an upper. The sole comprises a graphene-containing polymer composition and one or more layers affixed to the upper.

    Abstract translation: 本发明的实施例涉及鞋类制品和制造鞋类制品的方法。 鞋类制品包括由含石墨烯的聚合物组合物组成的上部和底部，并且具有固定到上部的一层或多层。 制造鞋类制品的方法包括在鞋面上形成鞋底。 鞋底包括含石墨烯的聚合物组合物和固定到鞋面的一层或多层。

    Wearable communications and ballistic protection system
    59.
    发明授权
    Wearable communications and ballistic protection system 有权

    公开(公告)号：US12228378B2

    公开(公告)日：2025-02-18

    申请号：US17713052

    申请日：2022-04-04

    Applicant: Vorbeck Materials Corp.

    Inventor： John Lettow ,  Keren Espina ,  Jennifer Pinkos ,  James A Turney ,  Can Gun Yaprak ,  Sandy Spence

    IPC: F41H1/02 ,  H01Q1/27

    Abstract: The instant disclosure seeks to a wearable communications and ballistics protection system that includes a carrier, communications hub, and antenna element(s). The hub is affixed to the carrier and includes an antenna port(s). The antenna element(s) is affixed to the carrier. Each antenna port conductively couples to an antenna element as well as demountably and conductively couples to a portable radio. The carrier holds ballistic plates and is configured to be worn on the user's torso and provide ballistic protection thereto. Antenna elements are formed using a graphene-polymer conductive composition. The carrier includes first and second panels that hold ballistic plates and are pivotably coupled together at a top end. The first and second panels are also laterally held together via demountable fasteners. The antenna elements and/or the panels include EM shielding material to shield the user from EM that emanates from antenna elements.

    Electromagnetic interference shielding structures
    60.
    发明授权
    Electromagnetic interference shielding structures 有权

    公开(公告)号：US11882680B2

    公开(公告)日：2024-01-23

    申请号：US17986529

    申请日：2022-11-14

    Applicant: Vorbeck Materials Corp.

    Inventor： Dan Scheffer ,  Kate Redmond ,  Trentice Bolar

    IPC: H05K9/00

    CPC classification number: H05K9/0007 ,  H05K9/0081

    Abstract: Embodiments of the present invention relate to electromagnetic interference (EMI) shielding structures. Rectangular EMI shielding panels are formed that include a first and second ends. A pair of rectangular EMI shielding panels are affixed orthogonal to each other at their first ends. The pair of rectangular EMI shielding panels are successively overlapped with each other to thereby form a plurality of interconnected EMI shielding planes. The pair of rectangular EMI shielding panels are affixed to each other at their second ends to form a helical EMI shielding structure that unfolds to an unfolded state and folds to a folded state along its center axis. Here, the plurality of interconnected EMI shielding planes are each angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer.

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