Abstract:
A defect inspection apparatus is capable of inspecting an extremely small defect present on the top and edge surfaces of a sample such as a semiconductor substrate or a thin film substrate with high sensitivity and at high speed. The defect inspection apparatus has an illumination optical system, a plurality of detection optical units and a signal processor. One or more of the detection optical units receives either light diffracted from an edge portion of the sample or light diffracted from an edge grip holding the sample. The one or more of the detection optical units shields the diffracted light received by the detection optical unit based on a signal obtained by monitoring an intensity of the diffracted light received by the detection optical unit in order to inspect a sample portion located near the edge portion and a sample portion located near the edge grip.
Abstract:
A defect inspection apparatus includes a movable stage for mounting a substrate having circuit patterns as an object of inspection, an irradiation optical system which irradiates a slit-shaped light beam from an oblique direction to the circuit patterns of the substrate, a detection optical system which includes an image sensor for receiving reflected/scattered light from the substrate by irradiation of the slit-shaped light beam and converting the received light into a signal, and an image processor which processes the signal. The irradiation optical system includes a cylindrical lens and a coherency reduction optical system, which receives the light beam and emits a plurality of slit-shaped light sub-beams which are spatially reduced in coherency in a light-converging direction of the cylindrical lens. The cylindrical lens focuses the plurality of slit-shaped light sub-beams into the slit-shaped light beam irradiated to the surface of the substrate.
Abstract:
A method for inspecting a defect of a surface of a sample, includes irradiating a laser beam on the sample surface a plurality of times so that at least part of an illumination field of the laser beam on the sample surface illuminates a first area of the sample surface each of the plurality of times, detecting a plurality of scattered light rays from the first area caused by the plurality of times of irradiation, correcting errors of detection timings for the plurality of scattered light rays detected in the detection step, and determining a defect on the sample surface based on the plurality of scattered light rays in accordance with the correcting errors of detection timings.
Abstract:
In a defect inspection for a semiconductor substrate, inspection objects include, in addition to a bare Si wafer, a wafer with various films formed on the surface thereof. For a sample formed with a metal film in particular, scattering light generated by surface roughness thereof is large, thus making it difficult to detect a minute defect and a minute foreign substance. It is desirable that a minute defect and a minute foreign substance be detected regardless of scattering light generated by the roughness of the sample surface. Insertion of an analyzer in an optical path of a detection optical system at such an angle that the scattering light generated by the roughness becomes minimum permits suppressing the scattering light generated by the roughness.
Abstract:
Scattered light that originates from the surface roughness of silicon or other metallic films is distributed more strongly at positions closer to the starting position of the scattering. Of all scattered-light detection signals obtained during multi-directional detection, therefore, only a detection signal of forward scattered light can be used to detect micro-defects, and only a detection signal of backward scattered light can be used to detect the surface roughness very accurately.
Abstract:
To inspect a substrate such as a semiconductor substrate for surface roughness at high precision.The surface roughness of the substrate is measured in each frequency band of the surface roughness by applying a light to the substrate surface and detecting a scattered light or reflected light at a plurality of azimuth or elevation angles.
Abstract:
A method for inspecting a defect of a surface of a sample includes irradiating a laser beam on the sample surface a plurality of times so that at least part of an illumination field of the laser beam on the sample surface illuminates a first area of the sample surface each of the plurality of times, detecting a plurality of scattered light rays from the first area caused by the plurality of times of irradiations, correcting errors of detection timings for the plurality of detected scattered light rays, correcting at least one of adding and averaging the plurality of scattered light rays, determining a defect on the sample surface based on a calculation result in accordance with the at least one of the adding and averaging.
Abstract:
A defect inspection apparatus includes an irradiation optical system 20, a detection optical system 30, and an image processor 40. In the irradiation optical system, a mirror 2603 is disposed to reflect downward a beam flux that has been guided to a first or second optical path, and a cylindrical lens 251 and an inclined mirror 2604 are disposed to focus the beam flux that has been directed downward by the mirror, at an inclination angle from a required oblique direction extending horizontally, onto a substrate 1 to be inspected, as a slit-shaped beam 90.