摘要:
When an ECU determines that the motor count of a motor generator exceeds a predetermined limit value, control is effected to set the torque of motor generator to zero. Further, when the ECU determines that motor count exceeds the predetermined limit value, voltage control of inverter input voltage is reduced by a predetermined level.
摘要:
When an ECU receives a transmission signal having a high level from a transmission, the ECU exerts torque reduction control to reduce a torque control value for a motor generator. Furthermore the ECU sets an optimum (or target) value of a voltage as based on the torque control value and a motor rotation speed and controls an upconverter. Herein, when the transmission is shifting gears, the ECU controls the upconverter to allow the voltage to be constant regardless of whether the torque reduction control is exerted to reduce the torque control value.
摘要:
When an ECU determines that the motor count of a motor generator exceeds a predetermined limit value, control is effected to set the torque of motor generator to zero. Further, when the ECU determines that motor count exceeds the predetermined limit value, voltage control of inverter input voltage is reduced by a predetermined level.
摘要:
A feature expansion module is provided which includes a generally rectangular body (11) installable in a host device (1), a first connection terminal (13) provided at one side of the body (11) for electrical connection with the host device (1), a feature expansion unit (44) provided inside the body (11) and having one or more functions, one or more recesses (22) formed contiguously to an insertion slot (23) formed at the other side of the body (11) and through which an integrated circuit chip (27) incorporating integrated circuit elements is inserted, to receive the integrated circuit chip (27), a second connection terminal (25) provided in the recess (22) for electrical connection with a group of terminals provided at the integrated circuit chip (27), and a controller (9) built in the body (11) to control the integrated circuit chip (27) set in the recess (22).
摘要:
An infrared ray test for a semiconductor chip is conducted by irradiating infrared ray onto a bottom surface of a semiconductor chip, receiving the infrared ray reflected from a bonding pad and displaying the image of the bonding pad on a monitor. The image obtained from the infrared ray has information whether the bonding pad itself or a portion of the silicon substrate underlying the bonding pad has a defect or whether or not there is a deviation of the bonding pad with respect to the bump.
摘要:
A printed circuit board is connected to a single-layer wiring tape so as to surround an integrated circuit element which is connected to the single-layer wiring tape. Wiring patterns of the wiring tape are formed from either a power electrode or a ground electrode on the integrated circuit element to a planar metal pattern on the printed circuit board, from the planar metal pattern on the printed circuit board to either an external power terminal or an external ground terminal on the wiring tape, and from a signal electrode on the integrated circuit element to an external signal terminal on the wiring tape.