Voltage Control of Upconverter in a Motored Vehicle Drive
    52.
    发明申请
    Voltage Control of Upconverter in a Motored Vehicle Drive 有权
    上变频器在车辆驱动中的电压控制

    公开(公告)号:US20090033257A1

    公开(公告)日:2009-02-05

    申请号:US11918230

    申请日:2006-05-19

    IPC分类号: H02P27/02

    摘要: When an ECU receives a transmission signal having a high level from a transmission, the ECU exerts torque reduction control to reduce a torque control value for a motor generator. Furthermore the ECU sets an optimum (or target) value of a voltage as based on the torque control value and a motor rotation speed and controls an upconverter. Herein, when the transmission is shifting gears, the ECU controls the upconverter to allow the voltage to be constant regardless of whether the torque reduction control is exerted to reduce the torque control value.

    摘要翻译: 当ECU从变速器接收到高电平的发送信号时,ECU进行转矩降低控制,以减小电动发电机的转矩控制值。 此外,ECU基于转矩控制值和电动机转速设定电压的最佳(或目标)值,并控制上变频器。 这里,当变速器正在变速时,ECU控制上变频器以允许电压恒定,而不管是否施加转矩降低控制以减小转矩控制值。

    Feature expansion module
    54.
    发明授权
    Feature expansion module 失效
    功能扩展模块

    公开(公告)号:US06764346B2

    公开(公告)日:2004-07-20

    申请号:US10344194

    申请日:2003-04-23

    IPC分类号: H01R2500

    摘要: A feature expansion module is provided which includes a generally rectangular body (11) installable in a host device (1), a first connection terminal (13) provided at one side of the body (11) for electrical connection with the host device (1), a feature expansion unit (44) provided inside the body (11) and having one or more functions, one or more recesses (22) formed contiguously to an insertion slot (23) formed at the other side of the body (11) and through which an integrated circuit chip (27) incorporating integrated circuit elements is inserted, to receive the integrated circuit chip (27), a second connection terminal (25) provided in the recess (22) for electrical connection with a group of terminals provided at the integrated circuit chip (27), and a controller (9) built in the body (11) to control the integrated circuit chip (27) set in the recess (22).

    摘要翻译: 提供一种特征扩展模块,其包括可安装在主机设备(1)中的大致矩形主体(11),设置在主体(11)的一侧的第一连接端子(13),用于与主机设备(1)电连接 ),设置在所述主体(11)内并且具有一个或多个功能的特征扩展单元(44),与形成在所述主体(11)的另一侧的插槽(23)连续形成的一个或多个凹部(22) 并且插入集成电路元件的集成电路芯片(27)以接收集成电路芯片(27),设置在所述凹部(22)中用于与提供的一组端子电连接的第二连接端子(25) 集成电路芯片(27)和内置在主体(11)中的控制器(9),以控制设置在凹部(22)中的集成电路芯片(27)。

    Method for inspecting semiconductor chip bonding pads using infrared rays
    55.
    发明授权
    Method for inspecting semiconductor chip bonding pads using infrared rays 失效
    使用红外线检查半导体芯片接合焊盘的方法

    公开(公告)号:US06339337B1

    公开(公告)日:2002-01-15

    申请号:US09048045

    申请日:1998-03-26

    IPC分类号: G01R3102

    CPC分类号: G01R31/311

    摘要: An infrared ray test for a semiconductor chip is conducted by irradiating infrared ray onto a bottom surface of a semiconductor chip, receiving the infrared ray reflected from a bonding pad and displaying the image of the bonding pad on a monitor. The image obtained from the infrared ray has information whether the bonding pad itself or a portion of the silicon substrate underlying the bonding pad has a defect or whether or not there is a deviation of the bonding pad with respect to the bump.

    摘要翻译: 通过将红外线照射到半导体芯片的底面上,接收从接合焊盘反射的红外线并将接合焊盘的图像显示在监视器上,进行半导体芯片的红外线测试。 从红外线获得的图像具有关于焊盘本身或接合焊盘下方的硅衬底的一部分是否具有缺陷的焊盘的位置,或者接合焊盘相对于凸块是否存在偏差的信息。