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    TeraPHY chiplet optical input/output system
    53.
    发明授权
    TeraPHY chiplet optical input/output system 有权

    公开(公告)号：US11822119B2

    公开(公告)日：2023-11-21

    申请号：US18168555

    申请日：2023-02-13

    Applicant: Ayar Labs, Inc.

    Inventor： John Fini ,  Vladimir Stojanovic ,  Chen Sun ,  Derek van Orden ,  Mark Taylor Wade

    IPC: G02B6/12 ,  G02B6/293 ,  G02B6/125 ,  G02B6/43 ,  H04B10/25

    CPC classification number: G02B6/12019 ,  G02B6/125 ,  G02B6/12016 ,  G02B6/29335 ,  G02B6/43 ,  G02B2006/12107 ,  G02F2203/15 ,  H04B10/25

    Abstract: An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

    Systems and Methods for Remote Optical Power Supply Communication for Uncooled WDM Optical Links
    56.
    发明公开
    Systems and Methods for Remote Optical Power Supply Communication for Uncooled WDM Optical Links 审中-公开

    公开(公告)号：US20230224047A1

    公开(公告)日：2023-07-13

    申请号：US18152461

    申请日：2023-01-10

    Applicant: Ayar Labs, Inc.

    Inventor： Matthew Sysak ,  Chen Sun ,  Shahab Ardalan ,  Daniel Jeong ,  Songtao Liu

    IPC: H04B10/80

    CPC classification number: H04B10/806

    Abstract: An optical power supply includes a plurality of lasers in a laser array. Each of the plurality of lasers is configured to generate a separate beam of continuous wave laser light. The optical power supply includes a temperature sensor that acquires a temperature associated with the laser array. The optical power supply includes a digital controller that receives notification of the temperature from the temperature senor. The optical power supply includes an optical power adjuster controlled by the digital controller. The optical power adjuster adjusts an optical power level of one or more beams of continuous wave laser light generated by the plurality of lasers to produce an optical power encoding that conveys information about the temperature associated with the laser array as acquired by the temperature sensor. An electro-optic chip receives the beams of continuous wave laser light from the optical power supply and decodes the optical power encoding.

    Electro-optical interface module and associated methods
    57.
    发明授权
    Electro-optical interface module and associated methods 有权

    公开(公告)号：US11563506B2

    公开(公告)日：2023-01-24

    申请号：US17410443

    申请日：2021-08-24

    Applicant: Ayar Labs, Inc.

    Inventor： Vladimir Stojanovic ,  Alexandra Wright ,  Chen Sun ,  Mark Wade ,  Roy Edward Meade

    IPC: H04J14/02 ,  H04Q11/00 ,  H04B10/50 ,  G02B6/293 ,  G02B6/43 ,  G02B6/42

    Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.

    Photonic Systems to Enable Top-Side Wafer-Level Optical and Electrical Test
    59.
    发明申请
    Photonic Systems to Enable Top-Side Wafer-Level Optical and Electrical Test 有权

    公开(公告)号：US20220214497A1

    公开(公告)日：2022-07-07

    申请号：US17701072

    申请日：2022-03-22

    Applicant: Ayar Labs, Inc.

    Inventor： Roy Edward Meade ,  Chen Sun ,  Shahab Ardalan ,  John Fini ,  Forrest Sedgwick

    IPC: G02B6/12 ,  H01L21/66 ,  G02B6/13 ,  G01M11/00

    Abstract: An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.

    Pooled Memory System Enabled by Monolithic In-Package Optical I/O
    60.
    发明申请
    Pooled Memory System Enabled by Monolithic In-Package Optical I/O 有权

    公开(公告)号：US20220148627A1

    公开(公告)日：2022-05-12

    申请号：US17583967

    申请日：2022-01-25

    Applicant: Ayar Labs, Inc.

    Inventor： Roy Edward Meade ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Wade ,  Hugo Saleh ,  Charles Wuischpard

    IPC: G11C5/04 ,  G11C5/14 ,  G02B6/42

    Abstract: A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.

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