摘要:
Structure and methods are disclosed for transferring thermal energy from an object to a thermal spreader. A plurality of pins are biased against the object so that the plurality of pins contact with, and substantially conform to, a macroscopic surface of the object. Thermal energy is communicated from the object through the pins and through a plurality of air gaps between the pins and the thermal spreader. The pins are retained to the passageways of the thermal spreader so that the pins are retained with the thermal spreader when unbiased against the object.
摘要:
The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components on the cell board. A mechanical subassembly provides support for the cell board, as well as ventilation passages for cooling. Controller chips are connected to one side of the backplane, while the cell boards are connected to the other side. The controller chips manage cell board to cell board communications, and communications between the backplane and the computer system. The cell boards are arranged in back to back pairs, with the outer most cell boards having their components extend beyond the height of the backplane. This allows for an increase of spacing between the front to front interface of adjacent cell boards.
摘要:
A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the middle section and each side section; wherein each flexible region permits the corresponding side section to be bent in relation to the middle section.
摘要:
This document describes various techniques for automatically starting servers at low temperatures. A server may be powered on into a heating mode responsive to determining that a temperature of the server is below an operational temperature range. The server may then be restarted when the temperature of the server has increased to a temperature that is within the operational temperature range.
摘要:
A computer system comprises a chassis and first and second electronic components disposed within the chassis. The computer system also comprises a multi-direction blower module having a blower housing connected to the chassis The blower housing comprises an inlet, a first outlet, and a second outlet. A centrifugal blower is rotatably mounted within the blower housing. An internal wall is disposed within the blower housing and partially surrounds the blower The airflow into the inlet is passed in thermal communication with the first electronic component. The airflow from the first outlet is passed in thermal communication with the second electronic device. The airflow from the second outlet is exhausted from the chassis.
摘要:
A datacenter may use heat collected from a heat exchanger at the exhaust portion of a cooling system to heat inlet louvers for an atmospheric intake. The louvers may have fluid passages through which heated fluid may pass and cause the louvers to heat up. The heated louvers may operate during periods of snow, rain, high humidity, or other conditions to eliminate condensation, snow and ice buildup, or other problems. In some embodiments, a liquid may be passed through the louvers, while in other embodiments, heated air or other gas may be passed through conductive paths in the louvers. In a heated air system, holes in the louvers may allow the heated air to enter the incoming airstream to regulate the incoming temperature to the datacenter.
摘要:
A data center is configured using alternating rows of racks containing heat-generating electronic devices and air conditioners. Fluid, such as water or a refrigerant, for the air conditioners is supplied through pluming below a raised floor, such as those commonly found in current data centers. Attached to this plumbing are standard fluid couplings configured to couple to either air conditioners or liquid cooling units. These air conditioners and liquid cooling units use the same fluid so that they may share the plumbing. As data center migrates to liquid-cooled racks, a fraction of the air conditioners are replaced with liquid conditioning units in such a way that the data center contains both air-cooled and liquid-cooled racks without substantial reduction in efficiency of the air-cooling system. Since the air conditioners and liquid conditioning units use the same couplings and the same fluid, no infrastructure change is required.
摘要:
A system comprises an electronic module slidably mounted in the system, a first assembly including at least one wireless transceiver mounted in the system, and a second assembly including at least one wireless transceiver to communicate wirelessly with the wireless transceiver of the first assembly. The second assembly is attached to the electronic module, and the wireless transceivers of the first and second assemblies continue communicating as the electronic module is slidably moved in the system.
摘要:
In one embodiment, an airflow regulation device comprises a at least one base member configured to couple to a connector on a circuit board, a first segment connected to the at least one base member and extending a first height from the at least one base member, and a second segment removably connected to the first segment and extending a second height from the at least one base member, wherein the second height is different than the first height.
摘要:
Computational enclosures may be designed to distribute power from power supplies to load units (e.g., processors, storage devices, or network routers). The architecture may affect the efficiency, cost, modularity, accessibility, and space utilization of the components within the enclosure. Presented herein are power distribution architectures involving a distribution board oriented along a first (e.g., vertical) axis within the enclosure, comprising a power interconnect configured to distribute power among a set of load boards oriented along a second (e.g., lateral) axis and respectively connecting with a set of load units oriented along a third (e.g., sagittal) axis, and a set of power supplies also oriented along the third axis. This orientation may compactly and proximately position the loads near the power supplies in the distribution system, and result in a comparatively low local current that enables the use of printed circuit boards for the distribution board and load boards.