Method for forming tapered inkjet nozzles
    52.
    发明授权
    Method for forming tapered inkjet nozzles 失效
    形成锥形喷墨喷嘴的方法

    公开(公告)号:US5417897A

    公开(公告)日:1995-05-23

    申请号:US308329

    申请日:1994-03-19

    摘要: A single mask is used to form a tapered nozzle in a polymer nozzle member using laser ablation. In one embodiment of the mask, clear portions of the mask, corresponding to the nozzle pattern to be formed, each incorporate a variable-density dot pattern, where the opaque dots act to partially shield the underlying polymer nozzle member from the laser energy. This partial shielding of the nozzle member under the dot pattern results in the nozzle member being ablated to less of a depth than where there is no shielding. By selecting the proper density of opaque dots around the peripheral portions of the mask openings, the central portion of each nozzle formed in the polymer nozzle member will be completely ablated through, and the peripheral portions of the nozzle will be only partially ablated through. By increasing the density of dots toward the periphery of each mask opening, the resulting nozzle may be formed to have any tapered shape. Other mask patterns are also described.

    摘要翻译: 使用单个掩模在使用激光烧蚀的聚合物喷嘴构件中形成锥形喷嘴。 在掩模的一个实施例中,对应于要形成的喷嘴图案的掩模的透明部分各自包含可变密度点图案,其中不透明点用于部分地屏蔽下面的聚合物喷嘴构件与激光能量。 喷嘴构件在点图案下的部分屏蔽导致喷嘴构件被烧蚀到比没有屏蔽的那个深度更小的深度。 通过在掩模开口的周边部分周围选择适当的不透明点密度,形成在聚合物喷嘴构件中的每个喷嘴的中心部分将被完全烧蚀穿过,并且喷嘴的周边部分将仅被部分地烧蚀通过。 通过向每个掩模开口的周边增加点的密度,所得到的喷嘴可以形成为具有任何锥形形状。 还描述了其他掩模图案。

    Signal swing trimming apparatus and method thereof
    53.
    发明授权
    Signal swing trimming apparatus and method thereof 有权
    信号摆动修整装置及其方法

    公开(公告)号:US08502589B2

    公开(公告)日:2013-08-06

    申请号:US12626630

    申请日:2009-11-26

    IPC分类号: G06F13/14

    CPC分类号: G06F13/4072 G06F2213/0042

    摘要: A signal swing trimming apparatus calibrates a swing level of an output signal generated from a transmitting device to a receiving device including: a comparing device coupled to the output signal for comparing the swing level of the output signal with a target swing level and generating a comparison output signal, and an adjusting device coupled to the comparing device and the transmitting device for controlling the transmitting device to adjust the swing level of the output signal according to the comparison output signal, wherein the signal swing trimming apparatus is configured to calibrate the swing level of the output signal during a hand-shake process between the transmitting device and the receiving device.

    摘要翻译: 信号摆幅修整装置将从发送装置产生的输出信号的摆幅电平校准到接收装置,包括:与输出信号耦合的比较装置,用于将输出信号的摆幅电平与目标摆动电平进行比较,并产生比较 输出信号,以及耦合到所述比较装置和所述发送装置的调整装置,用于根据所述比较输出信号控制所述发送装置调整所述输出信号的摆动电平,其中所述信号摆幅修整装置被配置为校准所述摆动电平 在发送设备和接收设备之间的握手过程中的输出信号。

    Semiconductor package having passive device and method for making the same
    55.
    发明授权
    Semiconductor package having passive device and method for making the same 有权
    具有无源器件的半导体封装及其制造方法

    公开(公告)号:US08415790B2

    公开(公告)日:2013-04-09

    申请号:US12796279

    申请日:2010-06-08

    IPC分类号: H01L25/16 H01L21/50

    摘要: The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a substrate, a first capacitor, a first protective layer, a first metal layer and a second protective layer. The substrate has at least one via structure. The first capacitor is disposed on a first surface of the substrate. The first protective layer encapsulates the first capacitor. The first metal layer is disposed on the first protective layer, and includes a first inductor. The second protective layer encapsulates the first inductor. Whereby, the first inductor, the first capacitor and the via structure are integrated into the semiconductor package, so that the size of the product is reduced.

    摘要翻译: 半导体封装及其制造方法技术领域本发明涉及半导体封装及其制造方法。 半导体封装包括衬底,第一电容器,第一保护层,第一金属层和第二保护层。 衬底具有至少一个通孔结构。 第一电容器设置在基板的第一表面上。 第一保护层封装第一电容器。 第一金属层设置在第一保护层上,并且包括第一电感器。 第二保护层封装第一电感器。 由此,第一电感器,第一电容器和通孔结构被集成到半导体封装中,使得产品的尺寸减小。

    Electric system and alarm device thereof
    56.
    发明授权
    Electric system and alarm device thereof 有权
    电力系统及其报警装置

    公开(公告)号:US08314697B2

    公开(公告)日:2012-11-20

    申请号:US12324556

    申请日:2008-11-26

    IPC分类号: G08B21/00

    CPC分类号: G08B25/016

    摘要: An alarm device includes a first detecting unit and a controlling unit. The first detecting unit has an isolating circuit, a first enabling circuit, a second enabling circuit and an output circuit. The isolating circuit generates an adjusting signal according to an input signal. The first enabling circuit generates a first enabling signal according to the adjusting signal. The second enabling circuit generates a second enabling signal according to the first enabling signal. The output circuit outputs a first detecting signal according to the second enabling signal. The controlling unit outputs a control signal according to the first detecting signal. The control signal controls an electronic device to operate under a standby mode when the first detecting signal refers to an abnormal status.

    摘要翻译: 报警装置包括第一检测单元和控制单元。 第一检测单元具有隔离电路,第一使能电路,第二使能电路和输出电路。 隔离电路根据输入信号产生调整信号。 第一使能电路根据调整信号产生第一使能信号。 第二使能电路根据第一使能信号产生第二使能信号。 输出电路根据第二使能信号输出第一检测信号。 控制单元根据第一检测信号输出控制信号。 当第一检测信号是指异常状态时,控制信号控制电子设备在待机模式下操作。

    General Winding and Feeding Apparatus
    57.
    发明申请
    General Winding and Feeding Apparatus 有权
    一般绕线和送料装置

    公开(公告)号:US20120119012A1

    公开(公告)日:2012-05-17

    申请号:US12945887

    申请日:2010-11-14

    IPC分类号: B65H18/10 B65H16/00

    摘要: A general winding and feeding apparatus includes a rotating shaft on the upper side of a standing wall of a base, and a motor is connected to the rotating shaft in the standing wall. A swing arm extends across a traveling material and is situated at a suitable position on the standing wall. Digital variable frequency methods may be used to drive the motor, which operates in conjunction with light-coupled sensors to detect the traveling speed of a material on the swing arm and sense a swing position of the swing arm. Feedback is generated in real-time to modify the speed of the motor, and the constant speed travel of the material can be achieved while being either wound or unwound.

    摘要翻译: 一般的卷绕给料装置包括在基座的立壁的上侧的旋转轴,马达与立体壁上的旋转轴连接。 摆臂延伸穿过行进材料并且位于站立壁上的适当位置。 数字可变频率方法可以用于驱动电动机,其与光耦合传感器一起操作以检测摆臂上的材料的行进速度并感测摆臂的摆动位置。 反馈是实时产生,以修改电机的速度,并且可以在卷绕或展开的同时实现材料的恒速行驶。

    Microfluidic device and a fluid ejection device incorporating the same
    59.
    发明授权
    Microfluidic device and a fluid ejection device incorporating the same 有权
    微流体装置和包含该微流体装置的流体喷射装置

    公开(公告)号:US08007078B2

    公开(公告)日:2011-08-30

    申请号:US12896980

    申请日:2010-10-04

    IPC分类号: B41J2/05

    摘要: A microfluidic device includes first and second substrates bonded together. The first substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second substrate is bonded to the second opposed surface of the first substrate whereby an outlet of a channel formed in the second substrate substantially aligns with the through slot. The channel of the second substrate has an inlet that is larger than the outlet.

    摘要翻译: 微流体装置包括粘合在一起的第一和第二基底。 第一基板具有第一和第二相对表面。 模具袋形成在第一相对表面中,并且通孔从模腔延伸到第二相对表面。 第二基板结合到第一基板的第二相对表面,由此形成在第二基板中的通道的出口基本上与通孔对准。 第二基板的通道具有比出口大的入口。

    Semiconductor Package and Method for Making the Same
    60.
    发明申请
    Semiconductor Package and Method for Making the Same 有权
    半导体封装及其制作方法

    公开(公告)号:US20110156247A1

    公开(公告)日:2011-06-30

    申请号:US12821800

    申请日:2010-06-23

    IPC分类号: H01L25/16 H01L21/50

    摘要: The present invention relates to a semiconductor package and a method for making the same. The semiconductor package comprises a substrate, a first metal layer, a first dielectric layer, a first upper electrode, a first protective layer, a second metal layer and a second protective layer. The substrate has at least one via structure. The first metal layer is disposed on a first surface of the substrate, and comprises a first lower electrode. The first dielectric layer is disposed on the first lower electrode. The first upper electrode is disposed on the first dielectric layer, and the first upper electrode, the first dielectric layer and the first lower electrode form a first capacitor. The first protective layer encapsulates the first capacitor. The second metal layer is disposed on the first protective layer, and comprises a first inductor. The second protective layer encapsulates the first inductor. Whereby, the first inductor, the first capacitor and the via structure are integrated into the semiconductor package, so that the size of the product is reduced.

    摘要翻译: 半导体封装及其制造方法技术领域本发明涉及半导体封装及其制造方法。 半导体封装包括衬底,第一金属层,第一介电层,第一上电极,第一保护层,第二金属层和第二保护层。 衬底具有至少一个通孔结构。 第一金属层设置在基板的第一表面上,并且包括第一下电极。 第一介电层设置在第一下电极上。 第一上电极设置在第一电介质层上,第一上电极,第一电介质层和第一下电极形成第一电容器。 第一保护层封装第一电容器。 第二金属层设置在第一保护层上,并且包括第一电感器。 第二保护层封装第一电感器。 由此,第一电感器,第一电容器和通孔结构被集成到半导体封装中,使得产品的尺寸减小。