摘要:
A method for making an orifice plate for an ink-jet printer. The orifice plate defines both the orifices and the connected ink chambers. The orifice plate is constructed to permit, in the same print head, one chamber (or orifice) to be deeper (as well as, if desired, wider and longer) than another chamber (or orifice) that may be next to the first chamber. Similarly, a channel delivering ink to the first chamber may be configured to be deeper or shallower, as needed, relative to another channel in the orifice plate.
摘要:
A single mask is used to form a tapered nozzle in a polymer nozzle member using laser ablation. In one embodiment of the mask, clear portions of the mask, corresponding to the nozzle pattern to be formed, each incorporate a variable-density dot pattern, where the opaque dots act to partially shield the underlying polymer nozzle member from the laser energy. This partial shielding of the nozzle member under the dot pattern results in the nozzle member being ablated to less of a depth than where there is no shielding. By selecting the proper density of opaque dots around the peripheral portions of the mask openings, the central portion of each nozzle formed in the polymer nozzle member will be completely ablated through, and the peripheral portions of the nozzle will be only partially ablated through. By increasing the density of dots toward the periphery of each mask opening, the resulting nozzle may be formed to have any tapered shape. Other mask patterns are also described.
摘要:
A signal swing trimming apparatus calibrates a swing level of an output signal generated from a transmitting device to a receiving device including: a comparing device coupled to the output signal for comparing the swing level of the output signal with a target swing level and generating a comparison output signal, and an adjusting device coupled to the comparing device and the transmitting device for controlling the transmitting device to adjust the swing level of the output signal according to the comparison output signal, wherein the signal swing trimming apparatus is configured to calibrate the swing level of the output signal during a hand-shake process between the transmitting device and the receiving device.
摘要:
A liquid crystal display device includes a light guide plate, a light source module, a first tape, a circuit board holder and an elastic support piece, an optical film, a panel, and an elastic buffer piece. By implement of the liquid crystal display device of this invention, the thickness and the weight of the liquid crystal display device can be reduced.
摘要:
The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a substrate, a first capacitor, a first protective layer, a first metal layer and a second protective layer. The substrate has at least one via structure. The first capacitor is disposed on a first surface of the substrate. The first protective layer encapsulates the first capacitor. The first metal layer is disposed on the first protective layer, and includes a first inductor. The second protective layer encapsulates the first inductor. Whereby, the first inductor, the first capacitor and the via structure are integrated into the semiconductor package, so that the size of the product is reduced.
摘要:
An alarm device includes a first detecting unit and a controlling unit. The first detecting unit has an isolating circuit, a first enabling circuit, a second enabling circuit and an output circuit. The isolating circuit generates an adjusting signal according to an input signal. The first enabling circuit generates a first enabling signal according to the adjusting signal. The second enabling circuit generates a second enabling signal according to the first enabling signal. The output circuit outputs a first detecting signal according to the second enabling signal. The controlling unit outputs a control signal according to the first detecting signal. The control signal controls an electronic device to operate under a standby mode when the first detecting signal refers to an abnormal status.
摘要:
A general winding and feeding apparatus includes a rotating shaft on the upper side of a standing wall of a base, and a motor is connected to the rotating shaft in the standing wall. A swing arm extends across a traveling material and is situated at a suitable position on the standing wall. Digital variable frequency methods may be used to drive the motor, which operates in conjunction with light-coupled sensors to detect the traveling speed of a material on the swing arm and sense a swing position of the swing arm. Feedback is generated in real-time to modify the speed of the motor, and the constant speed travel of the material can be achieved while being either wound or unwound.
摘要:
In one embodiment, a fluid ejector structure includes an orifice sub-structure and an ejector element sub-structure direct contact bonded together along a direct contact bonding interface. The orifice sub-structure has a plurality of orifices therein. Each orifice is positioned adjacent to a corresponding one of a plurality of fluid ejection elements on the ejector element sub-structure.
摘要:
A microfluidic device includes first and second substrates bonded together. The first substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second substrate is bonded to the second opposed surface of the first substrate whereby an outlet of a channel formed in the second substrate substantially aligns with the through slot. The channel of the second substrate has an inlet that is larger than the outlet.
摘要:
The present invention relates to a semiconductor package and a method for making the same. The semiconductor package comprises a substrate, a first metal layer, a first dielectric layer, a first upper electrode, a first protective layer, a second metal layer and a second protective layer. The substrate has at least one via structure. The first metal layer is disposed on a first surface of the substrate, and comprises a first lower electrode. The first dielectric layer is disposed on the first lower electrode. The first upper electrode is disposed on the first dielectric layer, and the first upper electrode, the first dielectric layer and the first lower electrode form a first capacitor. The first protective layer encapsulates the first capacitor. The second metal layer is disposed on the first protective layer, and comprises a first inductor. The second protective layer encapsulates the first inductor. Whereby, the first inductor, the first capacitor and the via structure are integrated into the semiconductor package, so that the size of the product is reduced.