摘要:
An array display may be formed of panels that include a resilient material positioned around their edges. The resilient material may be black to promote a seamless appearance. Because the material is resilient, it may facilitate the interconnection of panels to form the array, preventing damage during assembly or thereafter.
摘要:
An optically addressed spatial light modulator may be formed with an integrated light emitting device display. The light emitting device display may be formed of a size and cost that optimizes the overall modulator design. In addition, by integrating the modulator and display devices, the overall size of the spatial light modulator may be reduced in some embodiments.
摘要:
An avalanche photodiode (APD) has a two tier passivation layer disposed over the silicon APD body. The passivation layer includes an inorganic moisture barrier layer and an organic dielectric layer. The inorganic material forming this layer is preferably silicon nitride or silicon oxide, and the organic dielectric material is a polyimide or benzocyclobutene.
摘要:
A method of fabricating a thin film transistor (TFT) includes the steps of forming a gate conductor on a substrate; depositing a gate dielectric layer of silicon nitride over the gate conductor; treating the exposed silicon nitride on the surface of the gate dielectric layer with a hydrogen plasma at a power level of at least 44 mW/cm.sup.2 for at least 5 minutes; depositing a layer of amorphous silicon semiconductor material over the gate dielectric layer; depositing a layer of n+ doped silicon over the treated amorphous silicon surface; depositing a layer of source/drain metallization over the n+ doped layer; and patterning the source/drain metallization and portions of the underlying n+ doped layer to form source and drain electrodes. The deposition of the TFT material layers and the hydrogen plasma treatment is preferably by plasma enhanced chemical vapor deposition.
摘要:
A radiation imager comprises a scintillator mated to a photodetector array. An enclosure ring is disposed around the outer sidewalls of the scintillator and an enclosure ring cover hermetically bonded to the ring extends across the scintillator to form a chamber sealably enclosing the scintillator. The enclosure ring cover is substantially impervious to moisture, is radiation transmissive, and minimizes scattering of light from the scintillator. The cover may be optically reflective or light absorptive. The chamber is evacuated to draw the cover in towards the photodetector array and thus to ensure close contact between the cover and the scintillator and between the scintillator and the photodetector array. Desiccant can be disposed in the chamber to provide additional protection against moisture absorption by the scintillator.