公开(公告)号：US06465277B2

公开(公告)日：2002-10-15

申请号：US09854488

申请日：2001-05-15

申请人： Shih-Chang Lee ,  Gwo Liang Weng

发明人： Shih-Chang Lee ,  Gwo Liang Weng

IPC分类号： H01L2144

CPC分类号： B29C45/14655 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  Y10T428/234 ,  Y10T428/24612 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A molding apparatus for use in forming a flexible substrate based package comprises a plurality of pots. Two flexible substrates are installed at two sides of the pots. A plurality of sets of chips mounted on the upper surface of the substrate wherein each set of chips is in an array arrangement. The molding apparatus further comprises a plurality of runners. Each runner independently extends from one side of the pot to one side of the substrate, and connects to a cavity of a upper part of a mold disposed on the substrate through a gate. The present invention characterized in that, the molding apparatus is provided with a first communication channel formed corresponding to one side of the substrate and a second communication channel formed corresponding to the other side of the substrate. The first and the second communication channels interconnect the cavities at two opposite sides thereof. Therefore, the molded product removed from the mold has a first and a second connection bar, which form interconnection at two opposite sides of each unit package body thereby integrating all unit package bodies, and thereby enhancing the mechanical strength of the molded product.

摘要翻译： 用于形成基于柔性基底的包装的成型装置包括多个盆。 两个柔性基板安装在锅的两侧。 安装在基板的上表面上的多组芯片，其中每组芯片是阵列布置。 成型装置还包括多个流道。 每个流道独立地从罐的一侧延伸到基板的一侧，并且通过浇口连接到设置在基板上的模具的上部的空腔。 本发明的特征在于，所述成型装置设置有与所述基板的一侧对应地形成的第一连通流路和与所述基板的另一侧对应地形成的第二连通流路。 第一和第二通信通道将空腔的两个相对侧互连。 因此，从模具中取出的模制产品具有第一和第二连接杆，其在每个单元封装主体的两个相对侧形成互连，从而整合所有单元封装主体，从而增强模制产品的机械强度。

公开(公告)号：US06242815B1

公开(公告)日：2001-06-05

申请号：US09455918

申请日：1999-12-07

申请人： Kao-Yu Hsu ,  Shih-Chang Lee

发明人： Kao-Yu Hsu ,  Shih-Chang Lee

IPC分类号： H01L2348

CPC分类号： H05K1/0271 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K2201/0394 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2203/0315 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A flexible substrate based BGA package mainly comprises a semiconductor chip securely attached onto a flexible film substrate through a nonconductive adhesive. The flexible film substrate is formed from a flexible film having a chip attaching area for carrying the semiconductor chip. The upper surface of the flexible film is provided with a plurality of chip connection pads, a plurality of solder pads, and at least a dummy pad which is disposed centrally on the chip attaching area. The purpose of the dummy pad is to increase the rigidity and strength of the central part of the chip attaching area. The chip connection pads are arranged about the periphery of the chip attaching area for electrically connected to the semiconductor chip. The solder pads are disposed about the dummy pad(s) and electrically connected to the corresponding chip connection pads. The flexible film has a plurality of through-holes formed corresponding to the solder pads such that each solder pad has a portion exposed within the corresponding through-hole for mounting a solder ball. A package body is formed over the semiconductor chip and the upper surface of the flexible film substrate.

摘要翻译： 基于柔性基板的BGA封装主要包括通过非导电粘合剂牢固地附接到柔性膜基底上的半导体芯片。 柔性膜基板由具有用于承载半导体芯片的芯片附着区域的柔性膜形成。 柔性膜的上表面设置有多个芯片连接焊盘，多个焊盘和至少设置在芯片安装区域中央的虚拟焊盘。 虚拟焊盘的目的是增加芯片安装区域的中心部分的刚度和强度。 芯片连接焊盘围绕芯片安装区域的周边布置以电连接到半导体芯片。 焊盘围绕虚拟焊盘设置并电连接到相应的芯片连接焊盘。 柔性膜具有与焊料焊盘相对形成的多个通孔，使得每个焊盘具有暴露在相应通孔内的部分，用于安装焊球。 在半导体芯片和柔性膜基板的上表面上形成封装体。