High-speed avalanche light emitting diode (ALED) and related apparatus and method
    52.
    发明授权
    High-speed avalanche light emitting diode (ALED) and related apparatus and method 有权
    高速雪崩发光二极管(ALED)及相关设备及方法

    公开(公告)号:US08344394B1

    公开(公告)日:2013-01-01

    申请号:US12584904

    申请日:2009-09-15

    CPC classification number: H01L33/0012 H01L33/34 H01L33/647

    Abstract: A circuit includes multiple doped regions in a substrate. A first of the doped regions has a tip proximate to a second of the doped regions and is separated from the second doped region by an intrinsic region to form a P-I-N structure. The circuit also includes first and second electrodes electrically coupled to the first and second doped regions, respectively. The electrodes are configured to supply voltages to the first and second doped regions to reverse bias the P-I-N structure and generate light. The first doped region could include multiple tips, the second doped region could include multiple tips, and each tip of the first doped region could be proximate to one of the tips of the second doped region to form multiple P-I-N structures. The P-I-N structure could also be configured to operate in double avalanche injection conductivity mode with internal positive feedback.

    Abstract translation: 电路包括衬底中的多个掺杂区域。 掺杂区域中的第一个具有靠近第二掺杂区域的尖端,并且与第二掺杂区域分离出本征区域以形成P-I-N结构。 电路还包括分别电耦合到第一和第二掺杂区域的第一和第二电极。 电极被配置为向第一和第二掺杂区域提供电压以反向偏置P-I-N结构并产生光。 第一掺杂区域可以包括多个尖端,第二掺杂区域可以包括多个尖端,并且第一掺杂区域的每个尖端可以接近第二掺杂区域的尖端之一以形成多个P-I-N结构。 P-I-N结构也可以被配置为在具有内部正反馈的双雪崩注入电导模式下工作。

    Apparatus and method for precision trimming of integrated circuits using anti-fuse bond pads
    56.
    发明授权
    Apparatus and method for precision trimming of integrated circuits using anti-fuse bond pads 有权
    使用反熔丝接合焊盘精密修整集成电路的装置和方法

    公开(公告)号:US07301436B1

    公开(公告)日:2007-11-27

    申请号:US11274491

    申请日:2005-11-14

    Abstract: An apparatus and method for using anti-fuse bond pads used to provide trimmed resistor values to the input terminals of circuits on an integrated circuit die. The apparatus and method comprises fabricating on a semiconductor integrated circuit a resistive network. The resistive network includes a first terminal, a second terminal and a resistor coupled between the two terminals. An anti-fuse bond pad and a trimming resistor are coupled between the first terminal and the second terminal. The trimming resistor is configured to be electrically coupled between the first terminal and the second terminal when a ball bond is formed on the anti-fuse bond pad. In various embodiments, a plurality of the anti-fuse bond pads and trimming resistors may be coupled between the two terminals. By selectively forming ball bonds on the plurality of anti-fuse bond pads, the resistance of the network can be selectively trimmed as needed.

    Abstract translation: 一种用于使用反熔丝接合焊盘的装置和方法,用于向集成电路管芯上的电路的输入端提供修整的电阻值。 该装置和方法包括在半导体集成电路上制造电阻网络。 电阻网络包括耦合在两个端子之间的第一端子,第二端子和电阻器。 反熔丝接合焊盘和微调电阻耦合在第一端子和第二端子之间。 当在反熔丝接合焊盘上形成球焊时,微调电阻被配置为电耦合在第一端子和第二端子之间。 在各种实施例中,多个反熔丝接合焊盘和微调电阻器可以耦合在两个端子之间。 通过在多个反熔丝接合焊盘上选择性地形成球键,可以根据需要选择性地修整网络的电阻。

    Single NMOS device memory cell and array
    59.
    发明授权
    Single NMOS device memory cell and array 有权
    单个NMOS器件存储单元和阵列

    公开(公告)号:US07221608B1

    公开(公告)日:2007-05-22

    申请号:US10957986

    申请日:2004-10-04

    CPC classification number: G11C11/406 G11C11/403 G11C2211/4065

    Abstract: The snapback characteristics of the parasitic NPN structure inside an NMOS device are used to write and store information in the device by periodically triggering the device from the high impedance state to the low impedance state using the self turn-on characteristics of the device under elevated voltage. To minimize power consumption, and thus overheating, in the “on” state, a pulsed mode operation is combined with dV/dt triggering powering the device at a constant Vdd pulse amplitude.

    Abstract translation: NMOS器件内的寄生NPN结构的快速恢复特性用于通过在高电压下使器件的自启动特性周期性地将器件从高阻抗状态触发到低阻抗状态来将信息写入和存储在器件中 。 为了最小化功率消耗并因此过热,在“导通”状态下,将脉冲模式操作与dV / dt触发相结合,以恒定的Vdd脉冲幅度向器件供电。

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