Abstract:
The cost and size of an atomic magnetometer are reduced by attaching a vapor cell structure that has a vapor cell cavity to a base die that has a laser light source that outputs light to the vapor cell cavity, and attaching a photo detection die that has a photodiode to the vapor cell structure to detect light from the laser light source that passes through the vapor cell cavity.
Abstract:
A circuit includes multiple doped regions in a substrate. A first of the doped regions has a tip proximate to a second of the doped regions and is separated from the second doped region by an intrinsic region to form a P-I-N structure. The circuit also includes first and second electrodes electrically coupled to the first and second doped regions, respectively. The electrodes are configured to supply voltages to the first and second doped regions to reverse bias the P-I-N structure and generate light. The first doped region could include multiple tips, the second doped region could include multiple tips, and each tip of the first doped region could be proximate to one of the tips of the second doped region to form multiple P-I-N structures. The P-I-N structure could also be configured to operate in double avalanche injection conductivity mode with internal positive feedback.
Abstract:
A silicon-based light emitting structure is formed as a high density array of light-emitting p-n junctions that substantially increases the intensity of the light emitted in a planar region. The p-n junctions are formed using standard CMOS processing methods, and emit light in response to applied voltages that generate avalanche breakdown and an avalanche current.
Abstract:
A silicon-based light emitting structure is formed as a high density array of light-emitting p-n junctions that substantially increases the intensity of the light emitted in a planar region. The p-n junctions are formed using standard CMOS processing methods, and emit light in response to applied voltages that generate avalanche breakdown and an avalanche current.
Abstract:
In a fuse-based programmable circuit block, the poly-fuse is burned out by making use of a snapback device connected in series with the poly-fuse.
Abstract:
An apparatus and method for using anti-fuse bond pads used to provide trimmed resistor values to the input terminals of circuits on an integrated circuit die. The apparatus and method comprises fabricating on a semiconductor integrated circuit a resistive network. The resistive network includes a first terminal, a second terminal and a resistor coupled between the two terminals. An anti-fuse bond pad and a trimming resistor are coupled between the first terminal and the second terminal. The trimming resistor is configured to be electrically coupled between the first terminal and the second terminal when a ball bond is formed on the anti-fuse bond pad. In various embodiments, a plurality of the anti-fuse bond pads and trimming resistors may be coupled between the two terminals. By selectively forming ball bonds on the plurality of anti-fuse bond pads, the resistance of the network can be selectively trimmed as needed.
Abstract:
In an EEPROM array the cells are pre-charged or pre-erased so that they will respond uniformly to the same read voltage level. By clearly defining the threshold voltage for the cells in their erased states and in their programmed states, it is possible to define more than one read voltage and thus provide cells that an store multiple values and even analog values.
Abstract:
A micro-electromechanical system (MEMS) inductor is formed in a saucer shape that completely surrounds a magnetic core structure which is formed from a ferromagnetic material. In addition, an array of MEMS inductors can be formed by dividing up the saucer-shaped MEMS inductor into a number of electrically-isolated MEMS inductor wedges.
Abstract:
The snapback characteristics of the parasitic NPN structure inside an NMOS device are used to write and store information in the device by periodically triggering the device from the high impedance state to the low impedance state using the self turn-on characteristics of the device under elevated voltage. To minimize power consumption, and thus overheating, in the “on” state, a pulsed mode operation is combined with dV/dt triggering powering the device at a constant Vdd pulse amplitude.
Abstract:
In a method and structure for a high voltage LDMOS with reduced hot carrier degradation, the thick field oxide is eliminated and a reduced surface field achieved instead by including adjacent p+ and n+ regions in the drain well and shorting these regions to each other, or by including a p+ region in the drain well and biasing it to a positive voltage relative to the source voltage.