摘要:
To provide a semiconductor manufacturing apparatus that can easily and quickly monitor and analyze the state of a semiconductor processing apparatus and a method for assisting the monitoring and analysis thereof. A semiconductor manufacturing apparatus includes: detecting means 7, 8 that detects, as a plurality of state signals, at least either of a plurality of spectra obtained by separating plasma light emission generated in a processing chamber 2 of a semiconductor processing apparatus 1 or a plurality of apparatus state signals that indicate states of the apparatus; apparatus event information output means 9 that outputs the state of the semiconductor processing apparatus in a current process step; conversion means 14, 17, 18 that converts a combination of the plurality of state signals detected by the detecting means 7, 8 into respective particular figures; and display position controlling means 20 that displays the figures generated by the conversion means 14, 17, 18 at predetermined display positions associated with the process step.
摘要:
A monitor data acquisition section acquires a plurality of monitor data relating to a processing state of one sample in a processing apparatus, via sensors. A data selection section selects monitor data belonging to an arbitrary processing division included in a plurality of processing divisions for the sample, from among the plurality of monitor data. A monitoring signal generation section generates monitoring signals based on the monitor data belonging to the arbitrary processing division selected by the data selection section. A display setting controller displays a plurality of monitoring signals obtained with respect to samples processed in the processing apparatus, on a display section in a time series manner.
摘要:
A semiconductor processing apparatus for processing a semiconductor wafer includes a sensor for monitoring a processing state of the semiconductor processing apparatus, a processing result input unit which inputs measured values for processing results of a semiconductor wafer processed by the semiconductor processing apparatus, and a model equation generation unit relying on sensed data acquired by the sensor and the measured values to generate a model equation for predicting a processing result using the sensed data as an explanatory variable. The apparatus includes a processing result prediction unit which predicts a processing result based on the model equation and the sensed data, and a process recipe control unit which compares the predicted processing result with a previously set value to control a processing condition. The process recipe control unit includes a controller which controls at least one among a plurality of different processing performances for processing of the semiconductor wafer.
摘要:
A monitor data acquisition section acquires a plurality of monitor data relating to a processing state of one sample in a processing apparatus, via sensors. A data selection section selects monitor data belonging to an arbitrary processing division included in a plurality of processing divisions for the sample, from among the plurality of monitor data. A monitoring signal generation section generates monitoring signals based on the monitor data belonging to the arbitrary processing division selected by the data selection section. A display setting controller displays a plurality of monitoring signals obtained with respect to samples processed in the processing apparatus, on a display section in a time series manner.
摘要:
A vacuum processing method and apparatus processing units for conducting processing, a transfer processing unit connected with the plurality of processing units for carrying wafers, and a control unit for controlling the processing units. A processing order information storing device stores a processing order of the wafers for the processing units, an operational information signal generating device generates an operational information signal indicating an operable or inoperable state of each of the processing units, an operational information signal storing device stores the operational information signal indicating the state of each of the processing units, and a control device matches and processes the processing order information and the operational information signal, and continues operation without using an inoperable processing unit while using other operable processing units.
摘要:
A data processing apparatus for a semiconductor manufacturing apparatus includes a semiconductor manufacturing apparatus for executing processing for a wafer, a data collecting semiconductor device for collecting processing data generated in association with the processing, and a data copying semiconductor device for extracting the processing data collected in the data collecting semiconductor device and for producing a copy of the processing data. The apparatus may include a data analyzer for analyzing the data copy produced by the data copying semiconductor device and for diagnosing a processing state of the processing apparatus.
摘要:
A method of operating a vacuum processing system including a plurality of processing units for processing wafers, a transferring unit for carrying the wafers and a control unit for controlling the processing units and the transferring unit. At least two of the plurality of processing units are connected to the transferring unit and wafers are processed using the processing units. The method includes the steps of judging whether each of the processing units is operable or inoperable, isolating inoperable ones of the processing units judged in the judging step from wafer processing, carrying wafers to operable ones of the processing units using the transferring unit and processing the wafers using only the operable processing units.
摘要:
A vacuum processing system including two or more processing units for processing wafers and a transferring unit for carrying the wafers. In this system, even when any one of the processing units becomes inoperable because of a failure, the operation of the system can be continued, and even when a processing unit in the system requires repair or maintenance at the time of the start of operation, the system can be operated using other operable processing units without subjecting the operator to danger due to improper operation. As a result, the working efficiency of the system can be increased and the safety of the operator can be secured. In this system, the cleaning of the interior of each processing unit is performed by carrying a cleaning dummy wafer into each processing unit using the transferring unit, followed by recovery of the dummy wafer after cleaning, so that processing of wafers in the processing unit can be carried out once again.