HIGHLY INTEGRATED POWER ELECTRONIC MODULE ASSEMBLY
    53.
    发明申请
    HIGHLY INTEGRATED POWER ELECTRONIC MODULE ASSEMBLY 审中-公开
    高集成度功率电子模块组件

    公开(公告)号:US20150016062A1

    公开(公告)日:2015-01-15

    申请号:US13940836

    申请日:2013-07-12

    IPC分类号: H05K7/20

    摘要: A power electronic module assembly according to an exemplary aspect of the present disclosure includes, among other things, a vapor chamber and a substrate integrated with a first surface of the vapor chamber. At least one cooling feature is integrated with a second surface of the vapor chamber.

    摘要翻译: 根据本公开的示例性方面的电力电子模块组件尤其包括与蒸气室的第一表面一体化的蒸气室和基板。 至少一个冷却特征与蒸气室的第二表面一体化。