公开(公告)号：US10172244B1

公开(公告)日：2019-01-01

申请号：US15975726

申请日：2018-05-09

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Matteo Cocchini ,  Kyle I. Giesen

IPC: H05K3/42 ,  H05K1/11 ,  H05K3/46 ,  H05K3/06

Abstract: Method of constructing a printed circuit board, preferably with one lamination step: constructing multilayer cores wherein each multilayer core includes a sheet of cured dielectric material having a layer of metal on each side of the sheet of cured dielectric material; patterning each layer of metal to form wiring traces; forming a sheet of uncured dielectric material; embedding a solder element in the sheet of the uncured dielectric material; alternately stacking the multilayer cores with the sheets of uncured dielectric material, the sheet of the uncured dielectric material having the embedded solder element positioned so as to be aligned with wiring traces in adjacent layers of metal in adjacent multilayer cores; heating the solder element so as to cause the solder element to melt; and hot pressing the stack of multilayer cores and sheets of uncured dielectric material to cause curing of the sheets of uncured dielectric material.

公开(公告)号：US20180224908A1

公开(公告)日：2018-08-09

申请号：US15945881

申请日：2018-04-05

Applicant: International Business Machines Corporation

Inventor： Matteo Cocchini ,  Michael A. Cracraft ,  Khaalid P. J. McMillan ,  Arushi Shahani ,  John G. Torok

IPC: G06F1/18

CPC classification number: G06F1/183

Abstract: An apparatus includes a cassette. The cassette includes a carriage. The carriage is retained internally to the cassette. The apparatus further includes a booklet assembly. The booklet assembly includes a cable connector. The cable connector is affixed internally to the booklet assembly. The cassette is configured for insertion into the booklet assembly. The apparatus further includes a cable assembly. The cable assembly is configured for insertion into the cable connector. The carriage is configured for retaining the cable assembly. In an aspect, a method of using the apparatus includes preloading the cable assembly into the carriage, inserting the cassette into the booklet assembly, and configuring the carriage such that the cable assembly is inserted into the cable connector and retained in an inserted position by the carriage.

公开(公告)号：US20180224907A1

公开(公告)日：2018-08-09

申请号：US15945869

申请日：2018-04-05

Applicant: International Business Machines Corporation

Inventor： Matteo Cocchini ,  Michael A. Cracraft ,  Khaalid P. J. McMillan ,  Arushi Shahani ,  John G. Torok

IPC: G06F1/18

CPC classification number: G06F1/183

Abstract: An apparatus includes a cassette. The cassette includes a carriage. The carriage is retained internally to the cassette. The apparatus further includes a booklet assembly. The booklet assembly includes a cable connector. The cable connector is affixed internally to the booklet assembly. The cassette is configured for insertion into the booklet assembly. The apparatus further includes a cable assembly. The cable assembly is configured for insertion into the cable connector. The carriage is configured for retaining the cable assembly. In an aspect, a method of using the apparatus includes preloading the cable assembly into the carriage, inserting the cassette into the booklet assembly, and configuring the carriage such that the cable assembly is inserted into the cable connector and retained in an inserted position by the carriage.

公开(公告)号：US09972566B2

公开(公告)日：2018-05-15

申请号：US15336884

申请日：2016-10-28

Applicant: International Business Machines Corporation

Inventor： Zhaoqing Chen ,  Matteo Cocchini ,  Rohan U. Mandrekar ,  Tingdong Zhou

IPC: H01L23/498 ,  H01L23/528 ,  H04B3/32 ,  H01P3/02 ,  H01P3/08 ,  H05K1/02 ,  H04B1/00 ,  H01L23/66

CPC classification number: H01L23/49838 ,  H01L23/528 ,  H01L23/66 ,  H01L2223/6627 ,  H01P3/02 ,  H01P3/026 ,  H01P3/081 ,  H04B1/00 ,  H04B3/32 ,  H05K1/0216 ,  H05K1/0245

Abstract: An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair.

公开(公告)号：US20180088157A1

公开(公告)日：2018-03-29

申请号：US15275532

申请日：2016-09-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Matteo Cocchini ,  Michael A. Cracraft

IPC: G01R19/165 ,  G01R31/28 ,  G01R1/20

CPC classification number: G01R19/16576 ,  G01R1/206 ,  G01R19/0053

Abstract: An apparatus and method for detecting transient voltage at an electrical component of a circuit board is provided. The apparatus including a circuit including a comparator and a latch, wherein a first input of the comparator is electrically coupled to the electrical component, and the comparator receives a threshold voltage at a second input, where the comparator outputs either a high signal or a low signal in response to both the first input and the second input, and an output of the comparator is electrically coupled to an input of the latch such that the latch outputs a high signal in response to receiving a high signal from the comparator, and an indicator electrically coupled to an output of the latch, and where the apparatus is mounted non-permanently to the circuit board to provide a non-permanent electrical coupling between the comparator and the electrical component.

公开(公告)号：US20180068048A1

公开(公告)日：2018-03-08

申请号：US15813233

申请日：2017-11-15

Applicant: International Business Machines Corporation

Inventor： Sungjun Chun ,  Matteo Cocchini ,  Michael A. Cracraft

IPC: G06F17/50

CPC classification number: G06F17/5072 ,  G06F17/5077 ,  G06F17/5081 ,  G06F2217/12 ,  Y02P90/265

Abstract: One aspect includes identifying via groups that each includes a ratio of a plurality of signal vias to one ground via based on a design file defining a layout of a multi-layer circuit board. A genetic via placement solver iteratively evaluates potential placement solutions that adjust a placement of one or more of the signal vias until at least one solution is identified that meets one or more placement criteria of the signal vias. The genetic via placement solver performs a mutation and recombination of one or more solutions that do not meet the one or more placement criteria and re-evaluates the one or more solutions that do not meet the one or more placement criteria. The design file is modified to include at least one shifted signal via position based on identifying the at least one solution that meets the one or more placement criteria.

公开(公告)号：US20180060478A1

公开(公告)日：2018-03-01

申请号：US15800151

申请日：2017-11-01

Applicant: International Business Machines Corporation

Inventor： Sungjun Chun ,  Matteo Cocchini ,  Michael A. Cracraft

IPC: G06F17/50

CPC classification number: G06F17/5077

Abstract: One aspect is a method that includes identifying a substantially uniform distribution of signal vias for a multi-layer circuit board based on a design file defining a layout. A signal via pitch is determined as a center-to-center distance between a neighboring pair of signal vias. The signal via pitch is compared to a target minimum drilling distance. A ground via is identified proximate the neighboring pair of the signal vias. Based determining that the signal via pitch of the neighboring pair is less than the target minimum drilling distance, at least one of the signal vias is positioned closer to the ground via such that after the positioning, the signal via pitch of the neighboring pair meets or exceeds the target minimum drilling distance. The design file is modified to include the positioning of the signal vias and is transmitted over a network to support circuit board manufacturing operations.

公开(公告)号：US09881115B2

公开(公告)日：2018-01-30

申请号：US15139653

申请日：2016-04-27

Applicant: International Business Machines Corporation

Inventor： Sungjun Chun ,  Matteo Cocchini ,  Michael A. Cracraft

IPC: G06F17/50

CPC classification number: G06F17/5072 ,  G06F17/5081

Abstract: One aspect includes identifying via groups that each includes a ratio of a plurality of signal vias to one ground via based on a design file defining a layout of a multi-layer circuit board. A genetic via placement solver iteratively evaluates potential placement solutions that adjust a placement of one or more of the signal vias until at least one solution is identified that meets one or more placement criteria of the signal vias. The genetic via placement solver performs a mutation and recombination of one or more solutions that do not meet the one or more placement criteria and re-evaluates the one or more solutions that do not meet the one or more placement criteria. The design file is modified to include at least one shifted signal via position based on identifying the at least one solution that meets the one or more placement criteria.

公开(公告)号：US09875331B2

公开(公告)日：2018-01-23

申请号：US15430970

申请日：2017-02-13

Applicant: International Business Machines Corporation

Inventor： Sungjun Chun ,  Matteo Cocchini ,  Michael A. Cracraft

IPC: G06F17/50

CPC classification number: G06F17/5072 ,  G06F17/5081

Abstract: One aspect includes identifying via groups that each includes a ratio of a plurality of signal vias to one ground via based on a design file defining a layout of a multi-layer circuit board. A genetic via placement solver iteratively evaluates potential placement solutions that adjust a placement of one or more of the signal vias until at least one solution is identified that meets one or more placement criteria of the signal vias. The genetic via placement solver performs a mutation and recombination of one or more solutions that do not meet the one or more placement criteria and re-evaluates the one or more solutions that do not meet the one or more placement criteria. The design file is modified to include at least one shifted signal via position based on identifying the at least one solution that meets the one or more placement criteria.

公开(公告)号：US20170269643A1

公开(公告)日：2017-09-21

申请号：US15071440

申请日：2016-03-16

Applicant: International Business Machines Corporation

Inventor： Matteo Cocchini ,  Michael A. Cracraft ,  Khaalid P. J. McMillan ,  Arushi Shahani ,  John G. Torok

IPC: G06F1/18

CPC classification number: G06F1/183

Abstract: An apparatus includes a cassette. The cassette includes a carriage. The carriage is retained internally to the cassette. The apparatus further includes a booklet assembly. The booklet assembly includes a cable connector. The cable connector is affixed internally to the booklet assembly. The cassette is configured for insertion into the booklet assembly. The apparatus further includes a cable assembly. The cable assembly is configured for insertion into the cable connector. The carriage is configured for retaining the cable assembly. In an aspect, a method of using the apparatus includes preloading the cable assembly into the carriage, inserting the cassette into the booklet assembly, and configuring the carriage such that the cable assembly is inserted into the cable connector and retained in an inserted position by the carriage.