公开(公告)号：US20170046334A1

公开(公告)日：2017-02-16

申请号：US15043542

申请日：2016-02-13

Applicant: International Business Machines Corporation

Inventor： Samuel R. Connor ,  Jonathan W. Jackson ,  Joseph Kuczynski

IPC: G06F17/28

CPC classification number: G06F17/2809 ,  G06F17/274 ,  G06F17/2785 ,  G06F17/2881

Abstract: Disclosed aspects include initiating an electronic communication configured to be transmitted to a first intended recipient. Based on a set of profile data, a first cultural indicator may be identified for the first intended recipient. Using a natural language processing technique, a cultural element of the electronic communication may be detected. Based on both the first cultural indicator and the cultural element, a first cultural-version of the cultural element may be determined for the first intended recipient. Using the first cultural-version, a cultural translation object may be established in the electronic communication. In response to establishing the cultural translation object in the electronic communication, the electronic communication may be transmitted to the first intended recipient.

Abstract translation: 公开的方面包括启动被配置为被发送到第一预期接收者的电子通信。 基于一组简档数据，可以为第一预期接收者识别第一文化指示符。 使用自然语言处理技术，可以检测电子通信的文化元素。 基于第一个文化指标和文化元素，可以确定第一个文化元素的第一个文化元素。 使用第一个文化版本，可以在电子通信中建立一个文化翻译对象。 为了响应在电子通信中建立文化翻译对象，可以将电子通信传送到第一预期接收者。

公开(公告)号：US09421455B1

公开(公告)日：2016-08-23

申请号：US14980145

申请日：2015-12-28

Applicant: International Business Machines Corporation

Inventor： Samuel R. Connor ,  Jonathan W. Jackson ,  Joseph Kuczynski

IPC: A63F13/00 ,  A63F13/80 ,  G06N3/00

CPC classification number: A63F13/67 ,  A63F13/00 ,  A63F13/42 ,  A63F13/80 ,  A63F13/822 ,  A63F13/843 ,  A63F13/847 ,  A63F2300/5553 ,  G06N3/006

Abstract: An avatar in a video game is controlled based on input from multiple users. An input composition system receives a first input from a first user. The first user uses a first input source for controlling the avatar. The input composition system receives a second input from a second user. The second user users a second input source for controlling the avatar. The input composition system alters the first input based on a first user performance modifier. The input composition system alters the second input based on a second user performance modifier. The input composition system creates an avatar input value based on the first altered input and the second altered input. The input composition directs the avatar in the video game based on the avatar input value.

Abstract translation: 基于来自多个用户的输入来控制视频游戏中的化身。 输入构图系统从第一用户接收第一输入。 第一个用户使用第一个输入源来控制化身。 输入组合系统从第二用户接收第二输入。 第二用户使用第二输入源来控制化身。 输入组合系统基于第一用户性能修改器改变第一输入。 输入组合系统基于第二用户性能修改器改变第二输入。 输入构图系统基于第一改变输入和第二改变输入创建化身输入值。 输入组合基于化身输入值指导视频游戏中的化身。

公开(公告)号：US09245854B2

公开(公告)日：2016-01-26

申请号：US14515597

申请日：2014-10-16

Applicant: International Business Machines Corporation

Inventor： William L. Brodsky ,  Timothy W. Budell ,  Samuel R. Connor ,  Mark Curtis Hayes Lamorey ,  Janak G. Patel ,  Peter Slota, Jr. ,  David B. Stone

IPC: H01L23/552 ,  H01L23/29 ,  H05K3/28 ,  H05K9/00 ,  H01L21/50 ,  H01L23/31 ,  H01L23/053

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L23/053 ,  H01L23/295 ,  H01L23/3128 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16172 ,  H01L2924/16178 ,  H01L2924/16179 ,  H01L2924/167 ,  H01L2924/1676 ,  H01L2924/16793 ,  H01L2924/16798 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/284 ,  H05K9/0081 ,  Y10T29/49128 ,  H01L2924/014

Abstract: Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An EMI shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.

Abstract translation: 用于电子封装的装置和方法，其包含防止电磁干扰（EMI）发射的屏蔽。 根据集成电路结构，衬底在印刷电路板上。 集成电路芯片在基板上。 集成电路芯片电连接到基板。 EMI屏蔽单元位于集成电路芯片和基板上。 EMI屏蔽单元包括覆盖集成电路芯片的盖和集成电路芯片外的基板的部分。 填充材料可以沉积在形成在盖和基底之间的空腔内。 填充材料包括EMI吸收材料。 盖的周边包括侧裙，侧裙围绕集成电路芯片和衬底。 EMI吸收材料在印刷电路板上，并且侧裙的一部分嵌入在EMI吸收材料中。

公开(公告)号：US08952503B2

公开(公告)日：2015-02-10

申请号：US13752737

申请日：2013-01-29

Applicant: International Business Machines Corporation

Inventor： William L. Brodsky ,  Timothy W. Budell ,  Samuel R. Connor ,  Mark Curtis Hayes Lamorey ,  Janak G. Patel ,  Peter Slota, Jr. ,  David B. Stone

IPC: H01L23/552 ,  H01L23/29 ,  H01L21/50 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L23/053 ,  H01L23/295 ,  H01L23/3128 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16172 ,  H01L2924/16178 ,  H01L2924/16179 ,  H01L2924/167 ,  H01L2924/1676 ,  H01L2924/16793 ,  H01L2924/16798 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/284 ,  H05K9/0081 ,  Y10T29/49128 ,  H01L2924/014

Abstract: Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An electromagnetic interference (EMI) shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.

Abstract translation: 用于电子封装的装置和方法，其包含防止电磁干扰（EMI）发射的屏蔽。 根据集成电路结构，衬底在印刷电路板上。 集成电路芯片在基板上。 集成电路芯片电连接到基板。 电磁干扰（EMI）屏蔽单元位于集成电路芯片和基板上。 EMI屏蔽单元包括覆盖集成电路芯片的盖和集成电路芯片外的基板的部分。 填充材料可以沉积在形成在盖和基底之间的空腔内。 填充材料包括EMI吸收材料。 盖的周边包括侧裙，侧裙围绕集成电路芯片和衬底。 EMI吸收材料在印刷电路板上，并且侧裙的一部分嵌入在EMI吸收材料中。

公开(公告)号：US20150033554A1

公开(公告)日：2015-02-05

申请号：US14515597

申请日：2014-10-16

Applicant: International Business Machines Corporation

Inventor： William L. Brodsky ,  Timothy W. Budell ,  Samuel R. Connor ,  Mark Curtis Hayes Lamorey ,  Janak G. Patel ,  Peter Slota, JR. ,  David B. Stone

IPC: H05K3/28 ,  H01L23/552 ,  H05K9/00

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L23/053 ,  H01L23/295 ,  H01L23/3128 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16172 ,  H01L2924/16178 ,  H01L2924/16179 ,  H01L2924/167 ,  H01L2924/1676 ,  H01L2924/16793 ,  H01L2924/16798 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/284 ,  H05K9/0081 ,  Y10T29/49128 ,  H01L2924/014

Abstract: Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An EMI shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.

Abstract translation: 用于电子封装的装置和方法，其包含防止电磁干扰（EMI）发射的屏蔽。 根据集成电路结构，衬底在印刷电路板上。 集成电路芯片在基板上。 集成电路芯片电连接到基板。 EMI屏蔽单元位于集成电路芯片和基板上。 EMI屏蔽单元包括覆盖集成电路芯片的盖和集成电路芯片外的基板的部分。 填充材料可以沉积在形成在盖和基底之间的空腔内。 填充材料包括EMI吸收材料。 盖的周边包括侧裙，侧裙围绕集成电路芯片和衬底。 EMI吸收材料在印刷电路板上，并且侧裙的一部分嵌入在EMI吸收材料中。