摘要:
A degradable hemostatic sponge that can be self-degraded and absorbed by a human body has poly lactic acid as its main material and mixed with a moisture-absorbent material, such as collagen, chitosan, starch and the like, at a specific ratio. Given grinding, mixing and melting steps, the materials using a supercritical fluid as a foaming agent can be used to manufacture the degradable hemostatic sponge having an open-cell microcellular form by a continuous extrusion foaming process. In addition, the present invention also includes a system and a method for manufacturing the degradable hemostatic sponge.
摘要:
A silicon nitride read-only-memory structure is provided. The silicon nitride read-only-memory includes a control gate over a substrate, a source region and a drain region in the substrate on each side of the control gate, a charge-trapping layer between the control gate and the substrate and a channel layer in the substrate underneath the charge-trapping layer and between the source region and the drain region. The charge-trapping layer further includes an isolation region. The isolation region partitions the charge-trapping layer into a source side charge-trapping block and a drain side charge-trapping block so that a two-bit structure is formed.
摘要:
A radiation resistant hexagonal gate flash memory cell. The flash memory cell includes a substrate, a source region, a drain region and a gate structure. A channel region is also formed in the substrate between the source region and the drain region. The gate structure is located above the substrate between the source region and the drain region. The gate structure further includes an oxide-nitride-oxide composite layer over the substrate. In a direction perpendicular to the channel, width of the gate structure increases gradually from the source region towards a pre-determined location and decreases towards the drain region thereafter. When the flash memory cell is subjected to radiation illumination, electron-hole pairs thus generated will be injected into the substrate without passing into the nitride layer. In a programming operation, a portion of the gate structure close to the source region serves as an equivalent source region having an area greater than the drain region so that second bit effect is greatly reduced.
摘要:
A nonvolatile memory cell for prevention from second bit effect comprises a pair of source/drain regions arranged with a channel therebetween, a programmable layer above the channel, and a gate conductor above the programmable layer. The memory cell is characterized in that the programmable layer has a maximum width substantially larger than the boundary widths between the programmable layer and the source/drain regions. The programmable layer comprises a trapping dielectric layer inserted between two insulator layers, and the trapping dielectric preferably comprises a nitride or an oxide having buried polysilicon islands.
摘要:
A method for fabricating a raised source/drain of a semiconductor device is described. A gate structure is formed on a substrate, and then a source/drain with a shallow-junction is formed in the substrate beside the gate structure. A spacer is formed on the sidewalls of the gate structure. Thereafter, an elevated layer is formed on the gate structure and the source/drain with a shallow junction, wherein the elevated layer formed on the source/drain serves as an elevated source/drain layer.
摘要:
A method of fabricating a multi-bit flash memory, having a control gate, a floating gate, a source region, a drain region and a channel region. An isolation region is formed in the floating gate to partition the floating gate into a plurality of conductive blocks. The conductive blocks are arranged in an array with rows extending from the source region to the drain region. Each row of the array has two conductive blocks. Before any data is written to the flash memory, the channel regions under the conductive blocks of the same row have the same threshold voltage, while the channel regions under the conductive blocks of different rows have different threshold voltage.
摘要:
A memory device and a method for fabricating the same are described. The memory device includes a substrate, buried bit lines, word line structures, a dielectric layer, conductive lines in trenches and self-aligned contacts. The buried bit lines are located in the substrate, and the word line structures are disposed on the substrate crossing over the buried bit lines. Each word line structure consists of a word line, a gate oxide layer, a capping layer and a spacer. Each conductive line is disposed in the dielectric layer and over a buried bit line, and crosses over the capping layers. The dielectric layer is disposed between the word line structures and between the conductive lines. Each self-aligned contact is disposed under a conductive line and between two adjacent word lines to electrically connect the conductive line and the corresponding buried bit line.
摘要:
A method of reading two-bit information in Nitride Read only memory (NROM) cell simultaneously. According to outputted voltage in drain or source of the NROM, it can identify a logical two-bit combination massage of the NROM. The method includes: grounding the source of the NROM; inputting a voltage to the drain of the NROM; inputting a voltage to the gate of the NROM; measuring the outputted current of drain or source; and dividing the outputted current into four different zones, and each zone represents a specific logical two-bit information, which is “0 and 0”, “0 and 1”, “1 and 0”, or “1 and 1”.
摘要:
The present invention provides a twin bit cell flash memory device and its fabricating method. The method is to first form a gate oxide layer on the surface of the silicon substrate followed by forming a polysilicon germanium (Si1−xGex,x=0.05˜1.0) layer on the gate oxide layer. Thereafter, an ion implantation process is performed to form at least one insulating region in the polysilicon germanium layer for separating the polysilicon germanium layer into two isolated conductive regions and forming a twin bit cell structure. Then, a dielectric layer is formed on the polysilicon germanium layer and a photo-etching-process (PEP) is performed to etch portions of the dielectric layer and the polysilicon germanium layer for forming a floating gate of the twin bit cell flash memory. Finally, a control gate is formed over the floating gate.
摘要:
The present invention provides a method for reducing the gate aspect ratio of a flash memory device. The method includes forming a tunnel oxide layer on a substrate; forming a polysilicon layer on the tunnel oxide layer; forming an insulating layer on the polysilicon layer; forming a control gate layer on the polysilicon layer; etching at least the tunnel oxide layer, the insulating layer, and the control gate layer to form at least two stack structures; forming a plurality of spacers at sides of the at least two stack structures; and filling at least one gap between the at least two stack structures with an oxide, where the control gate layer provides a gate aspect ratio which allows for a maximum step coverage by the oxide. In a preferred embodiment, the method uses nickel silicide instead of the conventional tungsten silicide in the control gate layers of the cells of the device. Nickel silicide has higher conductivity than conventional silicides, thus a thinner layer of nickel silicide may be used without sacrificing performance. Nickel silicide also has a lower barrier height for holes, thus maintaining a low contact resistance. With a thinner nickel silicide layer, the gate aspect ratio of the cells are lowered, allowing for a maximum step coverage by the gap-filling oxide. The reliability of the device is thus improved.