公开(公告)号：US4308406A

公开(公告)日：1981-12-29

申请号：US152391

申请日：1980-05-22

申请人： Masaaki Takenaka ,  Haruhisa Harada ,  Hiroshi Maki ,  Shigeru Sasaki

发明人： Masaaki Takenaka ,  Haruhisa Harada ,  Hiroshi Maki ,  Shigeru Sasaki

IPC分类号： C07C27/00 ,  C07C37/88 ,  C07C39/08 ,  C07C67/00 ,  C07C37/68

CPC分类号： C07C37/88

摘要： Dihydric phenol is effectively prevented from discoloration by mixing the dihydric phenol with 0.00001 to 0.1% by weight of hydrocarboxylic acid on the basis of the dihydric phenol.

摘要翻译： 通过将二元酚与基于二元酚的0.00001至0.1重量％的氢化羧酸混合，可有效防止二元酚变色。

公开(公告)号：US08222050B2

公开(公告)日：2012-07-17

申请号：US13208171

申请日：2011-08-11

申请人： Hiroshi Maki ,  Tsuyoshi Yokomori ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Tsuyoshi Yokomori ,  Tatsuyuki Okubo

IPC分类号： H01L21/00

CPC分类号： H01L21/77 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L22/12 ,  H01L22/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T156/1132 ,  Y10T156/1944 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2924/3512

摘要： In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.

摘要翻译： 在半导体集成电路器件的制造期间的组装工艺中的切割之后的芯片拾取工艺中，减少由快速进行的每个芯片的厚度减小引起的拾取缺陷是重要的课题。 特别地，由剥离操作引起的芯片周边部分的弯曲很可能引起芯片的破裂和碎裂。 在本发明中，为了解决这些问题，在通过夹紧夹头对芯片进行真空夹持的情况下，在从切割带（胶带）等剥离芯片的情况下，夹紧夹头中的真空夹紧系统的流量 被监视以在第一芯片从胶带完全分离之前检查芯片的弯曲状态。

公开(公告)号：US07759164B2

公开(公告)日：2010-07-20

申请号：US12392171

申请日：2009-02-25

申请人： Hiroshi Maki ,  Kazuhiro Seiki ,  Eiji Wada

发明人： Hiroshi Maki ,  Kazuhiro Seiki ,  Eiji Wada

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  Y10T156/1077 ,  Y10T156/1089 ,  Y10T156/1092 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1983

摘要： A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.

摘要翻译： 一种半导体器件的制造方法，包括以下步骤：将芯片附着膜和切割膜固定到半导体晶片的背面上：其后，切割半导体晶片和芯片附着膜，将半导体晶片分割成多个半导体 芯片：此后以第一张力将切割膜从中心朝向切割膜的外周拉出，以切割芯片附着膜芯片; 然后以小于第一张力的第二拉伸力从切割膜的中心向外周拉动切割膜，同时与芯片附着膜一起拾取半导体芯片。

公开(公告)号：US20080318346A1

公开(公告)日：2008-12-25

申请号：US12137522

申请日：2008-06-11

申请人： Hiroshi Maki ,  Tsuyoshi Yokomori ,  Tatsuyuki Okubo

发明人： Hiroshi Maki ,  Tsuyoshi Yokomori ,  Tatsuyuki Okubo

IPC分类号： H01L21/66

CPC分类号： H01L21/77 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/78 ,  H01L22/12 ,  H01L22/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T156/1132 ,  Y10T156/1944 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01032 ,  H01L2924/01031 ,  H01L2924/3512

摘要： In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape.

摘要翻译： 在半导体集成电路器件制造期间的组装工艺中的切割之后的芯片拾取过程中，减少由快速进行的每个芯片的厚度减小引起的拾取缺陷是重要的课题。 特别地，由剥离操作引起的芯片周边部分的弯曲很可能引起芯片的破裂和碎裂。 在本发明中，为了解决这些问题，在通过夹紧夹头对芯片进行真空夹持的情况下，在从切割带（胶带）等剥离芯片的情况下，夹紧夹头中的真空夹紧系统的流量 被监视以在第一芯片从胶带完全分离之前检查芯片的弯曲状态。

公开(公告)号：US20060166466A1

公开(公告)日：2006-07-27

申请号：US11335459

申请日：2006-01-20

申请人： Hiroshi Maki ,  Kazuhiro Seiki ,  Eiji Wada

发明人： Hiroshi Maki ,  Kazuhiro Seiki ,  Eiji Wada

IPC分类号： H01L21/78 ,  H01L21/301 ,  H01L21/46

CPC分类号： H01L21/67132 ,  Y10T156/1077 ,  Y10T156/1089 ,  Y10T156/1092 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1983

摘要： A manufacturing method of a semiconductor device comprising the steps of: affixing a die attach film and a dicing film to a back surface of a semiconductor wafer: thereafter dicing the semiconductor wafer and the die attach film to divide the semiconductor wafer into a plurality of semiconductor chips: thereafter pulling the dicing film from the center toward the outer periphery of the dicing film with a first tensile force to cut the die attach film chip by chip; and thereafter picking up the semiconductor chips together with the die attach film while pulling the dicing film from the center toward the outer periphery of the dicing film with a second tensile force smaller than the first tensile force.

摘要翻译： 一种半导体器件的制造方法，包括以下步骤：将芯片附着膜和切割膜固定到半导体晶片的背面上：此后切割半导体晶片和芯片附着膜，以将半导体晶片分成多个半导体 芯片：此后以第一张力将切割膜从中心朝向切割膜的外周拉出，以切割芯片附着膜芯片; 然后以小于第一张力的第二拉伸力从切割膜的中心向外周拉动切割膜，同时与芯片附着膜一起拾取半导体芯片。

公开(公告)号：US06345895B1

公开(公告)日：2002-02-12

申请号：US09453397

申请日：1999-12-03

申请人： Hiroshi Maki ,  Kiyoshi Numazaki ,  Masaaki Kusano ,  Tetsuo Hattori ,  Atsushi Sekine

发明人： Hiroshi Maki ,  Kiyoshi Numazaki ,  Masaaki Kusano ,  Tetsuo Hattori ,  Atsushi Sekine

IPC分类号： G03B2100

CPC分类号： G02B27/149 ,  G02B27/1026 ,  G02B27/1073 ,  G02B27/145 ,  H04N5/7416 ,  H04N9/317

摘要： An analyzing-synthesizing optical system has the structure in which for each of the three primary colors of R, G, and B, there are provided a light valve for modulating incident light and a polarization beam splitter for guiding specific polarized light to this light valve and extracting only modulated light coming from the light valve to output it, wherein these light valves and polarization beam splitters are fixed as integrated with a synthesizing optical system comprising a cross dichroic prism and wherein optical path lengths of optical paths of the respective colors are adjusted to be almost equal to each other. A projection image display apparatus comprises the analyzing-synthesizing optical unit.

摘要翻译： 分析合成光学系统具有这样的结构，其中，对于R，G和B的三原色中的每一种，设置有用于调制入射光的光阀和用于将特定偏振光引导到该光阀的偏振分束器 并且仅提取来自光阀的调制光以输出它们，其中这些光阀和偏振分束器被固定为与包括十字分色棱镜的合成光学系统集成，并且其中调节各种颜色的光路的光路长度 几乎相等。 投影图像显示装置包括分析合成光学单元。

公开(公告)号：US6010221A

公开(公告)日：2000-01-04

申请号：US80932

申请日：1998-05-19

申请人： Hiroshi Maki ,  Kiyoshi Numazaki ,  Masaaki Kusano ,  Tetsuo Hattori ,  Atsushi Sekine

发明人： Hiroshi Maki ,  Kiyoshi Numazaki ,  Masaaki Kusano ,  Tetsuo Hattori ,  Atsushi Sekine

IPC分类号： G02B27/14 ,  H04N5/74 ,  H04N9/31 ,  H04N17/00 ,  G03B21/14

CPC分类号： G02B27/149 ,  G02B27/1026 ,  G02B27/1073 ,  G02B27/145 ,  H04N9/317 ,  H04N5/7416

摘要： An analyzing-synthesizing optical system has the structure in which for each of the three primary colors of R, G, and B, there are provided a light valve for modulating incident light and a polarization beam splitter for guiding specific polarized light to this light valve and extracting only modulated light coming from the light valve to output it, wherein these light valves and polarization beam splitters are fixed as integrated with a synthesizing optical system comprising a cross dichroic prism and wherein optical path lengths of optical paths of the respective colors are adjusted to be almost equal to each other. A projection image display apparatus comprises the analyzing-synthesizing optical unit.

公开(公告)号：US5512821A

公开(公告)日：1996-04-30

申请号：US974585

申请日：1993-02-01

申请人： Seigo Ando ,  Yasuhiro Matsufuji ,  Hiroshi Maki ,  Mamoru Inaba ,  Kenichi Iwanaga ,  Atsuhisa Takeoshi ,  Masaki Takenaka

发明人： Seigo Ando ,  Yasuhiro Matsufuji ,  Hiroshi Maki ,  Mamoru Inaba ,  Kenichi Iwanaga ,  Atsuhisa Takeoshi ,  Masaki Takenaka

IPC分类号： G01N27/82 ,  G01R33/02 ,  G01N27/72

CPC分类号： G01N27/82

摘要： A magnetic detector includes a magnetizer generating a magnetic field; a first magnetic sensor for detecting a leakage flux resulting from a magnetically defective portion of an object moving in and relative to the magnetic field; a low-pass filter for extracting a low-frequency signal component contained in the signal output by the magnetic sensor, the low-frequency signal component being indicative of a floating flux which crosses the magnetic sensor and is a result of the object moving through the magnetic field; an amplifier for amplifying the extracted low-frequency signal component; a compensating coil excited by the amplified low-frequency signal component output by the amplifier, for generating a magnetic flux which cancels out the floating flux crossing the magnetic sensor; a high-pass filter for extracting a signal resulting from the magnetically defective portion and contained in the signal that is output by the first magnetic sensor; an output amplifier for amplifying a signal output by the high-pass filter to produce a defect signal; a second magnetic sensor located near the first magnetic sensor, for detecting a component of the magnetic field which is parallel to the surface of the object; an amplifier control circuit for controlling an amplification factor of the output amplifier in accordance with a signal from the second magnetic sensor; and a magnetizer control circuit for controlling the intensity of the magnetic field generated by the magnetizer, in accordance with a signal output by the second magnetic sensor.

摘要翻译： PCT No.PCT / JP92 / 00191 Sec。 371日期：1993年2月1日 102（e）日期1993年2月1日PCT提交1992年2月24日PCT公布。 公开号WO92 / 21964 日期：1992年12月10日。磁检测器包括产生磁场的磁化器; 第一磁传感器，用于检测由相对于磁场移动的物体的磁性缺陷部分产生的漏磁通; 用于提取包含在由磁传感器输出的信号中的低频信号分量的低通滤波器，低频信号分量指示穿过磁传感器的浮动磁通，并且是物体移动通过 磁场; 放大器，用于放大所提取的低频信号分量; 由放大器输出的放大的低频信号分量激励的补偿线圈，用于产生抵消与磁传感器交叉的浮动磁通的磁通; 高通滤波器，用于提取由磁性缺陷部分产生的并包含在由第一磁传感器输出的信号中的信号; 输出放大器，用于放大由高通滤波器输出的信号以产生缺陷信号; 位于第一磁传感器附近的用于检测平行于物体表面的磁场分量的第二磁传感器; 放大器控制电路，用于根据来自第二磁传感器的信号控制输出放大器的放大系数; 以及用于根据由第二磁传感器输出的信号来控制由磁化器产生的磁场的强度的磁化控制电路。

公开(公告)号：US5276193A

公开(公告)日：1994-01-04

申请号：US561419

申请日：1990-08-01

申请人： Hiroshi Maki ,  Michihiro Kawasaki ,  Hiroshi Shimizu ,  Yoshiaki Ito

发明人： Hiroshi Maki ,  Michihiro Kawasaki ,  Hiroshi Shimizu ,  Yoshiaki Ito

IPC分类号： B01J23/40 ,  B01J23/42 ,  C07B61/00 ,  C07C213/02 ,  C07C215/08 ,  C07C209/26

CPC分类号： C07C213/02

摘要： A process for preparing an N-alkyl-substituted aminophenol is disclosed, comprising continuously feeding an aldehyde or a ketone to a reaction system containing an organic solvent, a catalyst for reduction, hydrogen, and an aminophenol to conduct a reductive alkylation reaction, wherein said reductive alkylation reaction is carried out while continuously adding an organic carboxylic acid into the reaction system. The process attains a high yield even when the catalyst is repeatedly used and does not cause corrosion of equipment.

摘要翻译： 公开了一种制备N-烷基取代的氨基苯酚的方法，其包括将醛或酮连续进料到含有机溶剂，还原催化剂，氢和氨基苯酚的反应体系中进行还原性烷基化反应，其中所述 在向反应体系中连续加入有机羧酸的同时进行还原性烷基化反应。 即使催化剂重复使用也不会导致设备腐蚀，该方法获得高产率。

公开(公告)号：US4787973A

公开(公告)日：1988-11-29

申请号：US100213

申请日：1987-09-23

申请人： Shoichiro Ando ,  Hiroshi Maki

发明人： Shoichiro Ando ,  Hiroshi Maki

IPC分类号： A47J31/60 ,  C02F1/00 ,  C02F1/28 ,  C02F1/68

CPC分类号： A47J31/605 ,  C02F1/002 ,  C02F1/283 ,  C02F1/68

摘要： There is provided a device for converting water into mineral water which comprises a covered or uncovered porous filter and ceramic as a calcium and magnesium source and active carbon as a deodorizer randomly held in the filter whereby when water flows through the filter the water is converted into mineral water.

摘要翻译： 提供了一种用于将水转化成矿泉水的装置，其包括覆盖或未覆盖的多孔过滤器和作为钙和镁源的陶瓷和作为除臭剂的活性炭，其随机地保持在过滤器中，由此当水流过过滤器时，水被转化成 矿泉水。