公开(公告)号：US20210120692A1

公开(公告)日：2021-04-22

申请号：US17136242

申请日：2020-12-29

Applicant: Medtronic, Inc.

Inventor： Christian S. Nielsen ,  Rajesh V. Iyer ,  Gordon O. Munns ,  Andrew J. Ries ,  Andrew J. Thom

IPC: H05K5/06 ,  A61N1/378 ,  A61N1/375 ,  H05K5/00 ,  H05K7/14 ,  H01M50/543

Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.

公开(公告)号：US20210001131A1

公开(公告)日：2021-01-07

申请号：US17027013

申请日：2020-09-21

Applicant: Medtronic, Inc.

Inventor： Rajesh V. Iyer ,  Gordon O. Munns ,  Christian S. Nielsen ,  Craig L. Schmidt ,  Paul B. Young

IPC: A61N1/378 ,  A61N1/375 ,  A61N1/372 ,  H01F5/04 ,  H01F38/14 ,  H01F41/10 ,  H02J7/00

Abstract: Systems, devices and methods allow inductive recharging of a power source located within or coupled to an implantable medical device while the device is implanted in a patient. The implantable devices in some examples include a multi-axis antenna having a plurality of coil windings arranged orthogonal to one another. The multi-axis antenna configured to generate at least a minimum level of induced current for recharging a power source of the implanted medical device regardless of the orientation of a direction of a magnetic field imposed on the multi-axis antenna relative to an orientation of the implanted medical device and the multi-axis antenna for a given energy level of the imposed magnetic field.

公开(公告)号：US20200005988A1

公开(公告)日：2020-01-02

申请号：US16021075

申请日：2018-06-28

Applicant: Medtronic, Inc.

Inventor： Rajesh V. Iyer ,  Gordon O. Munns ,  John D. Norton ,  Craig L. Schmidt ,  Paul B. Young

IPC: H01F27/28 ,  H02J7/02 ,  H02J50/10 ,  H02J50/40 ,  H02J7/00 ,  H01F27/24 ,  A61N1/39 ,  A61N1/378 ,  A61N1/05 ,  A61N1/372

Abstract: Systems, devices and methods allow inductive recharging of a power source located within or coupled to an implantable medical device while the device is implanted in a patient. The implantable medical device in some examples include a receive antenna configuration that may include at least one infinity shaped receive coil. One or more of the receive coils may be affixed to a ferrite sheet formed having a curved shape that conforms to a curvature on an inner surface of a portion of a housing of the implantable medical device so that the ferrite sheet and the receive coil or coils may be positioned adjacent to some portion of the curved inner surface with the ferrite sheet positioned between the inner surface and the receive coil or coils.

公开(公告)号：US20190314635A1

公开(公告)日：2019-10-17

申请号：US16464672

申请日：2017-10-19

Applicant: MEDTRONIC, INC.

Inventor： Rajesh V. Iyer ,  Kunal J. Paralikar ,  Randy S. Roles

IPC: A61N1/375 ,  H01R13/52 ,  H01R13/622 ,  H01R24/58

Abstract: Medical devices include fixation structures that include retained portions that provide medical lead fixation within the medical devices. Lead extensions include fixation structures that include retained portions that provide medical lead fixation within the lead extensions. A grip that a clinician may grasp and manipulate is engaged with a nose structure of a header block of the medical device or a connector block of a lead extension and manipulation of the grip causes compression of a deformable structure to ultimately create fixation of the lead or lead extension within the header block or the lead within the extension connector block. The deformable structure may be the retained portion of the fixation structure or alternatively may be separate from the fixation structure.

公开(公告)号：US10143849B2

公开(公告)日：2018-12-04

申请号：US15464328

申请日：2017-03-20

Applicant: MEDTRONIC, INC.

Inventor： Steven T. Deininger ,  Michael J. Baade ,  Rajesh V. Iyer

IPC: A61N1/00 ,  A61N1/375 ,  H05K7/02 ,  H05K7/14 ,  H01R13/52 ,  H01R43/26 ,  H01G4/35 ,  H01R4/02 ,  H01R13/516 ,  H01R24/58 ,  H01R107/00

Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors that are electrically coupled to feedthrough pins and that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.

公开(公告)号：US20150213951A1

公开(公告)日：2015-07-30

申请号：US14685094

申请日：2015-04-13

Applicant: Medtronic, Inc.

Inventor： Rajesh V. Iyer

IPC: H01G2/20 ,  A61N1/375 ,  H01G4/35

CPC classification number: H01G2/20 ,  A61N1/3754 ,  H01G2/106 ,  H01G4/236 ,  H01G4/35 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49004

Abstract: A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The capacitor includes an insulative member fixedly attached to its bottom portion to inhibit high voltage arcing. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the capacitor proximate the bottom portion, e.g., at the insulative member.

Abstract translation: 一种电容器组件，用于组装滤波后的馈通。 电容器包括固定地附接到其底部的绝缘构件，以抑制高电压电弧。 存在于电容器的内径和外径上的端接材料不存在靠近底部的电容器的一部分，例如在绝缘构件上。

公开(公告)号：US20130289681A1

公开(公告)日：2013-10-31

申请号：US13772490

申请日：2013-02-21

Applicant: MEDTRONIC, INC.

Inventor： Rajesh V. Iyer ,  Michael G. Marinkov ,  Lea A. Nygren ,  Brad C. Tischendorf

IPC: A61N1/375

CPC classification number: A61N1/3754 ,  B23K35/0244 ,  Y10T29/49222

Abstract: Implantable medical device having a feedthrough, a feedthrough and method for making such feedthrough. The feedthrough has a ferrule, an electrically conductive pin, a preform having a preform liquidus temperature, a capacitor, positioned within the ferrule abutting the preform, having a coating having a coating liquidus temperature and being configured to electrically couple with the preform, and an insulative assembly configured, at least in part, to seal against passage of a liquid through the ferrule, and having an insulative assembly liquidus temperature. The coating liquidus temperature is greater than the preform liquidus temperature and the coating liquidus temperature being greater than the insulative assembly liquidus temperature.

Abstract translation: 具有馈通的可植入医疗装置，馈通和用于制造这种馈通的方法。 馈通具有套圈，导电销，具有预制液相线温度的预成型件，位于套圈内的电容器，邻接预型件，具有涂层液相线温度并被配置为与预成型件电耦合的涂层，以及 绝缘组件至少部分地被构造成密封液体通过套圈的通道，并且具有绝缘组装液相线温度。 涂层液相线温度大于预制液相线温度，涂层液相线温度大于绝缘组装液相线温度。