公开(公告)号：US07223635B1

公开(公告)日：2007-05-29

申请号：US10888169

申请日：2004-07-08

申请人： Peter D. Brewer

发明人： Peter D. Brewer

IPC分类号： H01L21/00

CPC分类号： B81C3/002 ,  B81C2203/058 ,  H01L21/6835 ,  H01L24/95 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68363 ,  H01L2224/95085 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00

摘要： An electronic apparatus comprising one or more microstructures on a substrate and a method for fabricating the electronic apparatus. The microstructures have alignment structures that allow the microstructures to be oriented in receptacles having shapes that are complementary to the shapes of the alignment structures. The alignment structures are shapes that vary when rotated 360°, such that the microstructures are positioned at a specific orientation in the receptacles.

摘要翻译： 一种包括在基板上的一个或多个微结构的电子设备和用于制造电子设备的方法。 微结构具有对准结构，其允许微结构在具有与对准结构的形状互补的形状的插座中取向。 对准结构是当旋转360°时变化的形状，使得微结构被定位在容器中的特定取向。

公开(公告)号：US06954302B2

公开(公告)日：2005-10-11

申请号：US10690486

申请日：2003-10-20

申请人： Keyvan Sayyah ,  David M. Pepper ,  Peter D. Brewer ,  Anson Au

发明人： Keyvan Sayyah ,  David M. Pepper ,  Peter D. Brewer ,  Anson Au

IPC分类号： G01S17/74 ,  G02B5/12 ,  H01L27/146 ,  H04B10/10 ,  H04B10/26 ,  G02B26/00

CPC分类号： H04B10/112 ,  G01S17/74 ,  G02B5/12 ,  H01L21/6835 ,  H01L24/18 ,  H01L24/82 ,  H01L24/96 ,  H01L27/14647 ,  H01L2221/6835 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1461 ,  H01L2924/30105 ,  H01L2924/3511 ,  H04B10/2587 ,  H01L2924/00

摘要： A conformal retro-modulator optical apparatus. The apparatus includes an array of multiple quantum well devices disposed in a thin array. A plastic support element is bonded to the thin array, the plastic support element having a thickness greater that of the thin array. The plastic support element is preferably plastic at elevated temperatures above room temperature, thereby allowing the plastic support element and the thin array of multiple well device disposed therein to conform to a predetermined shape, yet being rigid at room temperature.

摘要翻译： 一种共形逆光调制器光学装置。 该装置包括以薄阵列布置的多个量子阱装置的阵列。 塑料支撑元件结合到薄阵列，塑料支撑元件的厚度大于薄阵列的厚度。 塑料支撑元件优选在高于室温的高温下塑性，从而允许塑料支撑元件和设置在其中的多孔装置的薄阵列符合预定形状，但在室温下是刚性的。

公开(公告)号：US06858537B2

公开(公告)日：2005-02-22

申请号：US10218055

申请日：2002-08-12

申请人： Peter D. Brewer

发明人： Peter D. Brewer

IPC分类号： B24B7/24 ,  B24B37/04 ,  C03C15/00 ,  C03C19/00 ,  H01L21/04 ,  H01L21/306 ,  H01L21/302

CPC分类号： C03C19/00 ,  B24B7/241 ,  B24B37/042 ,  C03C15/00 ,  H01L21/042 ,  H01L21/30604 ,  H01L21/30625

摘要： A process for smoothing a rough surface on a substrate, such as a diamond or silicon carbide substrate, said rough surface including protruding peak portions separated by valleys, said smoothing comprising (a) depositing a coating on said rough surface so as to adhere to and to fill at least the valleys of said rough surface, (b) mechanically polishing the thus coated rough surface so as to achieve a smooth coated surface, and (c) dry etching the smooth coated surface, such as by PACE, so as to remove the remaining coating and at least protruding peak portions of the substrate so as to achieve a smooth surface on the substrate, wherein in the mechanical polishing step (b) the coating is removed at a rate of reduction of thickness greater than the rate at which the substrate is subject to reduction of thickness by the mechanical polishing, and in the dry etching step (c) the coating and substrate are removed at substantially the same or a similar rate of reduction of thickness, and, if necessary, steps (a), (b) and (c) are repeated, or the coating and substrate are removed in separate, alternate preferential etching steps.

摘要翻译： 一种用于平滑诸如金刚石或碳化硅衬底的衬底上的粗糙表面的工艺，所述粗糙表面包括由谷分开的突出的峰部分，所述平滑化包括（a）在所述粗糙表面上沉积涂层以粘附到 以至少填充所述粗糙表面的谷部，（b）机械抛光由此涂覆的粗糙表面，以便实现光滑的涂覆表面，和（c）例如通过PACE干燥蚀刻光滑涂覆表面，以便去除 剩余的涂层和至少突出的基板的峰部分，以便在基板上实现光滑的表面，其中在机械抛光步骤（b）中，以大于其的 基板通过机械抛光进行厚度减小，在干法蚀刻步骤（c）中，以基本上相同或相似的厚度减小速率除去涂层和基板，如果 必要时，重复步骤（a），（b）和（c），或者在单独的交替优先蚀刻步骤中除去涂层和基底。

公开(公告)号：US06828556B2

公开(公告)日：2004-12-07

申请号：US10256335

申请日：2002-09-26

申请人： Carl W. Pobanz ,  Mehran Matloubian ,  Peter D. Brewer

发明人： Carl W. Pobanz ,  Mehran Matloubian ,  Peter D. Brewer

IPC分类号： H01Q2100

CPC分类号： H01L27/14649

摘要： A focal plane array for millimeter wave imaging comprising a three dimensional stack of antenna elements and radiometer microwave monolithic integrated circuits (MMICs) embedded in polymer dielectric layers built on top of a silicon substrate. Each radiometer MMIC and antenna element comprise a radiometer pixel. The silicon substrate contains integrated circuits to collect and process the signals from each radiometer pixel and generate a full-frame video signal. The array can be fabricated on a single silicon wafer or can be constructed from structures fabricated on multiple silicon wafers.

摘要翻译： 一种用于毫米波成像的焦平面阵列，包括天线元件的三维叠层和嵌入在硅衬底顶部的聚合物电介质层中的辐射计微波单片集成电路（MMIC）。 每个辐射计MMIC和天线元件包括辐射计像素。 硅衬底包含集成电路以收集和处理来自每个辐射计像素的信号并产生全帧视频信号。 阵列可以在单个硅晶片上制造，或者可以由在多个硅晶片上制造的结构构造。