公开(公告)号：US20160197006A1

公开(公告)日：2016-07-07

申请号：US14903961

申请日：2014-06-24

Applicant: SOITEC

Inventor： Marcel Broekaart ,  Ionut Radu ,  Chrystelle Lagahe Blanchard

IPC: H01L21/762 ,  H01L23/544

CPC classification number: H01L21/76254 ,  H01L23/544 ,  H01L27/14687 ,  H01L2223/54426 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The disclosure relates to a process for locating devices, the process comprising the following steps: a) providing a carrier substrate comprising: a device layer; and alignment marks; b) providing a donor substrate; c) forming a weak zone in the donor substrate, the weak zone delimiting a useful layer; d) assembling the donor substrate and the carrier substrate; and e) fracturing the donor substrate in the weak zone so as to transfer the useful layer to the device layer; wherein the alignment marks are placed in cavities formed in the device layer, the cavities having an aperture flush with the free surface of the device layer.

Abstract translation: 本公开涉及一种用于定位设备的方法，该方法包括以下步骤：a）提供载体衬底，其包括：器件层; 和对准标记; b）提供供体底物; c）在施主衬底中形成弱区，限定有用层的弱区; d）组装供体衬底和载体衬底; 以及e）在所述弱区中破坏所述施主衬底，以将所述有用层转移到所述器件层; 其中对准标记被放置在形成在器件层中的空腔中，空腔具有与器件层的自由表面齐平的孔。

公开(公告)号：US09138980B2

公开(公告)日：2015-09-22

申请号：US13624470

申请日：2012-09-21

Applicant: Soitec

Inventor： Marcel Broekaart ,  Ionut Radu

IPC: B32B37/10 ,  B32B38/18 ,  H01L21/67

CPC classification number: H01L25/50 ,  B32B38/1858 ,  B32B2309/64 ,  B32B2309/65 ,  B32B2309/68 ,  H01L21/67092 ,  H01L2924/0002 ,  Y10T156/10 ,  H01L2924/00

Abstract: The present invention relates to an apparatus for the manufacture of semiconductor devices wherein the apparatus includes a bonding module that has a vacuum chamber to provide bonding of wafers under pressure below atmospheric pressure; and a loadlock module connected to the bonding module and configured for wafer transfer to the bonding module. The loadlock module is also connected to a first vacuum pumping device configured to reduce the pressure in the loadlock module to below atmospheric pressure. The bonding and loadlock modules remain at a pressure below atmospheric pressure while the wafer is transferred from the loadlock module into the bonding module.

Abstract translation: 本发明涉及一种用于制造半导体器件的装置，其中所述装置包括具有真空室的接合模块，以在低于大气压的压力下提供晶片的接合; 以及负载锁模块，其连接到所述接合模块并且被配置为用于晶片转移到所述接合模块。 负载锁模块还连接到第一真空泵装置，其被配置成将负载锁模块中的压力降低到低于大气压。 接合和负载锁定模块保持在低于大气压力的压力下，同时晶片从负载锁定模块传输到接合模块中。

公开(公告)号：US20150235851A1

公开(公告)日：2015-08-20

申请号：US14434624

申请日：2013-10-11

Applicant: SOITEC

Inventor： Marcel Broekaart ,  Arnaud Castex

IPC: H01L21/18 ,  B32B37/00 ,  B32B37/10

CPC classification number: H01L21/187 ,  B32B37/0007 ,  B32B37/1009 ,  B32B2037/0092 ,  B32B2307/20 ,  B32B2457/14

Abstract: The disclosure relates to a method of bonding by molecular adhesion comprising the positioning of a first wafer and of a second wafer within a hermetically sealed vessel, the evacuation of the vessel to a first pressure lower than or equal to 400 hPa, the adjustment of the pressure in the vessel to a second pressure higher than the first pressure by introduction of a dry gas, and bringing the first and second wafers into contact, followed by the initiation of the propagation of a bonding wave between the two wafers, while maintaining the vessel at the second pressure.

Abstract translation: 本发明涉及一种通过分子粘合进行粘合的方法，包括将第一晶片和第二晶片定位在密封容器内，将容器排空至低于或等于400hPa的第一压力， 通过引入干燥气体将容器中的压力升至高于第一压力的第二压力，并使第一和第二晶片接触，随后在两个晶片之间引起粘结波的传播，同时保持容器 在第二个压力。