公开(公告)号：US12174681B2

公开(公告)日：2024-12-24

申请号：US18096993

申请日：2023-01-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Duhee Jang ,  Kangmoon Seo ,  Sanghoon Lee ,  Jungho Lee

IPC: G06F1/3218 ,  G06F1/3296 ,  G10L15/22

Abstract: An electronic device comprising: a power supply apparatus including a first converter configured to generate driving power and a second converter configured to generate first standby voltage and second standby voltage; and a main body operated based on the driving power and the second standby power received from the power supply apparatus. The second converter is configured to: during a normal mode operation and a standby mode operation, obtain the first standby voltage and adjust the first standby power based on the obtained standby power; and during the standby mode operation, obtain the second standby voltage; and in response to the obtained second standby voltage being equal to or less than a reference level, perform the normal mode operation to control the first standby voltage to be maintained at a first voltage level and control the second standby voltage to be maintained at a second voltage level.

公开(公告)号：US20240416529A1

公开(公告)日：2024-12-19

申请号：US18522855

申请日：2023-11-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghoon Joo ,  Sunghyup Kim ,  Kiho Lee ,  Sanghoon Lee

IPC: B25J15/00 ,  H01L21/687

Abstract: A robot blade may include a blade body and a frequency variator. The blade body may include a frequency variation groove. The frequency variator may be detachably arranged in the frequency variation groove to vary a frequency of the blade body. Thus, the robot blade may have a changed shape by removing at least one frequency variation block included in the frequency variator. Therefore, the robot blade having the changed shape may have a frequency different from a frequency of a part in semiconductor fabrication equipment to prevent a resonance. As a result, a vibration of the robot blade may be suppressed to prevent damage to a semiconductor substrate.

公开(公告)号：US20240112606A1

公开(公告)日：2024-04-04

申请号：US18372350

申请日：2023-09-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Deoksoo PARK ,  Seungwan Kim ,  Yongkwon Cho ,  Byoungju Song ,  Sanghoon Lee

IPC: G09G3/00 ,  G06T5/00 ,  G06T5/50

CPC classification number: G09G3/03 ,  G06T5/001 ,  G06T5/50 ,  G09G2320/02 ,  G09G2340/10

Abstract: An image processing device is provided. The image processing device includes: an image quality enhancement circuit configured to generate second image data indicating a plurality of pixel values corresponding to a quadrangular shape by performing image quality enhancement processing on first image data; a map decoder configured to read a map, which includes a plurality of pixel adjustment values for adjusting brightness of a first region of the second image data corresponding to a curved edge of a display panel, from a memory and provide alpha values indicated by the map; a processing circuit configured to generate third image data by adjusting the brightness of the first region by applying the alpha values to the second image data; and a transmission circuit configured to output the third image data to a display driving integrated circuit.

公开(公告)号：US11822693B2

公开(公告)日：2023-11-21

申请号：US17236027

申请日：2021-04-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunsik Ki ,  Sangchul Ku ,  Youngil Kim ,  Junhong Kim ,  Sanghoon Lee ,  Woong Lee ,  Junhyun Yim

IPC: G06F21/62 ,  H04W4/48 ,  G06V20/59

CPC classification number: G06F21/6245 ,  G06V20/593 ,  H04W4/48

Abstract: An electronic device is disclosed, including a sensor module configured to recognize boarding and alighting of a passenger from the vehicle, a network interface configured to communicate with a mobile device disposed in the vehicle, a memory, storing a program including one or more instructions, and a processor. The processor implements a method, including: detecting alighting of the passenger using the sensor module, or when a mobile device disconnects from the network interface, determining, by the processor, a deletion level for data related to personal information of a passenger, the deletion level based on a use history information of the passenger, including a latest use time and a use frequency, and deleting the data from the memory according to the determined deletion level.

公开(公告)号：US11636861B2

公开(公告)日：2023-04-25

申请号：US16476364

申请日：2017-10-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junhui Kim ,  Subhojit Chakladar ,  Tae-Jin Lee ,  Sanghoon Lee

IPC: G10L17/12 ,  G06F1/3209 ,  G06F1/3215

Abstract: Various embodiments of the disclosure provide a method and apparatus for processing a voice command in an electronic device. According to various embodiments of the disclosure, the electronic device includes a microphone, a memory, and a processor operatively coupled to the microphone and the memory. The processor may be configured to wake up on the basis of detection of a voice call command, calculate a score related to recognition of the voice call command, share the score with an external device, decide whether to execute a voice command on the basis of the score, and process the voice command on the basis of the decision result. Various embodiments are possible.

公开(公告)号：US11626381B2

公开(公告)日：2023-04-11

申请号：US16837025

申请日：2020-04-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggu Lee ,  Sunghyup Kim ,  Byungjo Kim ,  Sanghoon Lee ,  Sukwon Lee ,  Sebin Choi

IPC: H01L23/00 ,  B29C65/30 ,  B29C65/00

Abstract: A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

公开(公告)号：US11551944B2

公开(公告)日：2023-01-10

申请号：US17012624

申请日：2020-09-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungyong Yun ,  Sanghoon Lee ,  Sungil Lee

IPC: H01L21/67 ,  H01L23/00

Abstract: An apparatus for forming a solder bump on a substrate including a supporter configured to support the substrate to be provided thereon, a housing surrounding the supporter, a cover defining a manufacturing space in combination with the housing and including an edge heating zone along a perimeter thereof, the manufacturing space surrounding the supporter, and an oxide remover supply nozzle configured to supply an oxide remover to the manufacturing space may be provided.

公开(公告)号：US11460695B2

公开(公告)日：2022-10-04

申请号：US17091591

申请日：2020-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyehoon Lee ,  Jigwang Kim ,  Jiwon Kim ,  Jaemin Soh ,  Sanghoon Lee ,  Daesu Choi

IPC: G02B27/01 ,  G02F1/1335 ,  G02F1/017

Abstract: A display apparatus includes a light source array in which a plurality of light sources emitting light by a local dimming are arranged, a color conversion layer comprising color conversion particles that convert the emitted light into light of a certain color, and configured to emit white light by using the converted light, a display panel configured to generate an image by using the white light, and a selective transmission member arranged between the light source array and the color conversion layer. The selective transmission member is configured to transmit the light to the color conversion layer, and avoid transmitting the light in the color conversion layer to the light source array.

公开(公告)号：US11444529B2

公开(公告)日：2022-09-13

申请号：US17126290

申请日：2020-12-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Duhee Jang ,  Kangmoon Seo ,  Wonmyung Woo ,  Sanghoon Lee ,  Jungho Lee

IPC: H02M1/32 ,  H02M1/44 ,  H02M7/217

Abstract: A power supply capable of protecting a rectifier circuit using a switching element from an overvoltage or an overcurrent is provided. The power supply includes a power input terminal; an output capacitor; a synchronous rectifier configured to rectify an AC voltage input through the power input terminal; a converter configured to convert the rectified AC voltage into a DC voltage following a preset voltage and supply the DC voltage to the output capacitor; and a protection circuit provided between the power input terminal and the output capacitor, and configured to supply an AC voltage higher than the voltage charged in the output capacitor to the output capacitor by bypassing the synchronous rectifier.

公开(公告)号：US11304287B1

公开(公告)日：2022-04-12

申请号：US17325327

申请日：2021-05-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghyup Kim ,  Myeongjun Gil ,  Yebin Nam ,  Sanghoon Lee ,  Injae Lee

IPC: H05G2/00 ,  G03F7/20

Abstract: Extreme ultraviolet light source systems may include a chamber including a condensing mirror and having an intermediate focus, by which extreme ultraviolet light reflected from the condensing mirror is emitted along a first optical path, a blocking plate that may be on the chamber so as to intersect the first optical path and may include an opening through which the extreme ultraviolet light is emitted, a transparent cover on the blocking plate so as to cover the opening, a nozzle that may be between the chamber and the blocking plate so that an end portion faces the intermediate focus and may spray a first gas in a direction intersecting the first optical path, and an exhaust pipe between the chamber and the blocking plate so as to face the end portion of the nozzle.