公开(公告)号：US20220165502A1

公开(公告)日：2022-05-26

申请号：US17521305

申请日：2021-11-08

Applicant: TDK CORPORATION

Inventor： Toshihiro IGUCHI ,  Masahide ISHIZUYA ,  Takeshi SHIBAHARA

IPC: H01G4/30

Abstract: To provide a multilayer electronic component of which a reliability is not compromised and also a crack is suppressed from forming even when the multilayer electronic component is made thinner. A multilayer electronic component including an element body in which at least one dielectric layer and at least one internal electrode layer are stacked in an alternating manner, wherein a thickness variation of the at least one internal electrode layer is larger than a thickness variation of the at least one dielectric layer.

公开(公告)号：US20210375553A1

公开(公告)日：2021-12-02

申请号：US17228822

申请日：2021-04-13

Applicant: TDK CORPORATION

Inventor： Akihiro MASUDA ,  Shinya ITO ,  Norihisa ANDO ,  Kosuke YAZAWA ,  Yoshiki SATOU ,  Katsumi KOBAYASHI ,  Toshihiro IGUCHI ,  Kenya TAMAKI ,  Shinya SAITO

IPC: H01G4/40 ,  H01G4/228 ,  H01G4/224 ,  H01G4/38 ,  H01F27/28

Abstract: An electronic device includes first and second capacitors, a case, a coil, and first to fourth conductive terminals. The first capacitor includes first and second terminal electrodes. The second capacitor includes third and fourth terminal electrodes. The case includes an accommodation recess for accommodating the first and second capacitors. The coil is separated from the first and second capacitors by a part of the case and disposed outside the accommodation recess. The first terminal is connected to the first electrode and partly disposed on a mounting-side bottom surface of the case. The second terminal is connected to one end of the coil and the second electrode and partly disposed on the surface. The third terminal is connected to the other end of the coil and the third electrode and partly disposed on the surface. The fourth terminal is connected to the fourth electrode and partly disposed on the surface.

公开(公告)号：US20200090869A1

公开(公告)日：2020-03-19

申请号：US16558542

申请日：2019-09-03

Applicant: TDK CORPORATION

Inventor： Toshihiro IGUCHI

IPC: H01G4/12 ,  H01B3/12 ,  C04B35/495 ,  C04B35/626 ,  C04B35/634 ,  C04B35/64

Abstract: A dielectric composition comprising a complex oxide represented by a general formula of AaBbC4O15+α and an oxide including aluminum, in which “A” at least includes Ba, “B” at least includes Zr, and “C” at least includes Nb, “a” is 2.50 or more and 3.50 or less, and “b” is 0.50 or more, and 1.50 or less.

公开(公告)号：US20190304694A1

公开(公告)日：2019-10-03

申请号：US16281773

申请日：2019-02-21

Applicant: TDK CORPORATION

Inventor： Toshihiro IGUCHI

IPC: H01G4/255 ,  H01G4/12 ,  H01G4/012

Abstract: A multilayer ceramic electronic component includes an element body in which dielectric layers and internal electrode layers having different polarities are laminated alternately. The dielectric layers contain a main component of a perovskite-type compound represented by (Ba1-a-bSraCab)m(Ti1-c-dZrcHfd)O3. 0.94

公开(公告)号：US20190304693A1

公开(公告)日：2019-10-03

申请号：US16281391

申请日：2019-02-21

Applicant: TDK CORPORATION

Inventor： Toshihiro IGUCHI

IPC: H01G4/255 ,  H01G4/008 ,  H01G4/30 ,  H01G4/012 ,  H01G4/12

Abstract: A multilayer ceramic electronic component includes an element body. The element body includes a capacitance region and an exterior region. The capacitance region is formed by alternately laminating inner dielectric layers and internal electrode layers having different polarities. The exterior region is laminated outside the capacitance region in a laminating direction and formed by outer dielectric layers. The internal electrode layers contain a main component of copper and/or silver. An exterior void ratio is larger than a capacitance void ratio, in which the exterior void ratio is an area ratio of voids contained in the exterior region, and the capacitance void ratio is an area ratio of voids contained in the capacitance region.