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20 条记录 (耗时 0.02 秒)

    ELECTRONIC DEVICE
    2.
    发明申请
    ELECTRONIC DEVICE 有权

    公开(公告)号：US20230010668A1

    公开(公告)日：2023-01-12

    申请号：US17847717

    申请日：2022-06-23

    申请人： TDK CORPORATION

    发明人： Akihiro MASUDA ,  Shinya ITO ,  Norihisa ANDO ,  Kosuke YAZAWA ,  Yoshiki SATOU ,  Katsumi KOBAYASHI

    IPC分类号： H01G4/224

    摘要： An electronic device 10 comprises chip capacitors 20a and 20b, an accommodation recess 62 accommodating the chip capacitors 20a and 20b, and a case 60 including a protrusion 64 partitioning the accommodation recess 62 into a first accommodation space 62a and a second accommodation space 62b along the X-axis direction. The protrusion 64 includes a first protrusion 64a and a second protrusion 64b disposed away from the first protrusion 64a along the Y-axis direction. The first protrusion 64a and the second protrusion 64b are disposed with a communication space 69 provided between the first protrusion 64a and the second protrusion 64b, so that the first accommodation space 62a and the second accommodation space 62b communicate.

    ELECTRONIC DEVICE
    3.
    发明申请
    ELECTRONIC DEVICE 有权

    公开(公告)号：US20220157533A1

    公开(公告)日：2022-05-19

    申请号：US17494538

    申请日：2021-10-05

    申请人： TDK CORPORATION

    发明人： Akihiro MASUDA ,  Shinya ITO ,  Norihisa ANDO ,  Tomoyuki SASAKI ,  Shinya ONODERA

    IPC分类号： H01G4/38 ,  H01G4/224

    摘要： An electronic device includes a plurality of chip components and an insulating case. The chip components are arranged in a first direction. The case includes a plate portion, a first protrusion portion, and a second protrusion portion. The plate portion faces first side surfaces of the chip components. The first protrusion portion is formed along a plate-portion first side of the plate portion and protrudes from the plate portion toward a downside perpendicular to the first direction. The second protrusion portion is formed to the first protrusion portion in a second direction and protrudes from the plate portion toward the downside. A protrusion length of the first protrusion portion and the second protrusion portion from the plate portion toward the downside is smaller than a protrusion length of the chip component included in the chip components from the plate portion toward the downside.

    ELECTRONIC DEVICE
    5.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20230411077A1

    公开(公告)日：2023-12-21

    申请号：US18331294

    申请日：2023-06-08

    申请人： TDK CORPORATION

    发明人： Akihiro MASUDA ,  Shinya ITO ,  Norihisa ANDO ,  Hideki KANEKO ,  Ken ABURAKAWA ,  Kenya TAMAKI ,  Akitoshi YOSHII

    IPC分类号： H01G4/228 ,  H01G4/224 ,  H01G4/30 ,  H01G4/232

    CPC分类号： H01G4/228 ,  H01G4/224 ,  H01G4/30 ,  H01G4/232

    摘要： The electronic device includes: a case including a recessed portion and an opening edge portion of the recessed portion; a ceramic element arranged in the recessed portion, having a first main surface and a second main surface facing each other, and including a first electrode portion formed on the first main surface and a second electrode portion formed on the second main surface; a first metal terminal including a first mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a first electrode connection portion connected to the first electrode portion; and a second metal terminal including a second mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a second electrode connection portion connected to the second electrode portion.

    CERAMIC ELECTRONIC DEVICE
    7.
    发明申请
    CERAMIC ELECTRONIC DEVICE 有权

    公开(公告)号：US20210125781A1

    公开(公告)日：2021-04-29

    申请号：US17062736

    申请日：2020-10-05

    申请人： TDK CORPORATION

    发明人： Akihiro MASUDA ,  Norihisa ANDO ,  Shinya ITO

    IPC分类号： H01G4/248 ,  H01G4/232

    摘要： A ceramic electronic device includes a ceramic element body, a terminal electrode, and a lead terminal. The ceramic element body has an end surface and a lateral surface. The terminal electrode is formed on from the end surface to a part of the lateral surface of the ceramic element body. The lead terminal is connected to the terminal electrode by a connection member. The lead terminal includes an electrode facing portion disposed correspondingly to an end-surface electrode of the terminal electrode, an extension unit extending downward from a lower end of the electrode facing portion, and a step surface located between the electrode facing portion and the extension unit. The electrode facing portion has a recess dented in a direction away from the terminal electrode. A center of the recess is located below a center of the electrode facing portion in a height direction.

    CONDUCTIVE TERMINAL AND ELECTRONIC DEVICE
    8.
    发明申请
    CONDUCTIVE TERMINAL AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20210043382A1

    公开(公告)日：2021-02-11

    申请号：US16988819

    申请日：2020-08-10

    申请人： TDK CORPORATION

    发明人： Akihiro MASUDA ,  Norihisa ANDO ,  Shinya ITO ,  Kosuke YAZAWA ,  Yoshiki SATOU ,  Katsumi KOBAYASHI

    IPC分类号： H01G4/228 ,  H01G4/224

    摘要： A conductive terminal includes an inner electrode part, an opening edge electrode part, and a lateral electrode part. The inner electrode part is connectable to a terminal electrode of a chip component by being inserted along an inner wall of an accommodation recess of a case. The opening edge electrode part is formed continuously to the inner electrode part. The lateral electrode part is formed continuously to the opening edge electrode part along an outer surface of the case. The inner electrode part includes a base part, a curved part, and a continuous boundary part. The base part continues to the opening edge electrode part. The curved part is formed near a tip of the base part and protrudes away from the lateral electrode part. The continuous boundary part is formed between the base part and the curved part and continuously connects them.

    ELECTRONIC DEVICE
    9.
    发明申请
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20200098521A1

    公开(公告)日：2020-03-26

    申请号：US16556735

    申请日：2019-08-30

    申请人： TDK CORPORATION

    发明人： Shinya ITO ,  Norihisa ANDO ,  Yoshiki SATOU ,  Kosuke YAZAWA

    IPC分类号： H01G4/224 ,  H01G4/248 ,  H01G4/38

    摘要： An electronic device includes at least two chip components, a hold member with insulation, a first conductive terminal piece, a second conductive terminal piece, and an intermediate connection piece. The hold member holds the chip components side by side. The intermediate connection piece connects the terminal electrode of one of the chip components and the terminal electrode of the other chip component.

    ELECTRONIC DEVICE
    10.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20230420188A1

    公开(公告)日：2023-12-28

    申请号：US18331358

    申请日：2023-06-08

    申请人： TDK CORPORATION

    发明人： Akihiro MASUDA ,  Takaaki SATO ,  Norihisa ANDO ,  Shinya ITO ,  Kosuke YAZAWA

    IPC分类号： H01G4/224 ,  H01G4/236 ,  H01G4/38

    CPC分类号： H01G4/224 ,  H01G4/236 ,  H01G4/38

    摘要： An electronic device comprises a chip component including a terminal electrode, a case having an accommodation recess accommodating the chip component, a conductive terminal attached to the case and connected to the terminal electrode, and a case cover disposed on an opening-edge surface of the case so as to cover the accommodation recess. The opening-edge surface has an opening-edge recess at least partly covered by the case cover. The opening-edge recess and the case cover have a space therebetween. The space is filled with a resin.